JPS56148837A - Electron device - Google Patents

Electron device

Info

Publication number
JPS56148837A
JPS56148837A JP5319480A JP5319480A JPS56148837A JP S56148837 A JPS56148837 A JP S56148837A JP 5319480 A JP5319480 A JP 5319480A JP 5319480 A JP5319480 A JP 5319480A JP S56148837 A JPS56148837 A JP S56148837A
Authority
JP
Japan
Prior art keywords
bonded
base plate
wire
bonding
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5319480A
Other languages
Japanese (ja)
Inventor
Yoshiharu Hayashi
Minoru Karasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Matsushima Kogyo KK
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Matsushima Kogyo KK
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushima Kogyo KK, Seiko Epson Corp, Suwa Seikosha KK filed Critical Matsushima Kogyo KK
Priority to JP5319480A priority Critical patent/JPS56148837A/en
Publication of JPS56148837A publication Critical patent/JPS56148837A/en
Pending legal-status Critical Current

Links

Classifications

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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve reliability by conducting first bonding to one element pad and second bonding to the other element pad in wire bonding between a functional element and a semiconductor element driving said element. CONSTITUTION:A gold ball 14 formed to a gold small wire 13 is first bonded to an aluminum pad 3 of a liquid-crystal television indicator 2 glued to a ceramic base plate 11 with adhesives 12, and the gold small wire 13 is second bonded to an aluminum projecting electrode 16 of a semiconductor element 17 glued to the ceramic base plate 11 with adhesives 15. A section between a wiring pattern 18 on the base plate 11 and the projecting electrode 16 of the semiconductor element 17 is wire-bonded through a power source and input signals. Thus, since the number of connection can be reduced by half, the formation of the exfoliation of connected sections is reduced by half, cost is brought down and reliability can be improved.
JP5319480A 1980-04-22 1980-04-22 Electron device Pending JPS56148837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5319480A JPS56148837A (en) 1980-04-22 1980-04-22 Electron device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5319480A JPS56148837A (en) 1980-04-22 1980-04-22 Electron device

Publications (1)

Publication Number Publication Date
JPS56148837A true JPS56148837A (en) 1981-11-18

Family

ID=12936055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5319480A Pending JPS56148837A (en) 1980-04-22 1980-04-22 Electron device

Country Status (1)

Country Link
JP (1) JPS56148837A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614113A (en) * 1995-05-05 1997-03-25 Texas Instruments Incorporated Method and apparatus for performing microelectronic bonding using a laser

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614113A (en) * 1995-05-05 1997-03-25 Texas Instruments Incorporated Method and apparatus for performing microelectronic bonding using a laser

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