JP2007512680A5 - - Google Patents
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- Publication number
- JP2007512680A5 JP2007512680A5 JP2006523830A JP2006523830A JP2007512680A5 JP 2007512680 A5 JP2007512680 A5 JP 2007512680A5 JP 2006523830 A JP2006523830 A JP 2006523830A JP 2006523830 A JP2006523830 A JP 2006523830A JP 2007512680 A5 JP2007512680 A5 JP 2007512680A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor layer
- depositing
- pattern
- aperture mask
- gate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 7
- 238000000151 deposition Methods 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 3
- 239000010409 thin film Substances 0.000 claims 3
- 239000007772 electrode material Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 239000003566 sealing material Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
Claims (3)
- (a)ゲート電極と、ゲート誘電体と、ソースおよびドレイン電極と、半導体層とを含む薄膜トランジスタを提供する工程と、
(b)封止材料をアパーチャマスクのパターンを通して前記半導体層の少なくとも一部の上に蒸着する工程と、
を含む、薄膜トランジスタの封止方法。 - 薄膜トランジスタの製造方法であって、
(a)基板を提供する工程と、
(b)ゲート電極材料をアパーチャマスクのパターンを通して前記基板の上に堆積する工程と、
(c)ゲート誘電体をアパーチャマスクのパターンを通して前記ゲート電極材料の上に堆積する工程と、
(d)半導体層をアパーチャマスクのパターンを通して前記ゲート誘電体に隣接して堆積する工程と、
(e)ソース電極およびドレイン電極をアパーチャマスクのパターンを通して前記半導体層に接触して堆積する工程と、
(f)封止材料をアパーチャマスクのパターンを通して前記半導体層の少なくとも一部の上に蒸着する工程と、
を含む方法。 - 基板と、ゲート電極と、ゲート誘電体と、ソースおよびドレイン電極と、半導体層と、前記半導体層の少なくとも一部の上の蒸着された封止層とを含むトランジスタ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/642,919 US20070178710A1 (en) | 2003-08-18 | 2003-08-18 | Method for sealing thin film transistors |
PCT/US2004/018681 WO2005020343A1 (en) | 2003-08-18 | 2004-06-10 | Method for sealing thin film transistors |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007512680A JP2007512680A (ja) | 2007-05-17 |
JP2007512680A5 true JP2007512680A5 (ja) | 2007-07-26 |
Family
ID=34216368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006523830A Pending JP2007512680A (ja) | 2003-08-18 | 2004-06-10 | 薄膜トランジスタの封止方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070178710A1 (ja) |
EP (1) | EP1656695A1 (ja) |
JP (1) | JP2007512680A (ja) |
KR (1) | KR20060079195A (ja) |
CN (1) | CN1839491A (ja) |
WO (1) | WO2005020343A1 (ja) |
Families Citing this family (25)
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DE102004052266A1 (de) * | 2004-10-27 | 2006-06-01 | Infineon Technologies Ag | Integrierte Analogschaltung in Schaltkondesatortechnik sowie Verfahren zu deren Herstellung |
US7282735B2 (en) * | 2005-03-31 | 2007-10-16 | Xerox Corporation | TFT having a fluorocarbon-containing layer |
US20090142227A1 (en) * | 2005-07-01 | 2009-06-04 | Manfred Fuchs | Parylene Coating and Method for the Production Thereof |
JP5188046B2 (ja) * | 2005-09-06 | 2013-04-24 | キヤノン株式会社 | 半導体素子 |
KR101172666B1 (ko) * | 2005-09-29 | 2012-08-08 | 엘지디스플레이 주식회사 | 액정표시소자 및 그 제조방법 |
KR100708720B1 (ko) * | 2005-10-19 | 2007-04-17 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터, 이의 제조 방법 및 이를 구비한평판 표시 장치 |
KR101219046B1 (ko) | 2005-11-17 | 2013-01-08 | 삼성디스플레이 주식회사 | 표시장치와 이의 제조방법 |
US8097877B2 (en) | 2005-12-20 | 2012-01-17 | Northwestern University | Inorganic-organic hybrid thin-film transistors using inorganic semiconducting films |
US7651896B2 (en) * | 2006-08-30 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
JP5216276B2 (ja) * | 2006-08-30 | 2013-06-19 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
TWI323039B (en) * | 2006-10-24 | 2010-04-01 | Micro-casting lithography and method for fabrication of organic thin film transistor | |
JP5151122B2 (ja) * | 2006-11-22 | 2013-02-27 | ソニー株式会社 | 電極被覆材料、電極構造体、及び、半導体装置 |
US7767589B2 (en) | 2007-02-07 | 2010-08-03 | Raytheon Company | Passivation layer for a circuit device and method of manufacture |
US8173906B2 (en) * | 2007-02-07 | 2012-05-08 | Raytheon Company | Environmental protection coating system and method |
JP5286826B2 (ja) * | 2007-03-28 | 2013-09-11 | 凸版印刷株式会社 | 薄膜トランジスタアレイ、薄膜トランジスタアレイの製造方法、およびアクティブマトリスクディスプレイ |
WO2010137664A1 (ja) * | 2009-05-28 | 2010-12-02 | 帝人株式会社 | アルキルシラン積層体及びその製造方法、並びに薄膜トランジスタ |
WO2011034012A1 (en) * | 2009-09-16 | 2011-03-24 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit, light emitting device, semiconductor device, and electronic device |
KR101595470B1 (ko) * | 2009-12-01 | 2016-02-18 | 엘지디스플레이 주식회사 | 유기발광 표시장치의 제조방법 |
JP6061858B2 (ja) * | 2010-10-07 | 2017-01-18 | ジョージア・テック・リサーチ・コーポレーション | 電界効果トランジスタおよびその製造方法 |
US8875067B2 (en) * | 2013-03-15 | 2014-10-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reusable cut mask for multiple layers |
KR102636749B1 (ko) * | 2016-11-28 | 2024-02-14 | 엘지디스플레이 주식회사 | 유기발광소자를 이용한 조명장치 및 그 제조방법 |
CN106847741B (zh) * | 2016-12-30 | 2019-11-22 | 深圳市华星光电技术有限公司 | 一种薄膜晶体管阵列基板制造方法、真空气相蒸发台及其控制方法 |
KR102271091B1 (ko) * | 2020-03-04 | 2021-06-29 | 성균관대학교산학협력단 | 비휘발성 메모리 소자 및 이의 제조 방법 |
CN113241422A (zh) * | 2021-06-17 | 2021-08-10 | 京东方科技集团股份有限公司 | 显示基板和显示装置 |
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-
2003
- 2003-08-18 US US10/642,919 patent/US20070178710A1/en not_active Abandoned
-
2004
- 2004-06-10 EP EP04755057A patent/EP1656695A1/en not_active Withdrawn
- 2004-06-10 CN CNA2004800238620A patent/CN1839491A/zh active Pending
- 2004-06-10 WO PCT/US2004/018681 patent/WO2005020343A1/en active Application Filing
- 2004-06-10 JP JP2006523830A patent/JP2007512680A/ja active Pending
- 2004-06-10 KR KR1020067003277A patent/KR20060079195A/ko not_active Application Discontinuation
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