JP2007509503A - 半導体構造および半導体構造を製造する方法 - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 75
- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims abstract description 36
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims description 72
- 239000000758 substrate Substances 0.000 claims description 31
- 238000002955 isolation Methods 0.000 claims description 10
- 230000005669 field effect Effects 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000001020 plasma etching Methods 0.000 description 10
- 150000004767 nitrides Chemical class 0.000 description 9
- 230000008021 deposition Effects 0.000 description 8
- 238000001459 lithography Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000002513 implantation Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 238000005280 amorphization Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000010561 standard procedure Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
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Abstract
【解決手段】 この半導体デバイスは、pFETおよびnFET用のチャネルを含む。nFETチャネルのチャネル内にはSiGe層を成長させ、pFETチャネル内には炭化シリコン層を成長させる。SiGe層および炭化シリコン層は、上に重なって成長させたエピタキシャル層内に応力成分を発生させるために、下にあるSi層の格子回路網と整合する。一実現例では、これにより、pFETチャネル内に圧縮成分が発生し、nFETチャネル内に引張成分が発生する。他の一実現例では、nFETチャネルとpFETチャネルの両方にSiGe層を成長させる。この実現例では、pFETチャネル内の応力レベルは約3GPaを上回るものでなければならない。
【選択図】 図6
Description
オオツカ他によるIEDM 2000の575ページ
Claims (26)
- 半導体構造を製造する方法であって、
基板内にp型電界効果トランジスタ(pFET)チャネルおよびn型電界効果トランジスタ(nFET)チャネルを形成するステップと、
前記基板の格子定数とは異なる格子定数を有する第1の材料層を前記pFETチャネル内に設けるステップと、
前記基板の前記格子定数とは異なる格子定数を有する第2の材料層を前記nFETチャネル内に設けるステップと、
前記pFETチャネル内の前記第1の材料層および前記nFETチャネル内の前記第2の材料層の上にエピタキシャル半導体層を形成するステップであって、前記pFETチャネルおよび前記nFETチャネル内に応力成分が発生するように、前記エピタキシャル半導体層が実質的に前記基板と同じ格子定数を有するステップと、
を有する、方法。 - 前記pFETチャネルと前記nFETチャネルが同時に形成される、請求項1に記載の方法。
- 前記pFETチャネルと前記nFETチャネルが別々に形成される、請求項1に記載の方法。
- 前記第1の材料層が、Siに対する比が約25%を上回る含有量のGeを有するSiGeである、請求項1に記載の方法。
- 前記第1の材料層が、3GPaを上回る引張応力を前記エピタキシャル半導体層内に発生させる、請求項4に記載の方法。
- 前記第2の材料層がSiGeである、請求項1に記載の方法。
- 前記第2の材料層が、前記nFETチャネル内の前記エピタキシャル半導体層内に引張応力を発生させる、請求項6に記載の方法。
- 前記第1の材料層が炭化シリコンである、請求項1に記載の方法。
- 前記エピタキシャル半導体層の上にゲート酸化物構造を形成するステップと、
前記ゲート酸化物構造の両側の前記基板内に延長部ならびにドレイン領域およびソース領域を形成するステップと、
をさらに有する、請求項1に記載の方法。 - 前記nFETおよびpFETチャネルを形成する前記ステップが、約200Å〜400Åの深さまで前記Si層をエッチングすることを含む、請求項1に記載の方法。
- 前記nFETチャネルの上にハード・マスクを配置し、前記pFETチャネル内に前記第1の材料層を成長させることにより、前記第1の材料層が形成され、
前記pFETチャネルの上にハード・マスクを配置し、前記nFETチャネル内に前記第2の材料層を成長させることにより、前記第2の材料層が形成される、請求項1に記載の方法。 - 前記基板内に浅いトレンチ構造を形成するステップをさらに有する、請求項1に記載の方法。
- 前記第1の材料層および前記第2の材料層を約100Å〜300Åの高さまで成長させる、請求項1に記載の方法。
- 前記基板層がシリコン・オン・インシュレータである、請求項1に記載の方法。
- 前記第1の材料層および前記第2の材料層がいずれも、前記pFETについて適用するために約25%〜30%より大きいGe率を有するSiGe材料である、請求項1に記載の方法。
- 半導体構造を製造する方法であって、
基板内にp型電界効果トランジスタ(pFET)チャネルおよびn型電界効果トランジスタ(nFET)チャネルを形成するステップと、
前記基板の格子定数とは異なる格子定数を有する第1の材料層を前記pFETチャネル内に設けるステップと、
前記基板の前記格子定数とは異なる格子定数を有する第2の材料層を前記nFETチャネル内に設けるステップと、
前記pFETチャネル内の前記第1の材料層および前記nFETチャネル内の前記第2の材料層の上にエピタキシャル半導体層を形成するステップであって、前記エピタキシャル半導体層が実質的に前記基板と同じ格子定数を有し、したがって、前記pFETチャネル内の前記第1の材料層および前記nFETチャネル内の前記第2の材料層の応力成分とは反対の応力成分を発生させるステップと、
を有する、方法。 - 前記pFETチャネルと前記nFETチャネルが同時に形成される、請求項16に記載の方法。
- 前記pFETチャネルと前記nFETチャネルが別々に形成される、請求項16に記載の方法。
- 前記第1の材料層が炭化シリコンであり、前記第2の材料層がSiGeである、請求項16に記載の方法。
- 前記第1の材料層が、前記pFETチャネル内の前記エピタキシャル半導体層内に圧縮応力を発生させ、
前記第2の材料層が、前記nFETチャネル内の前記エピタキシャル半導体層内に引張応力を発生させる、請求項19に記載の方法。 - 前記エピタキシャル半導体層の上にゲート酸化物構造を形成するステップと、
前記ゲート酸化物構造の両側の前記Si層内に延長部ならびにドレイン領域およびソース領域を形成するステップと、
をさらに有する、請求項16に記載の方法。 - 前記nFETチャネルの上にハード・マスクを配置し、前記pFETチャネル内に前記第1の材料層を成長させることにより、前記第1の材料層が形成され、
前記pFETチャネルの上にハード・マスクを配置し、前記nFETチャネル内に前記第2の材料層を成長させることにより、前記第2の材料層が形成される、請求項16に記載の方法。 - 基板内に形成されたp型電界効果トランジスタ(pFET)チャネルと、
前記基板内に形成されたn型電界効果トランジスタ(nFET)チャネルと、
前記基板内に形成された浅いトレンチ分離構造と、
前記基板の格子定数とは異なる格子定数を有する前記pFETチャネル内の第1の材料層と、
前記基板の前記格子定数とは異なる格子定数を有する前記nFETチャネル内の第2の材料層と、
前記pFETチャネル内の前記第1の材料層および前記nFETチャネル内の前記第2の材料層の上に形成されたエピタキシャル半導体層であって、実質的に前記基板と同じ格子定数を有し、したがって、前記pFETチャネルおよび前記nFETチャネル内に所望の応力成分を発生させるエピタキシャル半導体層と、
を有する、半導体構造。 - 前記第1の材料層が炭化シリコンであり、前記第2の材料層がSiGeである、請求項23に記載の構造。
- 前記第1の材料層および前記第2の材料層が、前記pFETチャネル内に約3GPaを上回る応力レベルを発生させるSiGeである、請求項23に記載の構造。
- 前記第1の材料層が、前記pFETチャネル内の前記エピタキシャル半導体層内に圧縮応力を発生させ、
前記第2の材料層が、前記nFETチャネル内の前記エピタキシャル半導体層内に引張応力を発生させる、請求項23に記載の構造。
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PCT/US2004/034528 WO2005043590A2 (en) | 2003-10-20 | 2004-10-19 | Strained dislocation-free channels for cmos and method of manufacture |
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JPWO2006030505A1 (ja) * | 2004-09-16 | 2008-05-08 | 富士通株式会社 | Mos型電界効果トランジスタ及びその製造方法 |
WO2011004474A1 (ja) * | 2009-07-08 | 2011-01-13 | 株式会社 東芝 | 半導体装置及びその製造方法 |
JP2011108692A (ja) * | 2009-11-12 | 2011-06-02 | Ulvac Japan Ltd | Cmosデバイス用シリコンウェハの製造方法 |
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JP5355692B2 (ja) * | 2009-07-08 | 2013-11-27 | 株式会社東芝 | 半導体装置及びその製造方法 |
KR101354844B1 (ko) | 2009-07-08 | 2014-01-22 | 가부시끼가이샤 도시바 | 반도체 장치 및 그의 제조 방법 |
US8653560B2 (en) | 2009-07-08 | 2014-02-18 | Kabushiki Kaisha Toshiba | Semiconductor device and fabrication method thereof |
JP2011108692A (ja) * | 2009-11-12 | 2011-06-02 | Ulvac Japan Ltd | Cmosデバイス用シリコンウェハの製造方法 |
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US7495291B2 (en) | 2009-02-24 |
WO2005043590A2 (en) | 2005-05-12 |
US7037770B2 (en) | 2006-05-02 |
CN101095211A (zh) | 2007-12-26 |
TW200525765A (en) | 2005-08-01 |
EP1676296A2 (en) | 2006-07-05 |
TWI327779B (en) | 2010-07-21 |
EP1676296B1 (en) | 2014-12-10 |
CN101095211B (zh) | 2010-08-11 |
US20050139930A1 (en) | 2005-06-30 |
EP1676296A4 (en) | 2008-08-20 |
WO2005043590A3 (en) | 2006-09-21 |
JP5046153B2 (ja) | 2012-10-10 |
US20050085022A1 (en) | 2005-04-21 |
KR20060089736A (ko) | 2006-08-09 |
KR100910902B1 (ko) | 2009-08-05 |
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