JP2007502333A5 - - Google Patents

Download PDF

Info

Publication number
JP2007502333A5
JP2007502333A5 JP2006522551A JP2006522551A JP2007502333A5 JP 2007502333 A5 JP2007502333 A5 JP 2007502333A5 JP 2006522551 A JP2006522551 A JP 2006522551A JP 2006522551 A JP2006522551 A JP 2006522551A JP 2007502333 A5 JP2007502333 A5 JP 2007502333A5
Authority
JP
Japan
Prior art keywords
group
groups
formula
substrate
silicone composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006522551A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007502333A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2004/019609 external-priority patent/WO2005017058A1/en
Publication of JP2007502333A publication Critical patent/JP2007502333A/ja
Publication of JP2007502333A5 publication Critical patent/JP2007502333A5/ja
Pending legal-status Critical Current

Links

JP2006522551A 2003-08-01 2004-06-18 光起電アプリケーション用のシリコーンベース誘電被膜及びフィルム Pending JP2007502333A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49188303P 2003-08-01 2003-08-01
PCT/US2004/019609 WO2005017058A1 (en) 2003-08-01 2004-06-18 Silicone based dielectric coatings and films for photovoltaic applications

Publications (2)

Publication Number Publication Date
JP2007502333A JP2007502333A (ja) 2007-02-08
JP2007502333A5 true JP2007502333A5 (enExample) 2008-11-13

Family

ID=34193100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006522551A Pending JP2007502333A (ja) 2003-08-01 2004-06-18 光起電アプリケーション用のシリコーンベース誘電被膜及びフィルム

Country Status (7)

Country Link
US (1) US20070111014A1 (enExample)
EP (1) EP1654334A1 (enExample)
JP (1) JP2007502333A (enExample)
KR (1) KR20060066080A (enExample)
CN (1) CN100582188C (enExample)
CA (1) CA2543366A1 (enExample)
WO (1) WO2005017058A1 (enExample)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100273011A1 (en) * 1996-12-20 2010-10-28 Bianxiao Zhong Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates
JP5219332B2 (ja) * 2005-09-20 2013-06-26 新日鉄住金マテリアルズ株式会社 被覆ステンレス箔及び薄膜太陽電池
US20070099005A1 (en) * 2005-10-31 2007-05-03 Honeywell International Inc. Thick crack-free silica film by colloidal silica incorporation
US8304085B2 (en) * 2006-04-18 2012-11-06 Dow Corning Corporation Metal foil substrates coated with condensation cured silicone resin compositions
EP2333841A3 (en) * 2006-04-18 2013-06-05 Dow Corning Corporation Cadmium telluride-based photovoltaic device and method of preparing the same
ES2335551T3 (es) * 2006-04-18 2010-03-29 Dow Corning Corporation Dispositivo fotovoltaico basado en diseleniuro de indio cobre y procedimiento de preparacion del mismo.
US20090084427A1 (en) * 2006-04-18 2009-04-02 Anderson Nicole R Copper Indium Diselenide-Based Photovoltaic Device And Method Of Preparing the Same
WO2008088570A1 (en) 2006-04-18 2008-07-24 Itn Energy Systems, Inc. Reinforcing structures for thin-film photovoltaic device substrates, and associated methods
WO2007136351A1 (en) * 2006-05-22 2007-11-29 Nanyang Technological University Solution-processed inorganic films for organic thin film transistors
JP2009545872A (ja) * 2006-06-05 2009-12-24 ダウ コーニング コーポレイシヨン シリコーン樹脂層を含む太陽電池
US20080012074A1 (en) * 2006-07-14 2008-01-17 Air Products And Chemicals, Inc. Low Temperature Sol-Gel Silicates As Dielectrics or Planarization Layers For Thin Film Transistors
WO2008036769A2 (en) 2006-09-19 2008-03-27 Itn Energy Systems, Inc. Semi-transparent dual layer back contact for bifacial and tandem junction thin-film photovolataic devices
CN101600664B (zh) 2006-12-20 2013-02-06 陶氏康宁公司 用多层固化的有机硅树脂组合物涂覆或层合的玻璃基材
WO2008079179A1 (en) 2006-12-20 2008-07-03 Dow Corning Corporation Glass substrates coated or laminated with cured silicone resin compositions
US20110027584A1 (en) * 2008-03-04 2011-02-03 Bianxiao Zhong Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates
JP2011518893A (ja) * 2008-03-04 2011-06-30 ダウ・コーニング・コーポレイション ボロシロキサン組成物、ボロシロキサン接着剤、塗装基板及び積層基板
CN102046371B (zh) * 2008-05-27 2013-11-06 陶氏康宁公司 粘合带和层压玻璃
TW201004795A (en) * 2008-07-31 2010-02-01 Dow Corning Laminated glass
CN102119077A (zh) * 2008-08-13 2011-07-06 富士通株式会社 薄膜贴附装置、薄膜贴附方法及电子纸的制造方法
US20100059385A1 (en) * 2008-09-06 2010-03-11 Delin Li Methods for fabricating thin film solar cells
JP5471180B2 (ja) * 2008-09-11 2014-04-16 信越化学工業株式会社 シリコーン積層基板、その製造方法、シリコーン積層基板製造用シリコーン樹脂組成物及びled装置
KR101138798B1 (ko) * 2008-12-29 2012-04-24 제일모직주식회사 신뢰성이 향상된 이방 전도성 필름용 조성물 및 이를 이용한 이방전도성 필름
US8557437B2 (en) * 2009-03-25 2013-10-15 Tdk Corporation Electrode comprising protective layer for lithium ion secondary battery and lithium ion secondary battery
US8613671B2 (en) * 2009-06-08 2013-12-24 Cfph, Llc Data transfer and control among multiple computer devices in a gaming environment
US8419535B2 (en) * 2009-06-08 2013-04-16 Cfph, Llc Mobile playing card devices
US8545328B2 (en) * 2009-06-08 2013-10-01 Cfph, Llc Portable electronic charge device for card devices
US8784189B2 (en) * 2009-06-08 2014-07-22 Cfph, Llc Interprocess communication regarding movement of game devices
US8287386B2 (en) * 2009-06-08 2012-10-16 Cfph, Llc Electrical transmission among interconnected gaming systems
US8771078B2 (en) 2009-06-08 2014-07-08 Cfph, Llc Amusement device including means for processing electronic data in play of a game of chance
US8545327B2 (en) * 2009-06-08 2013-10-01 Cfph, Llc Amusement device including means for processing electronic data in play of a game in which an outcome is dependant upon card values
US8557877B2 (en) 2009-06-10 2013-10-15 Honeywell International Inc. Anti-reflective coatings for optically transparent substrates
DE102009042447A1 (de) * 2009-09-23 2011-04-07 Sasol Germany Gmbh Zusammensetzungen enthaltend Dialkylether, daraus hergestellte Beschichtungen und Verwendung von Dialkylethern
EP2328183A1 (de) * 2009-11-26 2011-06-01 Engineered Products Switzerland AG Substrat mit einer Metallfolie zur Herstellung von Photovoltaik-Zellen
EP2530731B1 (en) * 2010-01-25 2016-03-30 LG Chem, Ltd. Sheet for photovoltaic cells
KR20140000270A (ko) 2010-11-09 2014-01-02 다우 코닝 코포레이션 유기인 화합물에 의해 가소화된 하이드로실릴화 경화된 실리콘 수지
US8864898B2 (en) 2011-05-31 2014-10-21 Honeywell International Inc. Coating formulations for optical elements
US20150209654A1 (en) 2013-11-12 2015-07-30 Deq Systems Corp. Reconfigurable playing cards and game display devices
US10544329B2 (en) 2015-04-13 2020-01-28 Honeywell International Inc. Polysiloxane formulations and coatings for optoelectronic applications
CN107690709B (zh) * 2015-05-27 2019-09-24 京瓷株式会社 太阳能电池元件及其制造方法
JP2017120873A (ja) 2015-12-25 2017-07-06 京セラ株式会社 絶縁性ペーストおよびその製造方法並びに太陽電池素子の製造方法
CN107501942B (zh) * 2017-08-29 2020-10-02 北京康美特科技股份有限公司 可模塑成型的有机硅树脂、组合物及其半导体发光元件
CN109651614A (zh) * 2017-10-12 2019-04-19 弗洛里光电材料(苏州)有限公司 八硅倍半氧烷纳米杂化分子化合物及其应用
JP7048367B2 (ja) * 2018-03-15 2022-04-05 日鉄ケミカル&マテリアル株式会社 平坦化膜形成用塗布液およびその製造方法、平坦化膜付き金属箔コイルおよびその製造方法、並びにそれらに用いるシリカ微粒子含有ケトン系溶剤
US11851572B2 (en) 2019-03-07 2023-12-26 Liquid X Printed Metals, Inc. Thermal cure dielectric ink
EP4409608A1 (de) * 2021-09-27 2024-08-07 Robert Bosch GmbH (poly-)silsesquioxan ausbildende kompositzusammensetzung
DE102022205830A1 (de) * 2021-09-27 2023-03-30 Robert Bosch Gesellschaft mit beschränkter Haftung (Poly-)Silsesquioxan ausbildende Kompositzusammensetzung
US20250257239A1 (en) * 2024-02-08 2025-08-14 Honeywell International Inc. Polysiloxane compositions for optoelectronic device applications involving moisture sensitive layers

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2830968A (en) * 1955-05-27 1958-04-15 Dow Corning Organosilicon resins
DE3278567D1 (en) 1981-10-03 1988-07-07 Japan Synthetic Rubber Co Ltd Solvent-soluble organopolysilsesquioxanes, processes for producing the same, and compositions and semiconductor devices using the same
JPS5859222A (ja) * 1981-10-03 1983-04-08 Japan Synthetic Rubber Co Ltd オルガノポリシルセスキオキサン及びその製造方法
US5043789A (en) * 1990-03-15 1991-08-27 International Business Machines Corporation Planarizing silsesquioxane copolymer coating
JP2928341B2 (ja) * 1990-07-03 1999-08-03 三菱電機株式会社 シリコーンラダー系樹脂塗布液組成物
US5063267A (en) * 1990-11-28 1991-11-05 Dow Corning Corporation Hydrogen silsesquioxane resin fractions and their use as coating materials
JPH08188649A (ja) * 1995-01-10 1996-07-23 Kansai Shin Gijutsu Kenkyusho:Kk ラダーポリシロキサンおよびその製造方法
JP3183390B2 (ja) * 1995-09-05 2001-07-09 キヤノン株式会社 光電変換装置及びそれを用いた撮像装置
GB9602873D0 (en) * 1996-02-13 1996-04-10 Dow Corning Sa Heating elements and process for manufacture thereof
KR100255659B1 (ko) * 1996-03-30 2000-05-01 윤종용 반도체 장치의 sog층 처리 방법
US5767014A (en) * 1996-10-28 1998-06-16 International Business Machines Corporation Integrated circuit and process for its manufacture
JP3635180B2 (ja) * 1997-02-24 2005-04-06 ダウ コーニング アジア株式会社 シリル化ポリメチルシルセスキオキサン、その製造方法、それを用いた組成物
US5906859A (en) * 1998-07-10 1999-05-25 Dow Corning Corporation Method for producing low dielectric coatings from hydrogen silsequioxane resin
JP3543669B2 (ja) * 1999-03-31 2004-07-14 信越化学工業株式会社 絶縁膜形成用塗布液及び絶縁膜の形成方法
JP2001011646A (ja) * 1999-04-30 2001-01-16 Kawasaki Steel Corp 表面処理鋼板
JP2000349320A (ja) * 1999-06-08 2000-12-15 Kobe Steel Ltd 耐電圧特性に優れたAl合金製絶縁材料およびその製造方法
US6310281B1 (en) * 2000-03-16 2001-10-30 Global Solar Energy, Inc. Thin-film, flexible photovoltaic module
JP2002097365A (ja) * 2000-09-25 2002-04-02 Nisshin Steel Co Ltd 薄膜多結晶シリコン太陽電池用絶縁基板及びその製造方法
US6646039B2 (en) * 2002-03-05 2003-11-11 Dow Corning Corporation Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same

Similar Documents

Publication Publication Date Title
JP7222983B2 (ja) 充填剤を含むシリコーン組成物
KR100997372B1 (ko) 열전도성 실리콘 조성물
TWI867684B (zh) 具有熱傳導性黏著層的熱傳導性聚矽氧橡膠片及其製造方法
WO2005030874A1 (ja) 熱伝導性シリコーン組成物
JP2007502333A (ja) 光起電アプリケーション用のシリコーンベース誘電被膜及びフィルム
JP3104568B2 (ja) 高電圧電気絶縁体用シリコーンゴム組成物
CN109564906B (zh) 导热性片材
JP2011254009A (ja) 太陽電池モジュール用シリコーン樹脂組成物及び太陽電池モジュール
TW202116879A (zh) 有機聚矽氧烷、其製造方法以及導熱性矽組成物
TWI816687B (zh) 用於暫時性接合黏著劑的聚矽氧組成物、包含其固化體的電子物品、及其製造方法
JP6673322B2 (ja) 導電性ペーストおよび伸縮性配線基板
US20060040116A1 (en) Two-part curable silicone composition
JP6240593B2 (ja) 熱伝導性シリコーン組成物及びその硬化物
JPH05247348A (ja) 貯蔵安定性の一液型オルガノシロキサン組成物
JP2004168920A (ja) 熱伝導性シリコーンエラストマー組成物
JP5533906B2 (ja) 付加反応硬化型オルガノポリシルメチレンシロキサンコポリマー組成物
JP2010514139A5 (enExample)
CN101096565B (zh) 改进有机硅凝胶的耐助焊剂能力的方法及其形成方法
JP4267404B2 (ja) 光学材料用硬化性組成物
US20060264566A1 (en) HCR room temperature curable rubber composition
JP2015189818A (ja) 超音波プローブ用組成物および超音波プローブ用シリコーン樹脂
CN110234711A (zh) 导热性聚有机硅氧烷组合物
TW201908437A (zh) 紫外線硬化型聚矽氧黏著劑組成物及聚矽氧黏著薄膜
JP2019505645A5 (enExample)
JP2020070402A (ja) 付加硬化型シリコーン樹脂組成物、その硬化物、及び光半導体装置