JP2007502333A5 - - Google Patents
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- JP2007502333A5 JP2007502333A5 JP2006522551A JP2006522551A JP2007502333A5 JP 2007502333 A5 JP2007502333 A5 JP 2007502333A5 JP 2006522551 A JP2006522551 A JP 2006522551A JP 2006522551 A JP2006522551 A JP 2006522551A JP 2007502333 A5 JP2007502333 A5 JP 2007502333A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- groups
- formula
- substrate
- silicone composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 125000003118 aryl group Chemical group 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- 125000000524 functional group Chemical group 0.000 claims description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 8
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 125000003282 alkyl amino group Chemical group 0.000 claims description 6
- 150000004678 hydrides Chemical group 0.000 claims description 6
- 125000004356 hydroxy functional group Chemical group O* 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 3
- 125000003342 alkenyl group Chemical group 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims 10
- 239000002245 particle Substances 0.000 claims 4
- 239000012763 reinforcing filler Substances 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000008119 colloidal silica Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 125000005375 organosiloxane group Chemical group 0.000 claims 2
- -1 phenylmethylsiloxane compound Chemical class 0.000 claims 2
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 claims 2
- 229920000734 polysilsesquioxane polymer Polymers 0.000 claims 2
- 125000005372 silanol group Chemical group 0.000 claims 2
- 229920002554 vinyl polymer Polymers 0.000 claims 2
- 150000001408 amides Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US49188303P | 2003-08-01 | 2003-08-01 | |
| PCT/US2004/019609 WO2005017058A1 (en) | 2003-08-01 | 2004-06-18 | Silicone based dielectric coatings and films for photovoltaic applications |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007502333A JP2007502333A (ja) | 2007-02-08 |
| JP2007502333A5 true JP2007502333A5 (enExample) | 2008-11-13 |
Family
ID=34193100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006522551A Pending JP2007502333A (ja) | 2003-08-01 | 2004-06-18 | 光起電アプリケーション用のシリコーンベース誘電被膜及びフィルム |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20070111014A1 (enExample) |
| EP (1) | EP1654334A1 (enExample) |
| JP (1) | JP2007502333A (enExample) |
| KR (1) | KR20060066080A (enExample) |
| CN (1) | CN100582188C (enExample) |
| CA (1) | CA2543366A1 (enExample) |
| WO (1) | WO2005017058A1 (enExample) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100273011A1 (en) * | 1996-12-20 | 2010-10-28 | Bianxiao Zhong | Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates |
| JP5219332B2 (ja) * | 2005-09-20 | 2013-06-26 | 新日鉄住金マテリアルズ株式会社 | 被覆ステンレス箔及び薄膜太陽電池 |
| US20070099005A1 (en) * | 2005-10-31 | 2007-05-03 | Honeywell International Inc. | Thick crack-free silica film by colloidal silica incorporation |
| EP2016625B1 (en) * | 2006-04-18 | 2009-09-02 | Dow Corning Corporation | Copper indium diselenide-based photovoltaic device and method of preparing the same |
| WO2007120905A2 (en) | 2006-04-18 | 2007-10-25 | Dow Corning Corporation | Cadmium telluride-based photovoltaic device and method of preparing the same |
| ATE448569T1 (de) * | 2006-04-18 | 2009-11-15 | Dow Corning | Fotovoltaische anordnung auf kupfer-indium- diselenidbasis und herstellungsverfahren dafür |
| US8304085B2 (en) * | 2006-04-18 | 2012-11-06 | Dow Corning Corporation | Metal foil substrates coated with condensation cured silicone resin compositions |
| US8207442B2 (en) | 2006-04-18 | 2012-06-26 | Itn Energy Systems, Inc. | Reinforcing structures for thin-film photovoltaic device substrates, and associated methods |
| JP5541918B2 (ja) * | 2006-05-22 | 2014-07-09 | ナンヤン テクノロジカル ユニヴァーシティー | 有機薄膜トランジスタ用の溶液プロセスにより作製される無機膜 |
| WO2009007786A2 (en) * | 2006-06-05 | 2009-01-15 | Dow Corning Corporation | A solar cell including a silicone resin layer |
| US20080012074A1 (en) * | 2006-07-14 | 2008-01-17 | Air Products And Chemicals, Inc. | Low Temperature Sol-Gel Silicates As Dielectrics or Planarization Layers For Thin Film Transistors |
| WO2008036769A2 (en) | 2006-09-19 | 2008-03-27 | Itn Energy Systems, Inc. | Semi-transparent dual layer back contact for bifacial and tandem junction thin-film photovolataic devices |
| WO2008079179A1 (en) | 2006-12-20 | 2008-07-03 | Dow Corning Corporation | Glass substrates coated or laminated with cured silicone resin compositions |
| JP5091249B2 (ja) | 2006-12-20 | 2012-12-05 | ダウ・コーニング・コーポレイション | 多層の硬化シリコーン樹脂組成物で被覆またはラミネートされたガラス基板 |
| JP2011516626A (ja) * | 2008-03-04 | 2011-05-26 | ダウ・コーニング・コーポレイション | シリコーン組成物、シリコーン接着剤、被覆基板及び積層基板 |
| JP2011518893A (ja) * | 2008-03-04 | 2011-06-30 | ダウ・コーニング・コーポレイション | ボロシロキサン組成物、ボロシロキサン接着剤、塗装基板及び積層基板 |
| US20110045277A1 (en) * | 2008-05-27 | 2011-02-24 | Nathan Greer | Adhesive Tape and Laminated Glass |
| TW201004795A (en) * | 2008-07-31 | 2010-02-01 | Dow Corning | Laminated glass |
| JP4973783B2 (ja) * | 2008-08-13 | 2012-07-11 | 富士通株式会社 | フィルム貼着装置及びフィルム貼着方法及び電子ペーパの製造方法 |
| US20100059385A1 (en) * | 2008-09-06 | 2010-03-11 | Delin Li | Methods for fabricating thin film solar cells |
| JP5471180B2 (ja) * | 2008-09-11 | 2014-04-16 | 信越化学工業株式会社 | シリコーン積層基板、その製造方法、シリコーン積層基板製造用シリコーン樹脂組成物及びｌｅｄ装置 |
| KR101138798B1 (ko) * | 2008-12-29 | 2012-04-24 | 제일모직주식회사 | 신뢰성이 향상된 이방 전도성 필름용 조성물 및 이를 이용한 이방전도성 필름 |
| US8557437B2 (en) * | 2009-03-25 | 2013-10-15 | Tdk Corporation | Electrode comprising protective layer for lithium ion secondary battery and lithium ion secondary battery |
| US8419535B2 (en) * | 2009-06-08 | 2013-04-16 | Cfph, Llc | Mobile playing card devices |
| US8784189B2 (en) * | 2009-06-08 | 2014-07-22 | Cfph, Llc | Interprocess communication regarding movement of game devices |
| US8613671B2 (en) * | 2009-06-08 | 2013-12-24 | Cfph, Llc | Data transfer and control among multiple computer devices in a gaming environment |
| US8287386B2 (en) * | 2009-06-08 | 2012-10-16 | Cfph, Llc | Electrical transmission among interconnected gaming systems |
| US8545327B2 (en) * | 2009-06-08 | 2013-10-01 | Cfph, Llc | Amusement device including means for processing electronic data in play of a game in which an outcome is dependant upon card values |
| US8771078B2 (en) | 2009-06-08 | 2014-07-08 | Cfph, Llc | Amusement device including means for processing electronic data in play of a game of chance |
| US8545328B2 (en) * | 2009-06-08 | 2013-10-01 | Cfph, Llc | Portable electronic charge device for card devices |
| US8557877B2 (en) | 2009-06-10 | 2013-10-15 | Honeywell International Inc. | Anti-reflective coatings for optically transparent substrates |
| DE102009042447A1 (de) * | 2009-09-23 | 2011-04-07 | Sasol Germany Gmbh | Zusammensetzungen enthaltend Dialkylether, daraus hergestellte Beschichtungen und Verwendung von Dialkylethern |
| EP2328183A1 (de) * | 2009-11-26 | 2011-06-01 | Engineered Products Switzerland AG | Substrat mit einer Metallfolie zur Herstellung von Photovoltaik-Zellen |
| KR101133061B1 (ko) * | 2010-01-25 | 2012-04-04 | 주식회사 엘지화학 | 광전지용 시트 |
| JP2014500897A (ja) | 2010-11-09 | 2014-01-16 | ダウ コーニング コーポレーション | 有機リン酸化合物により可塑化されたヒドロシリル化硬化シリコーン樹脂 |
| US8864898B2 (en) | 2011-05-31 | 2014-10-21 | Honeywell International Inc. | Coating formulations for optical elements |
| US20150209654A1 (en) | 2013-11-12 | 2015-07-30 | Deq Systems Corp. | Reconfigurable playing cards and game display devices |
| US10544329B2 (en) | 2015-04-13 | 2020-01-28 | Honeywell International Inc. | Polysiloxane formulations and coatings for optoelectronic applications |
| JP6203986B2 (ja) | 2015-05-27 | 2017-09-27 | 京セラ株式会社 | 太陽電池素子およびその製造方法 |
| JP2017120873A (ja) | 2015-12-25 | 2017-07-06 | 京セラ株式会社 | 絶縁性ペーストおよびその製造方法並びに太陽電池素子の製造方法 |
| CN107501942B (zh) * | 2017-08-29 | 2020-10-02 | 北京康美特科技股份有限公司 | 可模塑成型的有机硅树脂、组合物及其半导体发光元件 |
| CN109651614A (zh) * | 2017-10-12 | 2019-04-19 | 弗洛里光电材料（苏州）有限公司 | 八硅倍半氧烷纳米杂化分子化合物及其应用 |
| JP7048367B2 (ja) * | 2018-03-15 | 2022-04-05 | 日鉄ケミカル＆マテリアル株式会社 | 平坦化膜形成用塗布液およびその製造方法、平坦化膜付き金属箔コイルおよびその製造方法、並びにそれらに用いるシリカ微粒子含有ケトン系溶剤 |
| WO2020180837A1 (en) | 2019-03-07 | 2020-09-10 | Liquid X Printed Metals, Inc. | Thermal cure dielectric ink |
| RO138402A2 (ro) * | 2021-09-27 | 2024-09-30 | Robert Bosch Gmbh | Compoziţie compozită formatoare de (poli)silsesquioxan |
| DE102022205830A1 (de) * | 2021-09-27 | 2023-03-30 | Robert Bosch Gesellschaft mit beschränkter Haftung | (Poly-)Silsesquioxan ausbildende Kompositzusammensetzung |
| US20250257239A1 (en) * | 2024-02-08 | 2025-08-14 | Honeywell International Inc. | Polysiloxane compositions for optoelectronic device applications involving moisture sensitive layers |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2830968A (en) * | 1955-05-27 | 1958-04-15 | Dow Corning | Organosilicon resins |
| JPS5859222A (ja) * | 1981-10-03 | 1983-04-08 | Japan Synthetic Rubber Co Ltd | オルガノポリシルセスキオキサン及びその製造方法 |
| DE3278567D1 (en) | 1981-10-03 | 1988-07-07 | Japan Synthetic Rubber Co Ltd | Solvent-soluble organopolysilsesquioxanes, processes for producing the same, and compositions and semiconductor devices using the same |
| US5043789A (en) | 1990-03-15 | 1991-08-27 | International Business Machines Corporation | Planarizing silsesquioxane copolymer coating |
| JP2928341B2 (ja) | 1990-07-03 | 1999-08-03 | 三菱電機株式会社 | シリコーンラダー系樹脂塗布液組成物 |
| US5063267A (en) * | 1990-11-28 | 1991-11-05 | Dow Corning Corporation | Hydrogen silsesquioxane resin fractions and their use as coating materials |
| JPH08188649A (ja) * | 1995-01-10 | 1996-07-23 | Kansai Shin Gijutsu Kenkyusho:Kk | ラダーポリシロキサンおよびその製造方法 |
| JP3183390B2 (ja) * | 1995-09-05 | 2001-07-09 | キヤノン株式会社 | 光電変換装置及びそれを用いた撮像装置 |
| GB9602873D0 (en) * | 1996-02-13 | 1996-04-10 | Dow Corning Sa | Heating elements and process for manufacture thereof |
| KR100255659B1 (ko) * | 1996-03-30 | 2000-05-01 | 윤종용 | 반도체 장치의 sog층 처리 방법 |
| US5767014A (en) * | 1996-10-28 | 1998-06-16 | International Business Machines Corporation | Integrated circuit and process for its manufacture |
| JP3635180B2 (ja) * | 1997-02-24 | 2005-04-06 | ダウ コーニング アジア株式会社 | シリル化ポリメチルシルセスキオキサン、その製造方法、それを用いた組成物 |
| US5906859A (en) * | 1998-07-10 | 1999-05-25 | Dow Corning Corporation | Method for producing low dielectric coatings from hydrogen silsequioxane resin |
| JP3543669B2 (ja) | 1999-03-31 | 2004-07-14 | 信越化学工業株式会社 | 絶縁膜形成用塗布液及び絶縁膜の形成方法 |
| JP2001011646A (ja) * | 1999-04-30 | 2001-01-16 | Kawasaki Steel Corp | 表面処理鋼板 |
| JP2000349320A (ja) * | 1999-06-08 | 2000-12-15 | Kobe Steel Ltd | 耐電圧特性に優れたＡｌ合金製絶縁材料およびその製造方法 |
| US6310281B1 (en) * | 2000-03-16 | 2001-10-30 | Global Solar Energy, Inc. | Thin-film, flexible photovoltaic module |
| JP2002097365A (ja) * | 2000-09-25 | 2002-04-02 | Nisshin Steel Co Ltd | 薄膜多結晶シリコン太陽電池用絶縁基板及びその製造方法 |
| US6646039B2 (en) * | 2002-03-05 | 2003-11-11 | Dow Corning Corporation | Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same |
-
2004
- 2004-06-18 US US10/566,788 patent/US20070111014A1/en not_active Abandoned
- 2004-06-18 EP EP20040755651 patent/EP1654334A1/en not_active Withdrawn
- 2004-06-18 WO PCT/US2004/019609 patent/WO2005017058A1/en not_active Ceased
- 2004-06-18 JP JP2006522551A patent/JP2007502333A/ja active Pending
- 2004-06-18 CA CA 2543366 patent/CA2543366A1/en not_active Abandoned
- 2004-06-18 KR KR1020067002276A patent/KR20060066080A/ko not_active Ceased
- 2004-06-18 CN CN200480028839A patent/CN100582188C/zh not_active Expired - Fee Related
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