JP2007502333A - 光起電アプリケーション用のシリコーンベース誘電被膜及びフィルム - Google Patents
光起電アプリケーション用のシリコーンベース誘電被膜及びフィルム Download PDFInfo
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- JP2007502333A JP2007502333A JP2006522551A JP2006522551A JP2007502333A JP 2007502333 A JP2007502333 A JP 2007502333A JP 2006522551 A JP2006522551 A JP 2006522551A JP 2006522551 A JP2006522551 A JP 2006522551A JP 2007502333 A JP2007502333 A JP 2007502333A
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- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 1
- 235000019796 monopotassium phosphate Nutrition 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- 150000003891 oxalate salts Chemical class 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- IWZKICVEHNUQTL-UHFFFAOYSA-M potassium hydrogen phthalate Chemical compound [K+].OC(=O)C1=CC=CC=C1C([O-])=O IWZKICVEHNUQTL-UHFFFAOYSA-M 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052990 silicon hydride Inorganic materials 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical group Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/30—Coatings
- H10F77/306—Coatings for devices having potential barriers
- H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/126—Active materials comprising only Group I-III-VI chalcopyrite materials, e.g. CuInSe2, CuGaSe2 or CuInGaSe2 [CIGS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Paints Or Removers (AREA)
- Silicon Polymers (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US49188303P | 2003-08-01 | 2003-08-01 | |
| PCT/US2004/019609 WO2005017058A1 (en) | 2003-08-01 | 2004-06-18 | Silicone based dielectric coatings and films for photovoltaic applications |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007502333A true JP2007502333A (ja) | 2007-02-08 |
| JP2007502333A5 JP2007502333A5 (enExample) | 2008-11-13 |
Family
ID=34193100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006522551A Pending JP2007502333A (ja) | 2003-08-01 | 2004-06-18 | 光起電アプリケーション用のシリコーンベース誘電被膜及びフィルム |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20070111014A1 (enExample) |
| EP (1) | EP1654334A1 (enExample) |
| JP (1) | JP2007502333A (enExample) |
| KR (1) | KR20060066080A (enExample) |
| CN (1) | CN100582188C (enExample) |
| CA (1) | CA2543366A1 (enExample) |
| WO (1) | WO2005017058A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019157031A (ja) * | 2018-03-15 | 2019-09-19 | 日鉄ケミカル＆マテリアル株式会社 | 平坦化膜形成用塗布液およびその製造方法、平坦化膜付き金属箔コイルおよびその製造方法、並びにそれらに用いるシリカ微粒子含有ケトン系溶剤 |
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| US20100273011A1 (en) * | 1996-12-20 | 2010-10-28 | Bianxiao Zhong | Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates |
| JP5219332B2 (ja) * | 2005-09-20 | 2013-06-26 | 新日鉄住金マテリアルズ株式会社 | 被覆ステンレス箔及び薄膜太陽電池 |
| US20070099005A1 (en) * | 2005-10-31 | 2007-05-03 | Honeywell International Inc. | Thick crack-free silica film by colloidal silica incorporation |
| EP2016625B1 (en) * | 2006-04-18 | 2009-09-02 | Dow Corning Corporation | Copper indium diselenide-based photovoltaic device and method of preparing the same |
| WO2007120905A2 (en) | 2006-04-18 | 2007-10-25 | Dow Corning Corporation | Cadmium telluride-based photovoltaic device and method of preparing the same |
| ATE448569T1 (de) * | 2006-04-18 | 2009-11-15 | Dow Corning | Fotovoltaische anordnung auf kupfer-indium- diselenidbasis und herstellungsverfahren dafür |
| US8304085B2 (en) * | 2006-04-18 | 2012-11-06 | Dow Corning Corporation | Metal foil substrates coated with condensation cured silicone resin compositions |
| US8207442B2 (en) | 2006-04-18 | 2012-06-26 | Itn Energy Systems, Inc. | Reinforcing structures for thin-film photovoltaic device substrates, and associated methods |
| JP5541918B2 (ja) * | 2006-05-22 | 2014-07-09 | ナンヤン テクノロジカル ユニヴァーシティー | 有機薄膜トランジスタ用の溶液プロセスにより作製される無機膜 |
| WO2009007786A2 (en) * | 2006-06-05 | 2009-01-15 | Dow Corning Corporation | A solar cell including a silicone resin layer |
| US20080012074A1 (en) * | 2006-07-14 | 2008-01-17 | Air Products And Chemicals, Inc. | Low Temperature Sol-Gel Silicates As Dielectrics or Planarization Layers For Thin Film Transistors |
| WO2008036769A2 (en) | 2006-09-19 | 2008-03-27 | Itn Energy Systems, Inc. | Semi-transparent dual layer back contact for bifacial and tandem junction thin-film photovolataic devices |
| WO2008079179A1 (en) | 2006-12-20 | 2008-07-03 | Dow Corning Corporation | Glass substrates coated or laminated with cured silicone resin compositions |
| JP5091249B2 (ja) | 2006-12-20 | 2012-12-05 | ダウ・コーニング・コーポレイション | 多層の硬化シリコーン樹脂組成物で被覆またはラミネートされたガラス基板 |
| JP2011516626A (ja) * | 2008-03-04 | 2011-05-26 | ダウ・コーニング・コーポレイション | シリコーン組成物、シリコーン接着剤、被覆基板及び積層基板 |
| JP2011518893A (ja) * | 2008-03-04 | 2011-06-30 | ダウ・コーニング・コーポレイション | ボロシロキサン組成物、ボロシロキサン接着剤、塗装基板及び積層基板 |
| US20110045277A1 (en) * | 2008-05-27 | 2011-02-24 | Nathan Greer | Adhesive Tape and Laminated Glass |
| TW201004795A (en) * | 2008-07-31 | 2010-02-01 | Dow Corning | Laminated glass |
| JP4973783B2 (ja) * | 2008-08-13 | 2012-07-11 | 富士通株式会社 | フィルム貼着装置及びフィルム貼着方法及び電子ペーパの製造方法 |
| US20100059385A1 (en) * | 2008-09-06 | 2010-03-11 | Delin Li | Methods for fabricating thin film solar cells |
| JP5471180B2 (ja) * | 2008-09-11 | 2014-04-16 | 信越化学工業株式会社 | シリコーン積層基板、その製造方法、シリコーン積層基板製造用シリコーン樹脂組成物及びｌｅｄ装置 |
| KR101138798B1 (ko) * | 2008-12-29 | 2012-04-24 | 제일모직주식회사 | 신뢰성이 향상된 이방 전도성 필름용 조성물 및 이를 이용한 이방전도성 필름 |
| US8557437B2 (en) * | 2009-03-25 | 2013-10-15 | Tdk Corporation | Electrode comprising protective layer for lithium ion secondary battery and lithium ion secondary battery |
| US8419535B2 (en) * | 2009-06-08 | 2013-04-16 | Cfph, Llc | Mobile playing card devices |
| US8784189B2 (en) * | 2009-06-08 | 2014-07-22 | Cfph, Llc | Interprocess communication regarding movement of game devices |
| US8613671B2 (en) * | 2009-06-08 | 2013-12-24 | Cfph, Llc | Data transfer and control among multiple computer devices in a gaming environment |
| US8287386B2 (en) * | 2009-06-08 | 2012-10-16 | Cfph, Llc | Electrical transmission among interconnected gaming systems |
| US8545327B2 (en) * | 2009-06-08 | 2013-10-01 | Cfph, Llc | Amusement device including means for processing electronic data in play of a game in which an outcome is dependant upon card values |
| US8771078B2 (en) | 2009-06-08 | 2014-07-08 | Cfph, Llc | Amusement device including means for processing electronic data in play of a game of chance |
| US8545328B2 (en) * | 2009-06-08 | 2013-10-01 | Cfph, Llc | Portable electronic charge device for card devices |
| US8557877B2 (en) | 2009-06-10 | 2013-10-15 | Honeywell International Inc. | Anti-reflective coatings for optically transparent substrates |
| DE102009042447A1 (de) * | 2009-09-23 | 2011-04-07 | Sasol Germany Gmbh | Zusammensetzungen enthaltend Dialkylether, daraus hergestellte Beschichtungen und Verwendung von Dialkylethern |
| EP2328183A1 (de) * | 2009-11-26 | 2011-06-01 | Engineered Products Switzerland AG | Substrat mit einer Metallfolie zur Herstellung von Photovoltaik-Zellen |
| KR101133061B1 (ko) * | 2010-01-25 | 2012-04-04 | 주식회사 엘지화학 | 광전지용 시트 |
| JP2014500897A (ja) | 2010-11-09 | 2014-01-16 | ダウ コーニング コーポレーション | 有機リン酸化合物により可塑化されたヒドロシリル化硬化シリコーン樹脂 |
| US8864898B2 (en) | 2011-05-31 | 2014-10-21 | Honeywell International Inc. | Coating formulations for optical elements |
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| US10544329B2 (en) | 2015-04-13 | 2020-01-28 | Honeywell International Inc. | Polysiloxane formulations and coatings for optoelectronic applications |
| JP6203986B2 (ja) | 2015-05-27 | 2017-09-27 | 京セラ株式会社 | 太陽電池素子およびその製造方法 |
| JP2017120873A (ja) | 2015-12-25 | 2017-07-06 | 京セラ株式会社 | 絶縁性ペーストおよびその製造方法並びに太陽電池素子の製造方法 |
| CN107501942B (zh) * | 2017-08-29 | 2020-10-02 | 北京康美特科技股份有限公司 | 可模塑成型的有机硅树脂、组合物及其半导体发光元件 |
| CN109651614A (zh) * | 2017-10-12 | 2019-04-19 | 弗洛里光电材料（苏州）有限公司 | 八硅倍半氧烷纳米杂化分子化合物及其应用 |
| WO2020180837A1 (en) | 2019-03-07 | 2020-09-10 | Liquid X Printed Metals, Inc. | Thermal cure dielectric ink |
| RO138402A2 (ro) * | 2021-09-27 | 2024-09-30 | Robert Bosch Gmbh | Compoziţie compozită formatoare de (poli)silsesquioxan |
| DE102022205830A1 (de) * | 2021-09-27 | 2023-03-30 | Robert Bosch Gesellschaft mit beschränkter Haftung | (Poly-)Silsesquioxan ausbildende Kompositzusammensetzung |
| US20250257239A1 (en) * | 2024-02-08 | 2025-08-14 | Honeywell International Inc. | Polysiloxane compositions for optoelectronic device applications involving moisture sensitive layers |
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- 2004-06-18 EP EP20040755651 patent/EP1654334A1/en not_active Withdrawn
- 2004-06-18 WO PCT/US2004/019609 patent/WO2005017058A1/en not_active Ceased
- 2004-06-18 JP JP2006522551A patent/JP2007502333A/ja active Pending
- 2004-06-18 CA CA 2543366 patent/CA2543366A1/en not_active Abandoned
- 2004-06-18 KR KR1020067002276A patent/KR20060066080A/ko not_active Ceased
- 2004-06-18 CN CN200480028839A patent/CN100582188C/zh not_active Expired - Fee Related
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| JP2000349320A (ja) * | 1999-06-08 | 2000-12-15 | Kobe Steel Ltd | 耐電圧特性に優れたＡｌ合金製絶縁材料およびその製造方法 |
| JP2002097365A (ja) * | 2000-09-25 | 2002-04-02 | Nisshin Steel Co Ltd | 薄膜多結晶シリコン太陽電池用絶縁基板及びその製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2019157031A (ja) * | 2018-03-15 | 2019-09-19 | 日鉄ケミカル＆マテリアル株式会社 | 平坦化膜形成用塗布液およびその製造方法、平坦化膜付き金属箔コイルおよびその製造方法、並びにそれらに用いるシリカ微粒子含有ケトン系溶剤 |
| JP7048367B2 (ja) | 2018-03-15 | 2022-04-05 | 日鉄ケミカル＆マテリアル株式会社 | 平坦化膜形成用塗布液およびその製造方法、平坦化膜付き金属箔コイルおよびその製造方法、並びにそれらに用いるシリカ微粒子含有ケトン系溶剤 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060066080A (ko) | 2006-06-15 |
| CA2543366A1 (en) | 2005-02-24 |
| CN100582188C (zh) | 2010-01-20 |
| EP1654334A1 (en) | 2006-05-10 |
| WO2005017058A1 (en) | 2005-02-24 |
| US20070111014A1 (en) | 2007-05-17 |
| CN1863882A (zh) | 2006-11-15 |
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