JP2007332462A - プラズマ処理装置の再生方法,プラズマ処理容器内部材,プラズマ処理容器内部材の製造方法及びプラズマ処理装置 - Google Patents
プラズマ処理装置の再生方法,プラズマ処理容器内部材,プラズマ処理容器内部材の製造方法及びプラズマ処理装置 Download PDFInfo
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- JP2007332462A JP2007332462A JP2007190921A JP2007190921A JP2007332462A JP 2007332462 A JP2007332462 A JP 2007332462A JP 2007190921 A JP2007190921 A JP 2007190921A JP 2007190921 A JP2007190921 A JP 2007190921A JP 2007332462 A JP2007332462 A JP 2007332462A
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- plasma treatment
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 230000001172 regenerating effect Effects 0.000 title claims abstract description 16
- 238000009832 plasma treatment Methods 0.000 title abstract description 9
- 238000004519 manufacturing process Methods 0.000 title description 15
- 239000000463 material Substances 0.000 claims abstract description 19
- 229920001721 polyimide Polymers 0.000 claims abstract description 19
- 239000004642 Polyimide Substances 0.000 claims abstract description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910001404 rare earth metal oxide Inorganic materials 0.000 claims abstract description 14
- 239000004693 Polybenzimidazole Substances 0.000 claims abstract description 13
- 229920002480 polybenzimidazole Polymers 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000005422 blasting Methods 0.000 claims description 22
- 238000005507 spraying Methods 0.000 claims description 15
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 12
- 235000011089 carbon dioxide Nutrition 0.000 claims description 12
- 239000010408 film Substances 0.000 description 48
- 239000007789 gas Substances 0.000 description 29
- 239000004065 semiconductor Substances 0.000 description 18
- 239000002245 particle Substances 0.000 description 11
- 238000001020 plasma etching Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000004020 conductor Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 238000007751 thermal spraying Methods 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 4
- 230000008439 repair process Effects 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000007750 plasma spraying Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Landscapes
- Chemical Vapour Deposition (AREA)
- Coating By Spraying Or Casting (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007190921A JP2007332462A (ja) | 2000-12-12 | 2007-07-23 | プラズマ処理装置の再生方法,プラズマ処理容器内部材,プラズマ処理容器内部材の製造方法及びプラズマ処理装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000377100 | 2000-12-12 | ||
| JP2001059985 | 2001-03-05 | ||
| JP2007190921A JP2007332462A (ja) | 2000-12-12 | 2007-07-23 | プラズマ処理装置の再生方法,プラズマ処理容器内部材,プラズマ処理容器内部材の製造方法及びプラズマ処理装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002550132A Division JP4440541B2 (ja) | 2000-12-12 | 2001-12-07 | プラズマ処理装置の再生方法、プラズマ処理装置およびプラズマ処理容器の内部の部材の再生方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007332462A true JP2007332462A (ja) | 2007-12-27 |
| JP2007332462A5 JP2007332462A5 (enExample) | 2008-07-24 |
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| JP2007190921A Pending JP2007332462A (ja) | 2000-12-12 | 2007-07-23 | プラズマ処理装置の再生方法,プラズマ処理容器内部材,プラズマ処理容器内部材の製造方法及びプラズマ処理装置 |
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| JP (1) | JP2007332462A (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008285734A (ja) * | 2007-05-21 | 2008-11-27 | Shin Etsu Chem Co Ltd | 希土類酸化物含有溶射基板及びその製造方法 |
| JP2009174000A (ja) * | 2008-01-24 | 2009-08-06 | Shin Etsu Chem Co Ltd | セラミックス溶射部材及びその製造方法ならびにセラミックス溶射部材用研磨メディア |
| JP2012500498A (ja) * | 2008-08-19 | 2012-01-05 | ラム リサーチ コーポレーション | 静電チャック用エッジリング |
| WO2018225497A1 (ja) * | 2017-06-08 | 2018-12-13 | 株式会社トクヤマ | 洗浄装置、および洗浄方法 |
| JP2019220500A (ja) * | 2018-06-15 | 2019-12-26 | キオクシア株式会社 | プラズマ処理装置の再生装置および再生方法 |
| CN114843166A (zh) * | 2021-02-02 | 2022-08-02 | 东京毅力科创株式会社 | 处理容器、等离子体处理装置和处理容器的制造方法 |
| KR20230164656A (ko) | 2022-05-23 | 2023-12-04 | 주식회사 히타치하이테크 | 내벽 부재의 재생 방법 |
| WO2024075459A1 (ja) * | 2022-10-05 | 2024-04-11 | 日本発條株式会社 | 積層構造体および積層構造体の製造方法 |
Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01188657A (ja) * | 1987-09-07 | 1989-07-27 | Yamada Kinzoku Boshoku Kk | グラスライニング機器の補修方法 |
| JPH01120328U (enExample) * | 1988-02-08 | 1989-08-15 | ||
| JPH01268853A (ja) * | 1988-04-18 | 1989-10-26 | Nippon Mining Co Ltd | クリープ温度域で使用される装置のクリープ脆化防止方法 |
| JPH02301548A (ja) * | 1989-05-15 | 1990-12-13 | Toshiba Corp | プラズマ対向材料の修理方法 |
| JPH03264705A (ja) * | 1990-03-14 | 1991-11-26 | Mitsubishi Heavy Ind Ltd | ガスタービン動翼補修方法 |
| JPH0598412A (ja) * | 1991-10-07 | 1993-04-20 | Nippon Steel Corp | 被溶射材料の前処理方法 |
| JPH06232243A (ja) * | 1993-01-29 | 1994-08-19 | Sumitomo Metal Ind Ltd | 静電チャック |
| JPH07176524A (ja) * | 1993-11-05 | 1995-07-14 | Tokyo Electron Ltd | 真空処理装置用素材及びその製造方法 |
| JPH08284604A (ja) * | 1995-04-14 | 1996-10-29 | Ishikawajima Harima Heavy Ind Co Ltd | ガスタービン翼の補修方法 |
| JPH08339895A (ja) * | 1995-06-12 | 1996-12-24 | Tokyo Electron Ltd | プラズマ処理装置 |
| JPH09228071A (ja) * | 1996-02-23 | 1997-09-02 | Nippon Steel Corp | 連続鋳造用鋳型への溶射方法及び連続鋳造用鋳型 |
| JPH104083A (ja) * | 1996-06-17 | 1998-01-06 | Kyocera Corp | 半導体製造用耐食性部材 |
| JPH10158810A (ja) * | 1996-12-03 | 1998-06-16 | Ngk Insulators Ltd | 金属製薄肉パイプ外周面への溶射方法 |
| JPH11209864A (ja) * | 1998-01-21 | 1999-08-03 | Meiwa Rubber Kogyo Kk | コロナ放電処理用セラミックロール及びその製造方法 |
| JPH11269639A (ja) * | 1998-03-24 | 1999-10-05 | Sumitomo Metal Mining Co Ltd | スパッタリングターゲットの再生方法 |
| JPH11323526A (ja) * | 1998-05-19 | 1999-11-26 | Babcock Hitachi Kk | 高硬度溶射皮膜の補修方法 |
| JP2000114189A (ja) * | 1998-10-06 | 2000-04-21 | Toshiba Corp | 真空処理装置 |
| JP2000234161A (ja) * | 1999-02-10 | 2000-08-29 | Toshiba Corp | 軸受け部品、その製造方法及び補修方法 |
| JP2001164354A (ja) * | 1999-12-10 | 2001-06-19 | Tocalo Co Ltd | プラズマ処理容器内部材およびその製造方法 |
-
2007
- 2007-07-23 JP JP2007190921A patent/JP2007332462A/ja active Pending
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01188657A (ja) * | 1987-09-07 | 1989-07-27 | Yamada Kinzoku Boshoku Kk | グラスライニング機器の補修方法 |
| JPH01120328U (enExample) * | 1988-02-08 | 1989-08-15 | ||
| JPH01268853A (ja) * | 1988-04-18 | 1989-10-26 | Nippon Mining Co Ltd | クリープ温度域で使用される装置のクリープ脆化防止方法 |
| JPH02301548A (ja) * | 1989-05-15 | 1990-12-13 | Toshiba Corp | プラズマ対向材料の修理方法 |
| JPH03264705A (ja) * | 1990-03-14 | 1991-11-26 | Mitsubishi Heavy Ind Ltd | ガスタービン動翼補修方法 |
| JPH0598412A (ja) * | 1991-10-07 | 1993-04-20 | Nippon Steel Corp | 被溶射材料の前処理方法 |
| JPH06232243A (ja) * | 1993-01-29 | 1994-08-19 | Sumitomo Metal Ind Ltd | 静電チャック |
| JPH07176524A (ja) * | 1993-11-05 | 1995-07-14 | Tokyo Electron Ltd | 真空処理装置用素材及びその製造方法 |
| JPH08284604A (ja) * | 1995-04-14 | 1996-10-29 | Ishikawajima Harima Heavy Ind Co Ltd | ガスタービン翼の補修方法 |
| JPH08339895A (ja) * | 1995-06-12 | 1996-12-24 | Tokyo Electron Ltd | プラズマ処理装置 |
| JPH09228071A (ja) * | 1996-02-23 | 1997-09-02 | Nippon Steel Corp | 連続鋳造用鋳型への溶射方法及び連続鋳造用鋳型 |
| JPH104083A (ja) * | 1996-06-17 | 1998-01-06 | Kyocera Corp | 半導体製造用耐食性部材 |
| JPH10158810A (ja) * | 1996-12-03 | 1998-06-16 | Ngk Insulators Ltd | 金属製薄肉パイプ外周面への溶射方法 |
| JPH11209864A (ja) * | 1998-01-21 | 1999-08-03 | Meiwa Rubber Kogyo Kk | コロナ放電処理用セラミックロール及びその製造方法 |
| JPH11269639A (ja) * | 1998-03-24 | 1999-10-05 | Sumitomo Metal Mining Co Ltd | スパッタリングターゲットの再生方法 |
| JPH11323526A (ja) * | 1998-05-19 | 1999-11-26 | Babcock Hitachi Kk | 高硬度溶射皮膜の補修方法 |
| JP2000114189A (ja) * | 1998-10-06 | 2000-04-21 | Toshiba Corp | 真空処理装置 |
| JP2000234161A (ja) * | 1999-02-10 | 2000-08-29 | Toshiba Corp | 軸受け部品、その製造方法及び補修方法 |
| JP2001164354A (ja) * | 1999-12-10 | 2001-06-19 | Tocalo Co Ltd | プラズマ処理容器内部材およびその製造方法 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008285734A (ja) * | 2007-05-21 | 2008-11-27 | Shin Etsu Chem Co Ltd | 希土類酸化物含有溶射基板及びその製造方法 |
| JP2009174000A (ja) * | 2008-01-24 | 2009-08-06 | Shin Etsu Chem Co Ltd | セラミックス溶射部材及びその製造方法ならびにセラミックス溶射部材用研磨メディア |
| JP2012500498A (ja) * | 2008-08-19 | 2012-01-05 | ラム リサーチ コーポレーション | 静電チャック用エッジリング |
| WO2018225497A1 (ja) * | 2017-06-08 | 2018-12-13 | 株式会社トクヤマ | 洗浄装置、および洗浄方法 |
| JP2019220500A (ja) * | 2018-06-15 | 2019-12-26 | キオクシア株式会社 | プラズマ処理装置の再生装置および再生方法 |
| JP7096079B2 (ja) | 2018-06-15 | 2022-07-05 | キオクシア株式会社 | プラズマ処理装置の再生装置 |
| CN114843166A (zh) * | 2021-02-02 | 2022-08-02 | 东京毅力科创株式会社 | 处理容器、等离子体处理装置和处理容器的制造方法 |
| KR20230164656A (ko) | 2022-05-23 | 2023-12-04 | 주식회사 히타치하이테크 | 내벽 부재의 재생 방법 |
| WO2024075459A1 (ja) * | 2022-10-05 | 2024-04-11 | 日本発條株式会社 | 積層構造体および積層構造体の製造方法 |
| EP4600994A4 (en) * | 2022-10-05 | 2025-12-03 | Nhk Spring Co Ltd | MULTILAYER STRUCTURE AND PRODUCTION PROCESS FOR MULTILAYER STRUCTURES |
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