JP2007227504A - 半導体発光装置およびこれを利用した集積型半導体光導波路素子 - Google Patents
半導体発光装置およびこれを利用した集積型半導体光導波路素子 Download PDFInfo
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Abstract
【解決手段】リッジを有する半導体発光装置において、リッジとそれ以外の構成要素との屈折率差を低くすることにより単一横モードのままリッジ幅の拡大を可能にし、かつリッジ両側に沿ってほぼ垂直の溝を形成することにより、拡散電流防止と屈折率差増大を防ぎ、かつリッジに回折格子を形成することにより、再成長による特性劣化を防ぎ、かつそれらを電界吸収型光変調器などの光素子と集積する際、成長回数を増大させることなく、テーパー状の導波路を用いることによりリッジ幅に制限なく電界吸収型光変調器などの光素子と上記発光装置とを集積する。
【選択図】図11
Description
さらに回折格子の挿入位置もレーザの特性に影響を与える。従来の回折格子の作製位置はn基板上部や多重井戸層内、または上部バッファ層内であった。多重井戸層内、または上部バッファ層内に回折格子を挿入した場合、回折格子形成後再成長を行うが、その再成長界面にてキャリア濃度変化を起こし、キャリアをトラップしてしまうため高出力化にとって特性劣化を招いてしまう。一方、n基板上部に作製すると上記のような問題は無視できるようになるが、多重井戸層を形成する前に回折格子を形成してしまうため波長の制御性が悪くなってしまう。
まず、本発明を波長1.5μm帯リッジ導波路型半導体発光装置に適用した実施例1について説明する。ただし、図の大きさと実施例1記載の縮尺は必ずしも一致するものではない。図1および図2を用いて、本発明の前提となる上部バッファ層を持つ半導体発光装置を説明し、その後、リッジ両側面部へ上部バッファ層に切り込んだ低屈折率の絶縁性の溝を形成した本発明の半導体発光装置の実施例を説明する。
本発明を適用した半導体発光装置は、n型InP半導体基板を出発とする構成に代えて、n型GaAs半導体基板を出発とする構成によっても実現できる。図8(a)−(c)はn型GaAs半導体基板を出発とする構成によって実現した半導体発光装置を実施例2として示す図である。
本発明を適用した集積型光導波路素子の実施形態の一例を、図9(a)−(e)、図10(a)−(e)および図11を参照して説明する。ただし図は飽くまで本実施例を説明するものであって、図の大きさと本実施例記載の縮尺は必ずしも一致するものではない。
本発明を適用した集積型光導波路素子の実施例4として、電界吸収型光変調器に代えてマッハ−ツェンダ型光変調器を採用した集積型光導波路素子の一例を、図13を用いて説明する。ただし図は飽くまで本実施例を説明するものであって、図の大きさと本実施例記載の縮尺は必ずしも一致するものではない。
Claims (20)
- 半導体基板と、前記基板上に設けられた下部クラッド層と、前記下部クラッド層上に設けられた活性層と、前記活性層上に設けられた上部クラッド層と、前記上部クラッド層上に設けられたリッジとを有する半導体発光装置であって、
前記上部クラッド層と前記リッジとの間に上部バッファ層が形成されるとともに、前記リッジの両側面と前記上部バッファ層との間に溝が形成され、該溝の幅が0を超えて200nm以下、深さの中央部分の位置で前記溝の側面が前記基板の面に対して90°±10°の角度を有することを特徴とする半導体発光装置。 - 前記溝が前記上部バッファ層の厚さの全体または一部の厚さに形成された請求項1記載の半導体発光装置。
- 前記半導体基板がn型InP、前記下部クラッド層がn型InGaAsP、前記活性層がInGaAsP、前記上部クラッド層がInGaAsPである請求項1記載の半導体発光装置。
- 前記半導体基板がn型InP、前記下部クラッド層がn型InGaAlAs、前記活性層がInGaAlAs、前記上部クラッド層がInGaAlAsである請求項1記載の半導体発光装置。
- 前記半導体基板がn型GaAs、前記下部クラッド層がn型AlGaInP、前記活性層がAlGaInPとGaInP、前記上部クラッド層がp型AlGaInPである請求項1記載の半導体発光装置。
- 半導体基板と、前記基板上に設けられた下部クラッド層と、前記下部クラッド層上に設けられた活性層と、前記活性層上に設けられた上部クラッド層と、前記上部クラッド層上に設けられたリッジとを有する半導体発光装置であって、
前記リッジが、前記上部バッファ層上に形成された下スペーサ層と、回折格子層と、上スペーサ層と、コンタクト層とを有することを特徴とする分布帰還型半導体発光装置。 - 前記下スペーサ層がp型InP、前記回折格子層がInGaAsP四元回折格子層、前記上スペーサ層がp型InP層、前記コンタクト層がInGaAsPとInGaAsからなる請求項6に記載の分布帰還型半導体発光装置。
- 前記上部クラッド層と前記リッジとの間に上部バッファ層が形成されるとともに、前記リッジの両側面と前記上部バッファ層との間に溝が形成され、該溝の幅が0を超えて200nm以下、深さの中央部分の位置で前記溝の側面が前記基板の面に対して90°±10°の角度を有する請求項6に記載の分布帰還型半導体発光装置。
- 前記溝が前記上部バッファ層の厚さの全体または一部の厚さに形成された請求項8記載の半分布帰還型導体発光装置。
- 前記半導体基板がn型InP、前記下部クラッド層がn型InGaAsP、前記活性層がInGaAsP、前記上部クラッド層がInGaAsPである請求項6記載の半導体発光装置。
- 前記半導体基板がn型InP、前記下部クラッド層がn型InGaAlAs、前記活性層がInGaAlAs、前記上部クラッド層がInGaAlAsである請求項6記載の半導体発光装置。
- 前記半導体基板がn型GaAs、前記下部クラッド層がn型AlGaInP、前記活性層がAlGaInPとGaInP、前記上部クラッド層がp型AlGaInPである請求項6記載の半導体発光装置。
- 半導体発光装置と、該半導体発光装置の発生する光を通過させる導波路と、該導波路を通過した光を与えられる電圧信号により変調する変調器とから構成され、半導体基板上にカスケードに配置された集積型半導体光導波路素子であって、
前記基板上に設けられた各要素は前記基板上に、下部クラッド層、多重量子井戸活性層および上部クラッド層の3層構造、導波路下部クラッド層、導波路コアおよび導波路上部クラッド層の3層構造、光変調器下部クラッド層、光変調器コア層および光変調器上部クラッド層の3層構造、をそれぞれ備えて、互いに隣接して配置されるとともに、前記半導体発光装置の多重量子井戸活性層、前記導波路コアおよび前記変調器の光変調器コア層が、それぞれ、実質的に同一の面に位置するように形成され、且つ、各要素はそれぞれの最上層の上にリッジを形成され、
前記導波路コアのリッジの幅は、隣接する前記半導体発光装置のリッジの幅と前記変調器の幅とをテーパーで結合する形状となっていることを特徴とする集積型半導体光導波路素子。 - 前記半導体発光装置のリッジの幅と前記変調器の幅は、前記変調器の幅に対して前記半導体発光装置のリッジの幅が、1.1倍から3倍である請求項13記載の集積型半導体光導波路素子。
- 前記基板上に設けられた半導体発光装置は、前記上部クラッド層と前記リッジとの間に上部バッファ層が形成されるとともに、前記リッジの両側面と前記上部バッファ層との間に溝が形成され、該溝の幅が0を超えて20nm以下、深さの中央部分の位置で前記溝の側面が前記基板の面に対して90°±10°の角度を有する請求項13記載の集積型半導体光導波路素子。
- 前記溝が前記上部バッファ層の厚さの全体または一部の厚さに形成された請求項15記載の集積型半導体光導波路素子。
- 前記半導体発光装置の前記リッジが前記上部バッファ層上に形成された下スペーサ層と、回折格子層と、上スペーサ層と、コンタクト層とを有する分布帰還型半導体発光装置とされた請求項13に記載の集積型半導体光導波路素子。
- 前記半導体基板がn型InP、前記下部クラッド層がn型InGaAsP、前記多重量子井戸活性層がInGaAsP、前記上部クラッド層がp型InGaAsP、前記導波路下部クラッド層がInGaAsP、前記導波路コアがInGaAsP、前記導波路上部クラッド層がInGaAsP、前記光変調器下部クラッド層がn型InGaAlAs、前期光変調器コア層がInGaAlAs多重量子井戸および光変調器上部クラッド層がp型InGaAlAsである請求項13に記載の集積型半導体光導波路素子。
- 前記半導体基板がn型InP、前記下部クラッド層がn型InGaAlAs、前記多重量子井戸活性層がInGaAlAs、前記上部クラッド層がp型InGaAlAs、前記導波路下部クラッド層がInGaAsP、前記導波路コアがInGaAsP、前記導波路上部クラッド層がInGaAsP、前記光変調器下部クラッド層がn型InGaAlAs、前期光変調器コア層がInGaAlAs多重量子井戸および光変調器上部クラッド層がp型InGaAlAsである請求項13に記載の集積型半導体光導波路素子。
- 前記基板上に設けられた前記変調器はマッハ−ツェンダ型光変調器とされた請求項13に記載の集積型半導体光導波路素子。
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2009094410A (ja) * | 2007-10-11 | 2009-04-30 | Nippon Telegr & Teleph Corp <Ntt> | 半導体光集積素子及びその作製方法 |
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JP2010283104A (ja) * | 2009-06-04 | 2010-12-16 | Nippon Telegr & Teleph Corp <Ntt> | 光半導体装置 |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09307182A (ja) * | 1996-05-20 | 1997-11-28 | Mitsubishi Electric Corp | リッジ型半導体レーザおよびその製造方法 |
JP2001230493A (ja) * | 2000-02-21 | 2001-08-24 | Sony Corp | 半導体レーザ発光装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2724050B1 (fr) | 1994-08-31 | 1997-01-10 | Alcatel Nv | Procede d'alignement d'un ruban enterre et d'un ruban externe dans un composant optique semiconducteur |
JPH11112081A (ja) * | 1997-10-01 | 1999-04-23 | Mitsubishi Electric Corp | 半導体レーザ,及びその製造方法 |
JP2000066046A (ja) | 1998-08-21 | 2000-03-03 | Hitachi Ltd | 光伝送装置 |
JP2002134826A (ja) | 2001-10-26 | 2002-05-10 | Hitachi Ltd | 半導体光集積素子 |
JP2004186259A (ja) * | 2002-11-29 | 2004-07-02 | Toshiba Corp | 半導体レーザ素子、その製造方法、および多波長集積化半導体レーザ装置 |
JP4433672B2 (ja) | 2002-12-27 | 2010-03-17 | 住友電気工業株式会社 | 半導体光素子の製造方法 |
JP2004226769A (ja) | 2003-01-24 | 2004-08-12 | Hitachi Ltd | 光送信装置 |
JP4244671B2 (ja) | 2003-03-24 | 2009-03-25 | 株式会社日立製作所 | 光送信装置 |
JP4243506B2 (ja) | 2003-04-03 | 2009-03-25 | 株式会社日立製作所 | 半導体レーザ及びそれを用いた光モジュール |
-
2006
- 2006-02-22 JP JP2006044887A patent/JP4977377B2/ja active Active
-
2007
- 2007-02-07 US US11/703,159 patent/US7463663B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09307182A (ja) * | 1996-05-20 | 1997-11-28 | Mitsubishi Electric Corp | リッジ型半導体レーザおよびその製造方法 |
JP2001230493A (ja) * | 2000-02-21 | 2001-08-24 | Sony Corp | 半導体レーザ発光装置 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009094410A (ja) * | 2007-10-11 | 2009-04-30 | Nippon Telegr & Teleph Corp <Ntt> | 半導体光集積素子及びその作製方法 |
JP2010087270A (ja) * | 2008-09-30 | 2010-04-15 | Shin Etsu Handotai Co Ltd | 発光素子 |
JP2010232372A (ja) * | 2009-03-26 | 2010-10-14 | Furukawa Electric Co Ltd:The | 集積型半導体光素子の製造方法および集積型半導体光素子 |
JP2010283104A (ja) * | 2009-06-04 | 2010-12-16 | Nippon Telegr & Teleph Corp <Ntt> | 光半導体装置 |
US8526478B2 (en) | 2010-06-10 | 2013-09-03 | Mitsubishi Electric Corporation | Semiconductor optical integrated element |
JP2011258810A (ja) * | 2010-06-10 | 2011-12-22 | Mitsubishi Electric Corp | 半導体光集積素子及びその製造方法 |
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JP2016115853A (ja) * | 2014-12-16 | 2016-06-23 | Nttエレクトロニクス株式会社 | 半導体リッジレーザ素子及び製造方法 |
WO2018079112A1 (ja) * | 2016-10-27 | 2018-05-03 | 三菱電機株式会社 | 半導体光導波路及び光集積素子 |
JP6324645B1 (ja) * | 2016-10-27 | 2018-05-16 | 三菱電機株式会社 | 半導体光導波路及び光集積素子 |
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JP7182814B2 (ja) | 2018-12-28 | 2022-12-05 | 南京郵電大学 | ホモ集積の赤外線フォトニックチップ及びその製造方法 |
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