JP2007227341A5 - - Google Patents

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Publication number
JP2007227341A5
JP2007227341A5 JP2006205935A JP2006205935A JP2007227341A5 JP 2007227341 A5 JP2007227341 A5 JP 2007227341A5 JP 2006205935 A JP2006205935 A JP 2006205935A JP 2006205935 A JP2006205935 A JP 2006205935A JP 2007227341 A5 JP2007227341 A5 JP 2007227341A5
Authority
JP
Japan
Prior art keywords
main body
guide member
small holes
contacts
spiral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006205935A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007227341A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006205935A priority Critical patent/JP2007227341A/ja
Priority claimed from JP2006205935A external-priority patent/JP2007227341A/ja
Priority to TW096102834A priority patent/TW200810268A/zh
Priority to KR1020087018735A priority patent/KR20080081205A/ko
Priority to PCT/JP2007/051349 priority patent/WO2007086549A1/ja
Priority to CN2007800124356A priority patent/CN101416361B/zh
Publication of JP2007227341A publication Critical patent/JP2007227341A/ja
Publication of JP2007227341A5 publication Critical patent/JP2007227341A5/ja
Priority to US12/181,698 priority patent/US20090021924A1/en
Withdrawn legal-status Critical Current

Links

JP2006205935A 2006-01-30 2006-07-28 ガイド部材及びガイド部材を備えた接続ボード並びにガイド部材の製造方法 Withdrawn JP2007227341A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2006205935A JP2007227341A (ja) 2006-01-30 2006-07-28 ガイド部材及びガイド部材を備えた接続ボード並びにガイド部材の製造方法
TW096102834A TW200810268A (en) 2006-01-30 2007-01-25 Guide member, connecting board with guide member, and method for manufacturing guide member
KR1020087018735A KR20080081205A (ko) 2006-01-30 2007-01-29 가이드 부재 및 가이드 부재를 구비한 접속 보드 그리고가이드 부재의 제조 방법
PCT/JP2007/051349 WO2007086549A1 (ja) 2006-01-30 2007-01-29 ガイド部材及びガイド部材を備えた接続ボード並びにガイド部材の製造方法
CN2007800124356A CN101416361B (zh) 2006-01-30 2007-01-29 导向构件及其制造方法以及具备导向构件的连接插板
US12/181,698 US20090021924A1 (en) 2006-01-30 2008-07-29 Guide member, connection board having guide member, and manufacturing method of guide member

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006020382 2006-01-30
JP2006205935A JP2007227341A (ja) 2006-01-30 2006-07-28 ガイド部材及びガイド部材を備えた接続ボード並びにガイド部材の製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2007192292A Division JP4616314B2 (ja) 2006-01-30 2007-07-24 接続ボード
JP2007192282A Division JP4065898B2 (ja) 2006-01-30 2007-07-24 接続ボード

Publications (2)

Publication Number Publication Date
JP2007227341A JP2007227341A (ja) 2007-09-06
JP2007227341A5 true JP2007227341A5 (enExample) 2008-01-17

Family

ID=38309326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006205935A Withdrawn JP2007227341A (ja) 2006-01-30 2006-07-28 ガイド部材及びガイド部材を備えた接続ボード並びにガイド部材の製造方法

Country Status (6)

Country Link
US (1) US20090021924A1 (enExample)
JP (1) JP2007227341A (enExample)
KR (1) KR20080081205A (enExample)
CN (1) CN101416361B (enExample)
TW (1) TW200810268A (enExample)
WO (1) WO2007086549A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4065898B2 (ja) * 2006-01-30 2008-03-26 アルプス電気株式会社 接続ボード
JP4895979B2 (ja) * 2007-11-06 2012-03-14 日本航空電子工業株式会社 コネクタ
US8896403B2 (en) 2009-10-19 2014-11-25 Exscitron Gmbh Inductive electronic module and use thereof
DE102010014281A1 (de) * 2010-04-08 2011-10-13 Exscitron Gmbh Induktive elektronische Baugruppe und Verwendung einer solchen
JP6063145B2 (ja) * 2012-04-27 2017-01-18 本田技研工業株式会社 半導体チップの通電検査装置
KR101955194B1 (ko) * 2012-10-26 2019-03-08 (주)테크윙 테스트핸들러용 인서트
JP6341634B2 (ja) 2013-05-28 2018-06-13 新光電気工業株式会社 プローブガイド板及びその製造方法、半導体検査装置
KR102355016B1 (ko) * 2014-12-11 2022-01-25 엘지이노텍 주식회사 이미지 센서의 각도 조절이 가능한 카메라 모듈
TWI583963B (zh) * 2016-04-18 2017-05-21 旺矽科技股份有限公司 探針卡
US10187634B2 (en) 2016-08-12 2019-01-22 Avegant Corp. Near-eye display system including a modulation stack
JP7084738B2 (ja) * 2018-02-14 2022-06-15 川崎重工業株式会社 実装装置及び実装方法
TWI767860B (zh) * 2021-10-27 2022-06-11 福懋科技股份有限公司 封裝陣列基板的測試裝置及其測試方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60112090U (ja) * 1983-12-29 1985-07-29 磐田電工株式会社 デバイス用ソケツト
JP3674300B2 (ja) * 1998-03-16 2005-07-20 Ｊｓｒ株式会社 半導体素子検査装置および検査方法
JPWO2003007435A1 (ja) * 2001-07-13 2004-11-04 日本発条株式会社 コンタクタ
JP2003168100A (ja) * 2001-12-03 2003-06-13 Matsushita Electric Ind Co Ltd カード端末装置
JP2005134373A (ja) * 2003-10-09 2005-05-26 Alps Electric Co Ltd スパイラル接触子を用いた接続装置
JP3971749B2 (ja) * 2004-01-21 2007-09-05 株式会社アドバンストシステムズジャパン 凸型スパイラルコンタクタおよびその製造方法
JP2005349463A (ja) * 2004-06-14 2005-12-22 Toyota Auto Body Co Ltd 筋状凹凸成形方法および同筋状凹凸成形方法によって製造される燃料電池用のメタルセパレータ

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