JP2011527106A5 - - Google Patents

Download PDF

Info

Publication number
JP2011527106A5
JP2011527106A5 JP2011516380A JP2011516380A JP2011527106A5 JP 2011527106 A5 JP2011527106 A5 JP 2011527106A5 JP 2011516380 A JP2011516380 A JP 2011516380A JP 2011516380 A JP2011516380 A JP 2011516380A JP 2011527106 A5 JP2011527106 A5 JP 2011527106A5
Authority
JP
Japan
Prior art keywords
liquid
surface region
structured surface
recessed features
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011516380A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011527106A (ja
JP5319769B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2009/045120 external-priority patent/WO2010002519A1/en
Publication of JP2011527106A publication Critical patent/JP2011527106A/ja
Publication of JP2011527106A5 publication Critical patent/JP2011527106A5/ja
Application granted granted Critical
Publication of JP5319769B2 publication Critical patent/JP5319769B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011516380A 2008-06-30 2009-05-26 パターン形成された基板の形成方法 Expired - Fee Related JP5319769B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7673608P 2008-06-30 2008-06-30
US61/076,736 2008-06-30
PCT/US2009/045120 WO2010002519A1 (en) 2008-06-30 2009-05-26 Method of forming a patterned substrate

Publications (3)

Publication Number Publication Date
JP2011527106A JP2011527106A (ja) 2011-10-20
JP2011527106A5 true JP2011527106A5 (enExample) 2012-07-12
JP5319769B2 JP5319769B2 (ja) 2013-10-16

Family

ID=40984776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011516380A Expired - Fee Related JP5319769B2 (ja) 2008-06-30 2009-05-26 パターン形成された基板の形成方法

Country Status (6)

Country Link
US (1) US8652345B2 (enExample)
EP (1) EP2311301B1 (enExample)
JP (1) JP5319769B2 (enExample)
CN (1) CN102124825B (enExample)
AT (1) ATE555643T1 (enExample)
WO (1) WO2010002519A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8941395B2 (en) 2010-04-27 2015-01-27 3M Innovative Properties Company Integrated passive circuit elements for sensing devices
CN103069365B (zh) 2010-06-11 2017-01-18 3M创新有限公司 包括力测量的定位触摸传感器
JP6005517B2 (ja) 2010-10-22 2016-10-12 ソニー株式会社 パターン基体およびその製造方法ならびに情報入力装置および表示装置
DE102011088793A1 (de) * 2011-12-16 2013-06-20 Tyco Electronics Amp Gmbh Elektrischer Steckverbinder mit mikrostrukturiertem Kontaktelement
WO2013119223A1 (en) * 2012-02-08 2013-08-15 Empire Technology Development Llc Flexible, expandable, patterned electrode with non-conducting substrate
US9360971B2 (en) 2012-02-10 2016-06-07 3M Innovative Properties Company Mesh patterns for touch sensor electrodes
KR102157170B1 (ko) * 2012-12-20 2020-09-18 쓰리엠 이노베이티브 프로퍼티즈 캄파니 후속 처리 동안 정확한 정합을 달성하기 위한 복수의 잉크의 인쇄
WO2014201414A1 (en) * 2013-06-14 2014-12-18 The Trustees Of Dartmouth College Methods for fabricating magnetic devices and associated systems and devices
KR102203104B1 (ko) * 2014-06-05 2021-01-15 삼성디스플레이 주식회사 플렉서블 디스플레이 장치
CN104311873B (zh) * 2014-09-04 2015-12-02 比亚迪股份有限公司 掺杂的氧化锡的应用及聚合物组合物和成型体及油墨组合物和表面金属化方法
CN108139626B (zh) * 2015-10-12 2021-08-10 3M创新有限公司 多模式显示器
WO2019018585A1 (en) * 2017-07-18 2019-01-24 Q Umbono Llc MULTILAYER LENS AND MANUFACTURE THEREOF
JP7765965B2 (ja) * 2021-03-19 2025-11-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置、および、ポリマー含有液
KR102778664B1 (ko) * 2021-03-19 2025-03-12 가부시키가이샤 스크린 홀딩스 기판 처리 방법, 기판 처리 장치, 및, 폴리머 함유액
JP2024039850A (ja) * 2022-09-12 2024-03-25 Ａｇｃ株式会社 ガラス成形装置

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3322053A (en) * 1964-04-30 1967-05-30 Minnesota Mining & Mfg Treating surfaces with fluids
JPS51126344A (en) * 1975-04-28 1976-11-04 Mitsubishi Electric Corp Etching method
JPS63288045A (ja) * 1987-05-20 1988-11-25 Hitachi Ltd 半導体装置の製造方法
US5137542A (en) 1990-08-08 1992-08-11 Minnesota Mining And Manufacturing Company Abrasive printed with an electrically conductive ink
US5254390B1 (en) * 1990-11-15 1999-05-18 Minnesota Mining & Mfg Plano-convex base sheet for retroreflective articles
US5137611A (en) * 1991-11-01 1992-08-11 Armco Inc. Electrolytic plating one surface of conductive sheet
US5300263A (en) * 1992-10-28 1994-04-05 Minnesota Mining And Manufacturing Company Method of making a microlens array and mold
US5439621A (en) * 1993-04-12 1995-08-08 Minnesota Mining And Manufacturing Company Method of making an array of variable focal length microlenses
JP3092896B2 (ja) * 1993-09-28 2000-09-25 シャープ株式会社 液晶表示素子及びその製造方法
TW291543B (enExample) * 1993-09-28 1996-11-21 Sharp Kk
US5382317A (en) * 1994-02-18 1995-01-17 Minnesota Mining And Manufacturing Company Method of selectively applying a coating to a bilevel substrate
US5917664A (en) * 1996-02-05 1999-06-29 3M Innovative Properties Company Brightness enhancement film with soft cutoff
US5825543A (en) * 1996-02-29 1998-10-20 Minnesota Mining And Manufacturing Company Diffusely reflecting polarizing element including a first birefringent phase and a second phase
US5970374A (en) * 1996-10-18 1999-10-19 Chartered Semiconductor Manufacturing Ltd. Method for forming contacts and vias with improved barrier metal step-coverage
US6280063B1 (en) * 1997-05-09 2001-08-28 3M Innovative Properties Company Brightness enhancement article
US6431695B1 (en) * 1998-06-18 2002-08-13 3M Innovative Properties Company Microstructure liquid dispenser
US6290685B1 (en) * 1998-06-18 2001-09-18 3M Innovative Properties Company Microchanneled active fluid transport devices
US6375871B1 (en) * 1998-06-18 2002-04-23 3M Innovative Properties Company Methods of manufacturing microfluidic articles
US6077560A (en) * 1997-12-29 2000-06-20 3M Innovative Properties Company Method for continuous and maskless patterning of structured substrates
EP1975649A1 (en) * 1998-02-18 2008-10-01 Minnesota Mining And Manufacturing Company Optical film
WO1999055537A1 (en) * 1998-04-29 1999-11-04 3M Innovative Properties Company Receptor sheet for inkjet printing having an embossed surface
US6037005A (en) * 1998-05-12 2000-03-14 3M Innovative Properties Company Display substrate electrodes with auxiliary metal layers for enhanced conductivity
US6495200B1 (en) * 1998-12-07 2002-12-17 Chartered Semiconductor Manufacturing Ltd. Method to deposit a seeding layer for electroless copper plating
CN1170693C (zh) * 1999-06-01 2004-10-13 3M创新有限公司 喷墨接受介质及其制法、成象喷墨接受介质、图象的制法
WO2000073082A1 (en) * 1999-06-01 2000-12-07 3M Innovative Properties Company Random microembossed receptor media
US7223364B1 (en) * 1999-07-07 2007-05-29 3M Innovative Properties Company Detection article having fluid control film
US6451191B1 (en) * 1999-11-18 2002-09-17 3M Innovative Properties Company Film based addressable programmable electronic matrix articles and methods of manufacturing and using the same
US6632343B1 (en) * 2000-08-30 2003-10-14 Micron Technology, Inc. Method and apparatus for electrolytic plating of surface metals
JP4232336B2 (ja) * 2000-11-22 2009-03-04 株式会社デンソー 半導体ウエハの表面処理方法
US7244669B2 (en) * 2001-05-23 2007-07-17 Plastic Logic Limited Patterning of devices
JP2003100950A (ja) * 2001-06-06 2003-04-04 Japan Science & Technology Corp 粉体集合体からなるパターンの製造方法
GB2379083A (en) * 2001-08-20 2003-02-26 Seiko Epson Corp Inkjet printing on a substrate using two immiscible liquids
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
RU2230391C2 (ru) 2002-03-21 2004-06-10 Открытое акционерное общество "НИИ молекулярной электроники и завод "Микрон" Способ изготовления самосовмещенной встроенной медной металлизации интегральных схем
JP2004006628A (ja) * 2002-03-27 2004-01-08 Hitachi Ltd 半導体装置の製造方法
US7105809B2 (en) * 2002-11-18 2006-09-12 3M Innovative Properties Company Microstructured polymeric substrate
US7245435B2 (en) 2002-12-16 2007-07-17 3M Innovative Properties Company Lens array sheet and molding method
JP2005012173A (ja) * 2003-05-28 2005-01-13 Seiko Epson Corp 膜パターン形成方法、デバイス及びデバイスの製造方法、電気光学装置、並びに電子機器
WO2005041217A1 (ja) * 2003-10-28 2005-05-06 Sumitomo Metal Mining Co., Ltd. 透明導電積層体とその製造方法及び透明導電積層体を用いたデバイス
US20050106360A1 (en) * 2003-11-13 2005-05-19 Johnston Raymond P. Microstructured surface building assemblies for fluid disposition
US7435074B2 (en) * 2004-03-13 2008-10-14 International Business Machines Corporation Method for fabricating dual damascence structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascence patterning
JP4740618B2 (ja) * 2004-04-01 2011-08-03 協立化学産業株式会社 磁場を用いたパターン形成方法および電子装置の製造方法
US7732334B2 (en) * 2004-08-23 2010-06-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7160583B2 (en) * 2004-12-03 2007-01-09 3M Innovative Properties Company Microfabrication using patterned topography and self-assembled monolayers
US7384173B2 (en) * 2004-12-30 2008-06-10 3M Innovative Properties Company Brightness enhancement article
JPWO2006100790A1 (ja) * 2005-03-22 2008-08-28 クラスターテクノロジー株式会社 配線基板の製造方法及び配線基板
JP4237184B2 (ja) * 2005-03-31 2009-03-11 エルピーダメモリ株式会社 半導体装置の製造方法
US20070024994A1 (en) 2005-07-29 2007-02-01 3M Innovative Properties Company Structured optical film with interspersed pyramidal structures
US7777832B2 (en) * 2005-11-18 2010-08-17 3M Innovative Properties Company Multi-function enhancement film
US20070134784A1 (en) * 2005-12-09 2007-06-14 Halverson Kurt J Microreplicated microarrays
US20070231541A1 (en) * 2006-03-31 2007-10-04 3M Innovative Properties Company Microstructured tool and method of making same using laser ablation
EP2232327A1 (en) * 2007-12-14 2010-09-29 3M Innovative Properties Company Methods for making electronic devices
EP2304078B1 (en) 2008-06-30 2015-04-15 3M Innovative Properties Company Method of forming a microstructure

Similar Documents

Publication Publication Date Title
JP2011527106A5 (enExample)
JP2010512261A5 (enExample)
JP2008528426A5 (enExample)
JP2008522038A5 (enExample)
JP2010507261A5 (enExample)
JP2009260173A5 (enExample)
JP2013508254A5 (enExample)
JP2009521675A5 (enExample)
JP2013532365A5 (enExample)
WO2015053833A3 (en) High temperature additive manufacturing for organic matrix composites
JP2010503205A5 (enExample)
JP2011526833A5 (enExample)
JP2011100877A5 (enExample)
TW200620512A (en) Electroform spring built on mandrel transferable to other surface
WO2008091279A3 (en) Etching and hole arrays
JP2009094457A5 (enExample)
JP2010082857A5 (enExample)
JP2012531518A5 (enExample)
TWI456271B (zh) 線柵偏光板及其製造方法
JP2008509528A5 (enExample)
WO2012061753A3 (en) Nanoimprint lithography formation of functional nanoparticles using dual release layers
WO2009086230A3 (en) Activation solution for electroless plating on dielectric layers
JP2010036194A5 (enExample)
JP2009508700A5 (enExample)
WO2011011140A3 (en) Method and materials for double patterning