JP5319769B2 - パターン形成された基板の形成方法 - Google Patents
パターン形成された基板の形成方法 Download PDFInfo
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- JP5319769B2 JP5319769B2 JP2011516380A JP2011516380A JP5319769B2 JP 5319769 B2 JP5319769 B2 JP 5319769B2 JP 2011516380 A JP2011516380 A JP 2011516380A JP 2011516380 A JP2011516380 A JP 2011516380A JP 5319769 B2 JP5319769 B2 JP 5319769B2
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Micromachines (AREA)
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| US7673608P | 2008-06-30 | 2008-06-30 | |
| US61/076,736 | 2008-06-30 | ||
| PCT/US2009/045120 WO2010002519A1 (en) | 2008-06-30 | 2009-05-26 | Method of forming a patterned substrate |
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| JP2011527106A JP2011527106A (ja) | 2011-10-20 |
| JP2011527106A5 JP2011527106A5 (enExample) | 2012-07-12 |
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| WO (1) | WO2010002519A1 (enExample) |
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| US8941395B2 (en) | 2010-04-27 | 2015-01-27 | 3M Innovative Properties Company | Integrated passive circuit elements for sensing devices |
| KR20130109090A (ko) | 2010-06-11 | 2013-10-07 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 힘 측정을 갖는 포지셔널 터치 센서 |
| CN103155725B (zh) * | 2010-10-22 | 2016-07-06 | 索尼公司 | 图案基板、图案基板的制造方法、信息输入装置和显示装置 |
| DE102011088793A1 (de) * | 2011-12-16 | 2013-06-20 | Tyco Electronics Amp Gmbh | Elektrischer Steckverbinder mit mikrostrukturiertem Kontaktelement |
| US20130199916A1 (en) * | 2012-02-08 | 2013-08-08 | Empire Technology Development Llc | Elongational structures |
| KR20140129134A (ko) | 2012-02-10 | 2014-11-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 터치 센서 전극용 메시 패턴 |
| SG11201504816WA (en) | 2012-12-20 | 2015-07-30 | 3M Innovative Properties Co | Printing of multiple inks to achieve precision registration during subsequent processing |
| WO2014201414A1 (en) * | 2013-06-14 | 2014-12-18 | The Trustees Of Dartmouth College | Methods for fabricating magnetic devices and associated systems and devices |
| KR102203104B1 (ko) * | 2014-06-05 | 2021-01-15 | 삼성디스플레이 주식회사 | 플렉서블 디스플레이 장치 |
| CN104311873B (zh) * | 2014-09-04 | 2015-12-02 | 比亚迪股份有限公司 | 掺杂的氧化锡的应用及聚合物组合物和成型体及油墨组合物和表面金属化方法 |
| WO2017066020A1 (en) * | 2015-10-12 | 2017-04-20 | 3M Innovative Properties Company | Multi-mode display |
| WO2019018585A1 (en) * | 2017-07-18 | 2019-01-24 | Q Umbono Llc | MULTILAYER LENS AND MANUFACTURE THEREOF |
| KR102778664B1 (ko) * | 2021-03-19 | 2025-03-12 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 방법, 기판 처리 장치, 및, 폴리머 함유액 |
| JP7765965B2 (ja) * | 2021-03-19 | 2025-11-07 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法、基板処理装置、および、ポリマー含有液 |
| JP2024039850A (ja) * | 2022-09-12 | 2024-03-25 | Ａｇｃ株式会社 | ガラス成形装置 |
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| US3322053A (en) | 1964-04-30 | 1967-05-30 | Minnesota Mining & Mfg | Treating surfaces with fluids |
| JPS51126344A (en) * | 1975-04-28 | 1976-11-04 | Mitsubishi Electric Corp | Etching method |
| JPS63288045A (ja) * | 1987-05-20 | 1988-11-25 | Hitachi Ltd | 半導体装置の製造方法 |
| US5137542A (en) | 1990-08-08 | 1992-08-11 | Minnesota Mining And Manufacturing Company | Abrasive printed with an electrically conductive ink |
| US5254390B1 (en) | 1990-11-15 | 1999-05-18 | Minnesota Mining & Mfg | Plano-convex base sheet for retroreflective articles |
| US5137611A (en) | 1991-11-01 | 1992-08-11 | Armco Inc. | Electrolytic plating one surface of conductive sheet |
| US5300263A (en) | 1992-10-28 | 1994-04-05 | Minnesota Mining And Manufacturing Company | Method of making a microlens array and mold |
| US5439621A (en) | 1993-04-12 | 1995-08-08 | Minnesota Mining And Manufacturing Company | Method of making an array of variable focal length microlenses |
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| JP3092896B2 (ja) * | 1993-09-28 | 2000-09-25 | シャープ株式会社 | 液晶表示素子及びその製造方法 |
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| US5825543A (en) | 1996-02-29 | 1998-10-20 | Minnesota Mining And Manufacturing Company | Diffusely reflecting polarizing element including a first birefringent phase and a second phase |
| US5970374A (en) * | 1996-10-18 | 1999-10-19 | Chartered Semiconductor Manufacturing Ltd. | Method for forming contacts and vias with improved barrier metal step-coverage |
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| US6375871B1 (en) | 1998-06-18 | 2002-04-23 | 3M Innovative Properties Company | Methods of manufacturing microfluidic articles |
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| US6431695B1 (en) | 1998-06-18 | 2002-08-13 | 3M Innovative Properties Company | Microstructure liquid dispenser |
| US6077560A (en) * | 1997-12-29 | 2000-06-20 | 3M Innovative Properties Company | Method for continuous and maskless patterning of structured substrates |
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-
2009
- 2009-05-26 CN CN200980132086.0A patent/CN102124825B/zh not_active Expired - Fee Related
- 2009-05-26 US US13/000,828 patent/US8652345B2/en not_active Expired - Fee Related
- 2009-05-26 EP EP09773971A patent/EP2311301B1/en not_active Not-in-force
- 2009-05-26 WO PCT/US2009/045120 patent/WO2010002519A1/en not_active Ceased
- 2009-05-26 JP JP2011516380A patent/JP5319769B2/ja not_active Expired - Fee Related
- 2009-05-26 AT AT09773971T patent/ATE555643T1/de active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010002519A1 (en) | 2010-01-07 |
| EP2311301A1 (en) | 2011-04-20 |
| US8652345B2 (en) | 2014-02-18 |
| US20110100957A1 (en) | 2011-05-05 |
| EP2311301B1 (en) | 2012-04-25 |
| CN102124825B (zh) | 2014-04-30 |
| ATE555643T1 (de) | 2012-05-15 |
| JP2011527106A (ja) | 2011-10-20 |
| CN102124825A (zh) | 2011-07-13 |
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