JP2012531518A5 - - Google Patents

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Publication number
JP2012531518A5
JP2012531518A5 JP2012517584A JP2012517584A JP2012531518A5 JP 2012531518 A5 JP2012531518 A5 JP 2012531518A5 JP 2012517584 A JP2012517584 A JP 2012517584A JP 2012517584 A JP2012517584 A JP 2012517584A JP 2012531518 A5 JP2012531518 A5 JP 2012531518A5
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JP
Japan
Prior art keywords
substrate
self
assembled monolayer
patterned region
metal
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JP2012517584A
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English (en)
Japanese (ja)
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JP6128847B2 (ja
JP2012531518A (ja
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Priority claimed from PCT/US2010/038942 external-priority patent/WO2010151471A1/en
Publication of JP2012531518A publication Critical patent/JP2012531518A/ja
Publication of JP2012531518A5 publication Critical patent/JP2012531518A5/ja
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Publication of JP6128847B2 publication Critical patent/JP6128847B2/ja
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JP2012517584A 2009-06-25 2010-06-17 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品 Active JP6128847B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22040709P 2009-06-25 2009-06-25
US61/220,407 2009-06-25
PCT/US2010/038942 WO2010151471A1 (en) 2009-06-25 2010-06-17 Methods of wet etching a self-assembled monolayer patterned substrate and metal patterned articles

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015137927A Division JP6399975B2 (ja) 2009-06-25 2015-07-09 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品

Publications (3)

Publication Number Publication Date
JP2012531518A JP2012531518A (ja) 2012-12-10
JP2012531518A5 true JP2012531518A5 (enExample) 2013-07-25
JP6128847B2 JP6128847B2 (ja) 2017-05-17

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ID=42710497

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2012517584A Active JP6128847B2 (ja) 2009-06-25 2010-06-17 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品
JP2015137927A Expired - Fee Related JP6399975B2 (ja) 2009-06-25 2015-07-09 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品
JP2017050042A Withdrawn JP2017166070A (ja) 2009-06-25 2017-03-15 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2015137927A Expired - Fee Related JP6399975B2 (ja) 2009-06-25 2015-07-09 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品
JP2017050042A Withdrawn JP2017166070A (ja) 2009-06-25 2017-03-15 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品

Country Status (5)

Country Link
US (1) US8647522B2 (enExample)
EP (1) EP2446067B1 (enExample)
JP (3) JP6128847B2 (enExample)
CN (1) CN102803562B (enExample)
WO (1) WO2010151471A1 (enExample)

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CN102334091B (zh) 2009-02-26 2016-01-06 3M创新有限公司 触摸屏传感器和具有低可见度的覆盖微图案的图案化基材
JP5747027B2 (ja) 2009-06-30 2015-07-08 スリーエム イノベイティブ プロパティズ カンパニー 図形を有する電子ディスプレイ及び金属微小パターン化基材
US8950324B2 (en) 2009-12-22 2015-02-10 3M Innovative Properties Company Apparatus and method for microcontact printing using a pressurized roller
JP2014501465A (ja) 2010-12-16 2014-01-20 スリーエム イノベイティブ プロパティズ カンパニー 透明な微小パターン化ｒｆｉｄアンテナ及びそれを包含する物品
CN103842553B (zh) 2011-09-30 2016-04-27 3M创新有限公司 图案化的基底的连续湿法蚀刻方法
EP3065951B1 (en) 2013-11-06 2019-07-31 3M Innovative Properties Company Microcontact printing stamps with functional features
WO2015126372A1 (en) * 2014-02-19 2015-08-27 Uni-Pixel Displays, Inc. Method of passivating a conductive pattern with self-assembling monolayers
US9232661B1 (en) 2014-09-22 2016-01-05 International Business Machines Corporation Magnetically controllable fluidic etching process
CN104538138B (zh) * 2014-12-30 2017-12-29 南京萨特科技发展有限公司 精密贴片电阻器的制作方法
CN104630773B (zh) * 2015-03-07 2017-01-18 宋彦震 一种全自动pcb板腐蚀箱
CN106455348A (zh) * 2016-11-29 2017-02-22 福建农林大学 Pcb板升降腐蚀机及使用方法
CN107833827B (zh) * 2017-10-25 2020-07-31 武汉华星光电技术有限公司 一种阵列基板的刻蚀方法
JP7368264B2 (ja) * 2019-02-20 2023-10-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び基板処理方法
CN113463099B (zh) * 2020-03-31 2023-08-29 长沙韶光铬版有限公司 一种银的细微图形化蚀刻方法
FR3110716B1 (fr) * 2020-05-19 2022-04-29 Commissariat Energie Atomique Procede de fabrication de moules pour lithographie par nano-impression
CN116683283A (zh) * 2023-05-30 2023-09-01 中国科学院半导体研究所 半导体激光器湿法腐蚀方法及其装置

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US1313233A (en) * 1919-08-12 Ernest grass
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US3483049A (en) * 1965-12-20 1969-12-09 Teletype Corp Method of froth etching
US3565707A (en) * 1969-03-03 1971-02-23 Fmc Corp Metal dissolution
DE2030304C3 (de) * 1970-06-19 1981-06-19 Walter 6983 Kreuzwertheim Lemmen Verfahren zum Ätzen von Metall
DE2353936A1 (de) * 1973-10-27 1975-05-07 Rudolf Schmidt Verfahren und vorrichtung zur verbesserung und/oder beschleunigung chemischer vorgaenge in fluessigkeiten und baedern
US4602184A (en) * 1984-10-29 1986-07-22 Ford Motor Company Apparatus for applying high frequency ultrasonic energy to cleaning and etching solutions
JPS61133390A (ja) * 1984-12-03 1986-06-20 Hitachi Cable Ltd めつきされた金の剥離方法
JPS61207584A (ja) * 1985-03-11 1986-09-13 Sumitomo Electric Ind Ltd 回路基板の製造方法
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US6518168B1 (en) 1995-08-18 2003-02-11 President And Fellows Of Harvard College Self-assembled monolayer directed patterning of surfaces
US7045195B2 (en) * 2000-10-16 2006-05-16 Governing Council Of The University Of Toronto Composite materials having substrates with self-assembled colloidal crystalline patterns thereon
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KR20070092219A (ko) * 2004-12-06 2007-09-12 코닌클리케 필립스 일렉트로닉스 엔.브이. 에칭 용액 및 이를 위한 첨가제
JP4528164B2 (ja) * 2005-03-11 2010-08-18 関東化学株式会社 エッチング液組成物
US8192795B2 (en) * 2006-06-28 2012-06-05 Northwestern University Etching and hole arrays
US8764996B2 (en) 2006-10-18 2014-07-01 3M Innovative Properties Company Methods of patterning a material on polymeric substrates
JP2011517367A (ja) 2008-02-28 2011-06-02 スリーエム イノベイティブ プロパティズ カンパニー 基材上に導電体をパターン化する方法
US8284332B2 (en) 2008-08-01 2012-10-09 3M Innovative Properties Company Touch screen sensor with low visibility conductors
CN102016768B (zh) 2008-02-28 2014-11-19 3M创新有限公司 具有变化的薄层电阻的触屏传感器
JP2011513846A (ja) 2008-02-28 2011-04-28 スリーエム イノベイティブ プロパティズ カンパニー タッチスクリーンセンサ
EP2370269B1 (en) 2008-12-11 2015-08-05 3M Innovative Properties Company Patterning process
JP2015137927A (ja) * 2014-01-22 2015-07-30 株式会社ブルービジョン 撮像装置及び検査システム

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