JP2012531518A5 - - Google Patents

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Publication number
JP2012531518A5
JP2012531518A5 JP2012517584A JP2012517584A JP2012531518A5 JP 2012531518 A5 JP2012531518 A5 JP 2012531518A5 JP 2012517584 A JP2012517584 A JP 2012517584A JP 2012517584 A JP2012517584 A JP 2012517584A JP 2012531518 A5 JP2012531518 A5 JP 2012531518A5
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JP
Japan
Prior art keywords
substrate
self
assembled monolayer
patterned region
metal
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JP2012517584A
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English (en)
Japanese (ja)
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JP2012531518A (ja
JP6128847B2 (ja
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Priority claimed from PCT/US2010/038942 external-priority patent/WO2010151471A1/en
Publication of JP2012531518A publication Critical patent/JP2012531518A/ja
Publication of JP2012531518A5 publication Critical patent/JP2012531518A5/ja
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Publication of JP6128847B2 publication Critical patent/JP6128847B2/ja
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JP2012517584A 2009-06-25 2010-06-17 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品 Active JP6128847B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22040709P 2009-06-25 2009-06-25
US61/220,407 2009-06-25
PCT/US2010/038942 WO2010151471A1 (en) 2009-06-25 2010-06-17 Methods of wet etching a self-assembled monolayer patterned substrate and metal patterned articles

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015137927A Division JP6399975B2 (ja) 2009-06-25 2015-07-09 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品

Publications (3)

Publication Number Publication Date
JP2012531518A JP2012531518A (ja) 2012-12-10
JP2012531518A5 true JP2012531518A5 (enExample) 2013-07-25
JP6128847B2 JP6128847B2 (ja) 2017-05-17

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ID=42710497

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2012517584A Active JP6128847B2 (ja) 2009-06-25 2010-06-17 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品
JP2015137927A Expired - Fee Related JP6399975B2 (ja) 2009-06-25 2015-07-09 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品
JP2017050042A Withdrawn JP2017166070A (ja) 2009-06-25 2017-03-15 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2015137927A Expired - Fee Related JP6399975B2 (ja) 2009-06-25 2015-07-09 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品
JP2017050042A Withdrawn JP2017166070A (ja) 2009-06-25 2017-03-15 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品

Country Status (5)

Country Link
US (1) US8647522B2 (enExample)
EP (1) EP2446067B1 (enExample)
JP (3) JP6128847B2 (enExample)
CN (1) CN102803562B (enExample)
WO (1) WO2010151471A1 (enExample)

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EP2401669B1 (en) 2009-02-26 2016-04-06 3M Innovative Properties Company Touch screen sensor and patterned substrate having overlaid micropatterns with low visibility
US8553400B2 (en) 2009-06-30 2013-10-08 3M Innovative Properties Company Electronic displays and metal micropatterned substrates having a graphic
JP5843784B2 (ja) 2009-12-22 2016-01-13 スリーエム イノベイティブ プロパティズ カンパニー 加圧ローラーを使用するマイクロコンタクトプリンティングのための装置及び方法
CN103262342B (zh) 2010-12-16 2016-08-10 3M创新有限公司 透明性微图案化rfid天线以及装配透明性微图案化rfid天线的制品
US9301397B2 (en) 2011-09-30 2016-03-29 3M Innovative Properties Company Methods of continuously wet etching a patterned substrate
EP3065951B1 (en) 2013-11-06 2019-07-31 3M Innovative Properties Company Microcontact printing stamps with functional features
WO2015126372A1 (en) * 2014-02-19 2015-08-27 Uni-Pixel Displays, Inc. Method of passivating a conductive pattern with self-assembling monolayers
US9232661B1 (en) 2014-09-22 2016-01-05 International Business Machines Corporation Magnetically controllable fluidic etching process
CN104538138B (zh) * 2014-12-30 2017-12-29 南京萨特科技发展有限公司 精密贴片电阻器的制作方法
CN104630773B (zh) * 2015-03-07 2017-01-18 宋彦震 一种全自动pcb板腐蚀箱
CN106455348A (zh) * 2016-11-29 2017-02-22 福建农林大学 Pcb板升降腐蚀机及使用方法
CN107833827B (zh) * 2017-10-25 2020-07-31 武汉华星光电技术有限公司 一种阵列基板的刻蚀方法
JP7368264B2 (ja) * 2019-02-20 2023-10-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び基板処理方法
CN113463099B (zh) * 2020-03-31 2023-08-29 长沙韶光铬版有限公司 一种银的细微图形化蚀刻方法
FR3110716B1 (fr) * 2020-05-19 2022-04-29 Commissariat Energie Atomique Procede de fabrication de moules pour lithographie par nano-impression
CN116683283A (zh) * 2023-05-30 2023-09-01 中国科学院半导体研究所 半导体激光器湿法腐蚀方法及其装置

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US3483049A (en) 1965-12-20 1969-12-09 Teletype Corp Method of froth etching
US3565707A (en) * 1969-03-03 1971-02-23 Fmc Corp Metal dissolution
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DE2353936A1 (de) 1973-10-27 1975-05-07 Rudolf Schmidt Verfahren und vorrichtung zur verbesserung und/oder beschleunigung chemischer vorgaenge in fluessigkeiten und baedern
US4602184A (en) * 1984-10-29 1986-07-22 Ford Motor Company Apparatus for applying high frequency ultrasonic energy to cleaning and etching solutions
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WO2010068531A1 (en) 2008-12-11 2010-06-17 3M Innovative Properties Company Amide-linked perfluoropolyether thiol compounds and processes for their preparation and use
JP2015137927A (ja) * 2014-01-22 2015-07-30 株式会社ブルービジョン 撮像装置及び検査システム

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