CN102803562B - 湿式蚀刻自组装单层图案化基材和金属图案化制品的方法 - Google Patents

湿式蚀刻自组装单层图案化基材和金属图案化制品的方法 Download PDF

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Publication number
CN102803562B
CN102803562B CN201080028067.6A CN201080028067A CN102803562B CN 102803562 B CN102803562 B CN 102803562B CN 201080028067 A CN201080028067 A CN 201080028067A CN 102803562 B CN102803562 B CN 102803562B
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China
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metal
pattern
substrate
patterned
self
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Expired - Fee Related
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CN201080028067.6A
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English (en)
Chinese (zh)
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CN102803562A (zh
Inventor
祖丽君
马修·H·弗雷
姜明燦
杰弗里·H·托奇
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
CN201080028067.6A 2009-06-25 2010-06-17 湿式蚀刻自组装单层图案化基材和金属图案化制品的方法 Expired - Fee Related CN102803562B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22040709P 2009-06-25 2009-06-25
US61/220,407 2009-06-25
PCT/US2010/038942 WO2010151471A1 (en) 2009-06-25 2010-06-17 Methods of wet etching a self-assembled monolayer patterned substrate and metal patterned articles

Publications (2)

Publication Number Publication Date
CN102803562A CN102803562A (zh) 2012-11-28
CN102803562B true CN102803562B (zh) 2015-09-30

Family

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CN201080028067.6A Expired - Fee Related CN102803562B (zh) 2009-06-25 2010-06-17 湿式蚀刻自组装单层图案化基材和金属图案化制品的方法

Country Status (5)

Country Link
US (1) US8647522B2 (enExample)
EP (1) EP2446067B1 (enExample)
JP (3) JP6128847B2 (enExample)
CN (1) CN102803562B (enExample)
WO (1) WO2010151471A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010099132A2 (en) 2009-02-26 2010-09-02 3M Innovative Properties Company Touch screen sensor and patterned substrate having overlaid micropatterns with low visibility
JP5747027B2 (ja) 2009-06-30 2015-07-08 スリーエム イノベイティブ プロパティズ カンパニー 図形を有する電子ディスプレイ及び金属微小パターン化基材
EP2516162A4 (en) 2009-12-22 2015-10-28 3M Innovative Properties Co APPARATUS AND METHOD FOR PRINTING MICROCONTACTS USING A PRESSURIZED ROLL
CN103262342B (zh) 2010-12-16 2016-08-10 3M创新有限公司 透明性微图案化rfid天线以及装配透明性微图案化rfid天线的制品
SG11201400767WA (en) 2011-09-30 2014-04-28 3M Innovative Properties Co Methods of continuously wet etching a patterned substrate
WO2015069538A1 (en) 2013-11-06 2015-05-14 3M Innovative Properties Company Microcontact printing stamps with functional features
WO2015126372A1 (en) * 2014-02-19 2015-08-27 Uni-Pixel Displays, Inc. Method of passivating a conductive pattern with self-assembling monolayers
US9232661B1 (en) 2014-09-22 2016-01-05 International Business Machines Corporation Magnetically controllable fluidic etching process
CN104538138B (zh) * 2014-12-30 2017-12-29 南京萨特科技发展有限公司 精密贴片电阻器的制作方法
CN104630773B (zh) * 2015-03-07 2017-01-18 宋彦震 一种全自动pcb板腐蚀箱
CN106455348A (zh) * 2016-11-29 2017-02-22 福建农林大学 Pcb板升降腐蚀机及使用方法
CN107833827B (zh) * 2017-10-25 2020-07-31 武汉华星光电技术有限公司 一种阵列基板的刻蚀方法
JP7368264B2 (ja) * 2019-02-20 2023-10-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び基板処理方法
CN113463099B (zh) * 2020-03-31 2023-08-29 长沙韶光铬版有限公司 一种银的细微图形化蚀刻方法
FR3110716B1 (fr) * 2020-05-19 2022-04-29 Commissariat Energie Atomique Procede de fabrication de moules pour lithographie par nano-impression
CN116683283A (zh) * 2023-05-30 2023-09-01 中国科学院半导体研究所 半导体激光器湿法腐蚀方法及其装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1313233A (en) * 1919-08-12 Ernest grass
GB1080536A (en) * 1964-09-18 1967-08-23 Her Majesty S Principal Sec De Improvements in or relating to chemical etching
US3483049A (en) * 1965-12-20 1969-12-09 Teletype Corp Method of froth etching
US3565707A (en) * 1969-03-03 1971-02-23 Fmc Corp Metal dissolution
DE2353936A1 (de) * 1973-10-27 1975-05-07 Rudolf Schmidt Verfahren und vorrichtung zur verbesserung und/oder beschleunigung chemischer vorgaenge in fluessigkeiten und baedern
DE2030304C3 (de) * 1970-06-19 1981-06-19 Walter 6983 Kreuzwertheim Lemmen Verfahren zum Ätzen von Metall
US4602184A (en) * 1984-10-29 1986-07-22 Ford Motor Company Apparatus for applying high frequency ultrasonic energy to cleaning and etching solutions
US20040053009A1 (en) * 2000-06-07 2004-03-18 Ozin Geoffrey Alan Method of self-assembly and optical applications of crystalline colloidal patterns on substrates

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61133390A (ja) * 1984-12-03 1986-06-20 Hitachi Cable Ltd めつきされた金の剥離方法
JPS61207584A (ja) * 1985-03-11 1986-09-13 Sumitomo Electric Ind Ltd 回路基板の製造方法
JPH0719944B2 (ja) * 1991-02-05 1995-03-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 微細電子回路パッケージの製造方法
JPH0677624A (ja) * 1992-08-25 1994-03-18 Matsushita Electric Ind Co Ltd プリント配線板のエッチング方法とエッチング装置
WO1997007429A1 (en) 1995-08-18 1997-02-27 President And Fellows Of Harvard College Self-assembled monolayer directed patterning of surfaces
US7041232B2 (en) * 2001-03-26 2006-05-09 International Business Machines Corporation Selective etching of substrates with control of the etch profile
US20020190028A1 (en) * 2001-05-31 2002-12-19 International Business Machines Corporation Method of improving uniformity of etching of a film on an article
GB0323902D0 (en) * 2003-10-11 2003-11-12 Koninkl Philips Electronics Nv Method for patterning a substrate surface
US20110104840A1 (en) * 2004-12-06 2011-05-05 Koninklijke Philips Electronics, N.V. Etchant Solutions And Additives Therefor
JP4528164B2 (ja) * 2005-03-11 2010-08-18 関東化学株式会社 エッチング液組成物
WO2008091279A2 (en) * 2006-06-28 2008-07-31 Northwestern University Etching and hole arrays
US8764996B2 (en) 2006-10-18 2014-07-01 3M Innovative Properties Company Methods of patterning a material on polymeric substrates
WO2009108765A2 (en) 2008-02-28 2009-09-03 3M Innovative Properties Company Touch screen sensor having varying sheet resistance
US8284332B2 (en) 2008-08-01 2012-10-09 3M Innovative Properties Company Touch screen sensor with low visibility conductors
US8179381B2 (en) 2008-02-28 2012-05-15 3M Innovative Properties Company Touch screen sensor
JP2011517367A (ja) 2008-02-28 2011-06-02 スリーエム イノベイティブ プロパティズ カンパニー 基材上に導電体をパターン化する方法
US8858813B2 (en) 2008-12-11 2014-10-14 3M Innovative Properties Company Patterning process
JP2015137927A (ja) * 2014-01-22 2015-07-30 株式会社ブルービジョン 撮像装置及び検査システム

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1313233A (en) * 1919-08-12 Ernest grass
GB1080536A (en) * 1964-09-18 1967-08-23 Her Majesty S Principal Sec De Improvements in or relating to chemical etching
US3483049A (en) * 1965-12-20 1969-12-09 Teletype Corp Method of froth etching
US3565707A (en) * 1969-03-03 1971-02-23 Fmc Corp Metal dissolution
DE2030304C3 (de) * 1970-06-19 1981-06-19 Walter 6983 Kreuzwertheim Lemmen Verfahren zum Ätzen von Metall
DE2353936A1 (de) * 1973-10-27 1975-05-07 Rudolf Schmidt Verfahren und vorrichtung zur verbesserung und/oder beschleunigung chemischer vorgaenge in fluessigkeiten und baedern
US4602184A (en) * 1984-10-29 1986-07-22 Ford Motor Company Apparatus for applying high frequency ultrasonic energy to cleaning and etching solutions
US20040053009A1 (en) * 2000-06-07 2004-03-18 Ozin Geoffrey Alan Method of self-assembly and optical applications of crystalline colloidal patterns on substrates

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Feature of gold having micrometer to centimeter dimensions can be formed through a combination of stamping with an elastomeric stamp and an alkanethiol "ink" followed by chemical etching;Amit Kumar and George M. Whitesides;《Applied Physics Letters》;19931004;第63卷(第14期);第2003页图2 *
James L Wilbur et al.Microcontact printing of self-assembled monolayers: apilication in microfabrication.《Nanotechnology》.1996,第7卷(第4期),第453页右栏倒数第1段,第454-455页,图3C. *
Microcontact printing of self-assembled monolayers: apilication in microfabrication;James L Wilbur et al;《Nanotechnology》;19961231;第7卷(第4期);第453页右栏倒数第1段，第454-455页，图3C *
Patterning sel-assembled monolayers: application in material science;Amit kumar et al;《Langmuir》;19940501;第10卷(第5期);第1501页图3 *
XIA Y et al..Pattern transfer:Self-assembled monolayers as ultrathin resists.《Microelectronic engineering》.1996,第32卷(第1期),255-268. *

Also Published As

Publication number Publication date
JP2012531518A (ja) 2012-12-10
JP6399975B2 (ja) 2018-10-03
JP2015214757A (ja) 2015-12-03
US8647522B2 (en) 2014-02-11
US20120082825A1 (en) 2012-04-05
JP6128847B2 (ja) 2017-05-17
EP2446067B1 (en) 2019-11-20
EP2446067A1 (en) 2012-05-02
WO2010151471A1 (en) 2010-12-29
CN102803562A (zh) 2012-11-28
JP2017166070A (ja) 2017-09-21

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