JP5747027B2 - 図形を有する電子ディスプレイ及び金属微小パターン化基材 - Google Patents
図形を有する電子ディスプレイ及び金属微小パターン化基材 Download PDFInfo
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- JP5747027B2 JP5747027B2 JP2012517591A JP2012517591A JP5747027B2 JP 5747027 B2 JP5747027 B2 JP 5747027B2 JP 2012517591 A JP2012517591 A JP 2012517591A JP 2012517591 A JP2012517591 A JP 2012517591A JP 5747027 B2 JP5747027 B2 JP 5747027B2
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- 229910052751 metal Inorganic materials 0.000 title claims description 227
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- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 125000004429 atom Chemical group 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
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- 239000004332 silver Substances 0.000 description 6
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- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
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- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 150000001356 alkyl thiols Chemical class 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
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- BZLVMXJERCGZMT-UHFFFAOYSA-N Methyl tert-butyl ether Chemical compound COC(C)(C)C BZLVMXJERCGZMT-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
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- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
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- SZQUEWJRBJDHSM-UHFFFAOYSA-N iron(3+);trinitrate;nonahydrate Chemical compound O.O.O.O.O.O.O.O.O.[Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O SZQUEWJRBJDHSM-UHFFFAOYSA-N 0.000 description 2
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- 229910052763 palladium Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
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- 150000007944 thiolates Chemical class 0.000 description 2
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- 239000004986 Cholesteric liquid crystals (ChLC) Substances 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- YAGKRVSRTSUGEY-UHFFFAOYSA-N ferricyanide Chemical compound [Fe+3].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] YAGKRVSRTSUGEY-UHFFFAOYSA-N 0.000 description 1
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- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/02—Signs, boards, or panels, illuminated by artificial light sources positioned in front of the insignia
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/16—Signs formed of or incorporating reflecting elements or surfaces, e.g. warning signs having triangular or other geometrical shape
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
Description
HS(CH2)nX
式中、nはメチレン単位の数であり、Xはアルキル鎖の末端基(例えば、X=−CH3、−OH、−COOH、−NH2等)である。好ましくは、X=−CH3であり、n=15、16、又は17であり、それぞれ16、17、又は18の鎖長に対応する。他の有用な鎖長には、19及び20が含まれる。金属への連結のための硫黄含有先端基を有する直鎖分子の場合、鎖長は、硫黄原子に結合した原子(これを含む)と直鎖配列における最終炭素原子との間の結合原子の直鎖配列に沿った原子の数として決定される。単層形成分子は、エッチングレジストとして機能する自己組織化単層を形成するのに好適な分子である限りにおいて、他の末端基を含んでもよく、また分枝状(側基を備える)であってもよい。SAM形成分子はまた、部分的にフッ素化又は過フッ素化していてもよく、これは例えば米国特許出願第61/121605号(2008年12月11日出願)に記述されている。
金属化ポリマーフィルム基材は、5mil(127マイクロメートル)のポリエチレンテレフタレート(PET)(ST504、E.I.DuPont de Nemours and Company(Wilmington、Delaware))の上に70〜100nmの厚さで銀を熱蒸着することによって調製された。
図1〜4の例示された金属微小パターンそれぞれについて、フォトリソグラフィーを使用して直径10センチメートルのシリコンウエハ上に微小パターン化されたフォトレジスト(Shipley 1818、Rohm and Haas Company(Philadelphia、Pennsylvania))を調製することによって、エラストマー製スタンプを成形するためのマスターツールが作製された。このマスターツールは、線分の六角形メッシュ(97パーセントの空白領域と、六角形を形成する3マイクロメートル幅の線分を備えた、六角形セル形状)の微小パターンで溝(フォトレジスト材料が除去されている)を含んで配置されているフォトレジストの微小パターンを有した。マスターツールそれぞれは、(11mm×5.5mm)の「3M」図形を形成する追加の回折性微小パターン特徴を有した。これについては後述される。
スタンプは、その裏側(レリーフ微小パターンのない平坦な表面)を、エタノール中の5mMオクタデシルチオール(「ODT」O0005、TCI AMERICA(Wellesley Hills、Massachusetts))の溶液に20時間接触させることによってインク付けされた。
金属化ポリマーフィルム基材は、記述のようにインク付けされたスタンプでスタンピングされた。スタンピングでは、最初にフィルムサンプルの縁部をスタンプ表面に接触させ、次に直径およそ3.0センチメートルのローラーを使用して、フィルムをローラーでスタンプ全体に接触させることにより、金属化されたフィルムを、上を向いたスタンプのレリーフ微小パターン化された表面に接触させた。ローリング工程は、実行に5秒未満を必要とした。ローリング工程の後に、基材をスタンプと10秒間接触させた。次に、基材がスタンプから剥がされ、工程は1秒未満を必要とした。
スタンピングの後、SAM印刷微小パターンで金属化されたフィルム基材を、エッチング浴に入れ、選択的エッチングと金属微小パターン化を行った。このエッチング浴は、5.8gのチオ尿素(99%、Alfa Aesar(MA、USA)、CAS 62−56−6)と20.8gの硝酸第二鉄九水和物(EMD Chemicals,Inc.(Darmstadt、Germany)、CAS 7782−61−8)を2500mLの脱イオン水に加えることによって調製した。SAM印刷微小パターンを備えた金属化フィルム基材を、表面を下にしてこのエッチング浴に入れ、このエッチング浴を約3分間、窒素気泡によって攪拌した。
図3は、タッチセンサーの導電性バーを構成する連続的六角形金属メッシュ微小パターン(六角形メッシュを形成する2〜3μm幅の線状金属特徴で、ここにおいて六角形は直径300μmを有する)と、非連続的(すなわち点状の)微小パターン特徴(3μm×3μmの点が、10.2μm間隔の三角形配列になっている)とを有する、金属微小パターンの光学顕微鏡写真である。この非連続的点の配列は、第1四分割の「3M」図形にのみ存在した。一方、図形に隣接する対照領域(例えば第1四分割の周囲部分)は、連続的六角形金属メッシュ微小パターンのみを有し、非連続的(すなわち点状)微小パターン特徴は欠いていた。この点の寸法と間隔は、合計金属微小パターン密度11〜12%を有する3M図形をもたらし、一方で、この図形の外側にある対照領域の六角形金属メッシュ微小パターンは、合計金属微小パターン密度が1.3〜2%であった。この図形について、金属微小パターンのコントラスト比は約7であった。このロゴの内側と外側の陰影領域比率の差(すなわち、合計金属微小パターン密度の差)は約10%であった(11.3〜12%から1.3〜2%を差し引く)。
Claims (3)
- 金属微小パターンを有する透明基材を含む電子ディスプレイであって、該金属微小パターンの少なくとも一部分は連続的に、該電子ディスプレイの回路に電気的に接続しており、該金属微小パターンは、隣接する対照領域によって画定される少なくとも1つの図形を含み、該図形の該金属微小パターン、該対照領域の該金属微小パターン、又はこれらの組み合わせは、該電子ディスプレイの回路と電気的に接続されていない非連続的微小パターン特徴を含んでなる、電子ディスプレイ。
- 前記非連続的微小パターン特徴が、点、線分、塗り潰し図形、又はこれらの組み合わせの配列を含む、請求項1に記載の電子ディスプレイ。
- 前記基材が前記電子ディスプレイのタッチセンサーの一部である、請求項1又は2に記載の電子ディスプレイ。
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PCT/US2010/039103 WO2011002617A1 (en) | 2009-06-30 | 2010-06-18 | Electronic displays and metal micropatterned substrates having a graphic |
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US20120086660A1 (en) | 2012-04-12 |
CN102473370B (zh) | 2015-06-17 |
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