WO2014038616A1 - 防汚体、表示装置、入力装置および電子機器 - Google Patents
防汚体、表示装置、入力装置および電子機器 Download PDFInfo
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- WO2014038616A1 WO2014038616A1 PCT/JP2013/073890 JP2013073890W WO2014038616A1 WO 2014038616 A1 WO2014038616 A1 WO 2014038616A1 JP 2013073890 W JP2013073890 W JP 2013073890W WO 2014038616 A1 WO2014038616 A1 WO 2014038616A1
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- 125000006547 cyclononyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
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- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
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- 229910003472 fullerene Inorganic materials 0.000 description 1
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- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- 229910052739 hydrogen Inorganic materials 0.000 description 1
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- DFENKTCEEGOWLB-UHFFFAOYSA-N n,n-bis(methylamino)-2-methylidenepentanamide Chemical compound CCCC(=C)C(=O)N(NC)NC DFENKTCEEGOWLB-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/18—Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
- B08B17/06—Preventing deposition of fouling or of dust by giving articles subject to fouling a special shape or arrangement
- B08B17/065—Preventing deposition of fouling or of dust by giving articles subject to fouling a special shape or arrangement the surface having a microscopic surface pattern to achieve the same effect as a lotus flower
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
- C09D133/16—Homopolymers or copolymers of esters containing halogen atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/16—Antifouling paints; Underwater paints
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
- G06F3/039—Accessories therefor, e.g. mouse pads
- G06F3/0393—Accessories for touch pads or touch screens, e.g. mechanical guides added to touch screens for drawing straight lines, hard keys overlaying touch screens or touch pads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Definitions
- This technology relates to an antifouling body, a display device including the same, an input device, and an electronic device. Specifically, the present invention relates to an antifouling layer that suppresses surface contamination.
- an antifouling layer designed so that a fluorine-based compound, a silicon-based compound, or the like appears on the outermost surface is used on the display surface including the touch panel (see, for example, Patent Document 1). Since the outermost surface of the antifouling layer is a water and oil repellent surface, the adhesion of the oil and fat components constituting the fingerprint is weakened, and it becomes easy to wipe off the fingerprint with a cloth or the like.
- the surface of the fingerprint becomes difficult to see the attached fingerprint spread without any action.
- the fingerprint surface is considered important.
- an object of the present technology is to provide an antifouling body having a surface on which a fingerprint pattern is wet spread without any action when a fingerprint is attached to the surface, and the attached fingerprint is difficult to see, a display device including the surface, an input device, and To provide electronic equipment.
- the first technique is: It has a surface with a fine relief structure,
- the concavo-convex structure is an antifouling body containing at least one of a first compound having an ester bond at a portion other than the terminal and a second compound having a cyclic hydrocarbon group.
- the second technology is It has an input surface with a fine uneven structure
- the concavo-convex structure is an input device including at least one of a first compound having an ester bond at a portion other than the terminal and a second compound having a cyclic hydrocarbon group.
- the third technology is It has a display surface with a fine uneven structure
- the concavo-convex structure is a display device including at least one of a first compound having an ester bond at a portion other than the terminal and a second compound having a cyclic hydrocarbon group.
- the fourth technology is It has a surface with a fine relief structure
- the concavo-convex structure is an electronic device including at least one of a first compound having an ester bond at a portion other than the terminal and a second compound having a cyclic hydrocarbon group.
- the fifth technology is It has a surface with a fine relief structure
- the concavo-convex structure is an antifouling article containing at least one of a first compound having an ester bond at a portion other than the terminal and a second compound having a cyclic hydrocarbon group.
- the antifouling body is preferably an antifouling layer, an antifouling structure layer or an antifouling substrate.
- the antifouling structure layer means a structure layer including a plurality of structures and an antifouling layer provided so as to follow the surfaces of these structures.
- a fine concavo-convex structure is provided on the surface, and the concavo-convex structure includes at least one of a first compound having an ester bond at a portion other than a terminal and a second compound having a cyclic hydrocarbon group. It is. For this reason, when a fingerprint adheres to the surface, the fingerprint pattern spreads out and the attached fingerprint becomes difficult to see without doing anything.
- the fingerprint pattern spreads out without doing anything, and the attached fingerprint becomes difficult to see.
- FIG. 1A is a plan view illustrating a configuration example of an antifouling substrate according to the first embodiment of the present technology.
- 1B is a cross-sectional view taken along the line aa shown in FIG. 1A.
- FIG. 1C is an enlarged cross-sectional view of a part of FIG. 1B.
- FIG. 2A is a plan view showing a configuration example of a plate-shaped master.
- FIG. 2B is a cross-sectional view taken along line aa shown in FIG. 2A.
- FIG. 2C is an enlarged cross-sectional view of a part of FIG. 2B.
- FIG. 3 is a schematic diagram showing a configuration example of a laser processing apparatus for producing a plate-shaped master.
- FIG. 4A to 4C are process diagrams for explaining an example of a method for manufacturing an antifouling substrate according to the first embodiment of the present technology.
- 5A to 5C are process diagrams for explaining an example of a structure forming process using an energy ray curable resin or a thermosetting resin.
- 6A to 6C are process diagrams for explaining an example of a structure constituting process using a thermoplastic resin composition.
- FIG. 7A is a cross-sectional view illustrating a configuration example of the antifouling substrate according to the first modification.
- FIG. 7B is a cross-sectional view illustrating a configuration example of the antifouling substrate according to the second modification.
- FIG. 7C is a cross-sectional view illustrating a configuration example of the antifouling substrate according to the third modification.
- FIG. 8A is a cross-sectional view illustrating a configuration example of an antifouling substrate according to a fourth modification.
- FIG. 8B is a cross-sectional view illustrating a configuration example of the antifouling substrate according to the fifth modification.
- FIG. 8C is a cross-sectional view showing a configuration example of the antifouling substrate according to the sixth modification.
- FIG. 9A is a cross-sectional view illustrating a configuration example of an antifouling substrate according to the second embodiment of the present technology.
- FIG. 9B is an enlarged cross-sectional view of a part of FIG. 9A.
- FIG. 10A is a cross-sectional view illustrating a configuration example of an antifouling substrate according to the third embodiment of the present technology.
- FIG. 10A is a cross-sectional view illustrating a configuration example of an antifouling substrate according to the third embodiment of the present technology.
- FIG. 10B is an enlarged cross-sectional view of a part of FIG. 10A.
- 11A to 11C are schematic views illustrating a configuration example of the antifouling substrate according to the fourth embodiment of the present technology.
- FIG. 12A is a perspective view illustrating a configuration example of a roll master.
- 12B is an enlarged plan view showing a part of the roll master shown in FIG. 12A.
- FIG. 12C is a cross-sectional view illustrating a part of FIG. 12B in an enlarged manner.
- FIG. 13 is a schematic diagram illustrating a configuration example of a laser processing apparatus for producing a roll master.
- 14A to 14C are process diagrams for explaining an example of a method for producing an antifouling substrate according to the fifth embodiment of the present technology.
- FIG. 15A and 15B are process diagrams for explaining an example of a structure forming process using an energy beam curable resin or a thermosetting resin.
- 16A and 16B are process diagrams for explaining an example of a structure forming process using a thermoplastic resin composition.
- FIG. 17 is a perspective view illustrating a configuration example of the display device according to the sixth embodiment of the present technology.
- FIG. 18A is a perspective view illustrating a configuration example of a display device according to the seventh embodiment of the present technology.
- FIG. 18B is an exploded perspective view illustrating a modification of the input device according to the seventh embodiment of the present technology.
- FIG. 19A is an external view illustrating an example of a television device as an electronic apparatus.
- FIG. 19B is an external view illustrating an example of a notebook personal computer as an electronic apparatus.
- FIG. 20A is an external view illustrating an example of a mobile phone as an electronic apparatus.
- FIG. 20B is an external view illustrating an example of a tablet computer as an electronic device.
- 21A is a view showing an AFM image of the antifouling film surface of Example 1.
- FIG. 21B is a diagram showing a cross-sectional profile along the line aa shown in FIG. 21A.
- 22A is a view showing an AFM image of the antifouling film surface of Example 2.
- FIG. FIG. 22B is a diagram showing a cross-sectional profile along the line aa shown in FIG. 22A.
- FIG. 23A is a view showing an AFM image of the antifouling film surface of Example 3.
- FIG. 23B is a diagram showing a cross-sectional profile along the line aa shown in FIG. 23A.
- 24A is a diagram showing an AFM image of the antifouling film surface of Example 4.
- FIG. 24B is a diagram showing a cross-sectional profile along the line aa shown in FIG. 24A.
- 25A is a view showing an AFM image of the antifouling film surface of Example 5.
- FIG. 25B is a diagram showing a cross-sectional profile along the line aa shown in FIG. 25A.
- Embodiments of the present technology will be described in the following order. 1. First embodiment (an example of an antifouling substrate having an anti-fingerprint surface) 2. Second embodiment (an example of an antifouling substrate having an anti-fingerprint surface) 3. Third embodiment (an example of an antifouling substrate having an anti-fingerprint surface) 4). Fourth embodiment (an example of an antifouling substrate having an anti-fingerprint surface) 5. Fifth embodiment (example of method for producing antifouling substrate) 6). Sixth Embodiment (Example of Display Device Having Anti-Fingerprint Surface) 7). Seventh embodiment (an example of an input device having an anti-fingerprint surface) 8). Eighth embodiment (an example of an electronic device having an anti-fingerprint surface)
- FIG. 1A is a plan view of an antifouling substrate according to the first embodiment of the present technology.
- 1B is a cross-sectional view taken along the line aa shown in FIG. 1A.
- FIG. 1C is an enlarged cross-sectional view of a part of FIG. 1B.
- the antifouling substrate (antifouling body) has a fingerprint-resistant surface (antifouling surface) S having a fingerprint resistance function.
- This fingerprint-resistant surface S contains a compound containing a specific molecular structure described later, and has a fine uneven structure on the surface. For this reason, the fingerprint adhering to the anti-fingerprint surface S gets wet and spreads easily without doing anything.
- the fingerprint adhering to the anti-fingerprint surface S is rubbed with a finger or the like so as to be slightly wetted and spread, thereby making it inconspicuous.
- the fine uneven surface S has a fluctuation in shape. By having fluctuations in the shape in this way, spectroscopy can be prevented.
- the antifouling substrate includes a substrate 11 and an antifouling layer 12 provided on the surface of the substrate 11.
- the antifouling base material provided with the base material 11 and the antifouling layer 12 will be described as an example of the antifouling body, but the antifouling body is not limited to this example, and the antifouling layer 12 is provided alone. It is good also as antifouling.
- the antifouling substrate according to the first embodiment is suitable for application to the surface of an apparatus that may be touched with a hand or a finger.
- the surface of the device include at least one place such as a display surface, an input surface, and a housing surface. It is also preferable to apply the antifouling layer 12 directly on the surface of the apparatus without the substrate 11.
- Specific devices that may be touched with a hand or a finger include, for example, display devices, input devices, and electronic devices.
- Examples of the display device include a liquid crystal display, a CRT (Cathode Ray Tube) display, and a plasma display (Plasma). Examples thereof include various display devices such as a display panel (PDP), an electro luminescence (EL) display, and a surface-conduction electron-emitter display (SED).
- PDP display panel
- EL electro luminescence
- SED surface-conduction electron-emitter display
- Examples of the input device include, but are not limited to, a touch panel, a mouse, and a keyboard.
- Examples of the touch panel include, but are not limited to, a touch panel provided on a television device, a personal computer, a mobile device (for example, a smartphone, a slate PC, etc.), a photo frame, and the like.
- the electronic device one having at least one of a display device, an input device, a housing, and the like is preferable.
- Examples of such an electronic device include, but are not limited to, a television device, a personal computer (PC), a mobile device (for example, a smartphone, a slate PC), and a photo frame.
- the object to which the antifouling substrate or the antifouling layer 12 is applied is not limited to the above-described apparatus, and any suitable object can be used as long as it has a surface that can be touched with a hand or a finger.
- articles (antifouling articles) other than the above-described devices include, for example, paper, plastic, glass, metal products (specifically, for example, photographs, photo stands, plastic cases, metal cases, glass windows, plastic windows) , Frame, lens, furniture, appliances, etc.), but is not limited thereto.
- the base material 11 is, for example, a transparent inorganic base material or plastic base material.
- a shape of the substrate 11 for example, a film shape, a sheet shape, a plate shape, a block shape, or the like can be used.
- the material of the inorganic base material include quartz, sapphire, and glass.
- a material for the plastic substrate for example, a known polymer material can be used. Specific examples of known polymer materials include triacetyl cellulose (TAC), polyester (TPEE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polyamide (PA), and aramid.
- PE Polyethylene
- PMMA polyacrylate
- PC polycarbonate
- epoxy resin epoxy resin
- urea resin urethane resin
- Melamine resin phenol resin, acrylonitrile-butadiene-styrene copolymer
- COP cycloolefin polymer
- COC cycloolefin copolymer
- PC / PMMA laminate rubber-added PMMA And the like.
- a pattern or a pattern may be printed or vapor-deposited on the substrate.
- the substrate 11 may not have transparency.
- the material include stainless steel, magnesium alloy, aluminum, aluminum alloy, titanium alloy, galvalume steel, and carbon fiber reinforced plastic.
- the base material 11 may be processed as an exterior of an electronic device or a part of a display.
- the surface shape of the base material 11 is not limited to a flat surface, and may be an uneven surface, a polygonal surface, a curved surface, or a combination of these shapes. Examples of the curved surface include a spherical surface, an elliptical surface, a paraboloid, and a free curved surface.
- the antifouling substrate may be molded into the curved surface by, for example, an in-mold molding process. In-mold molding is a method in which an antifouling substrate is placed in a mold, a resin such as plastic is injected, and molding and surface decoration are performed simultaneously.
- the antifouling substrate itself may be pressed using a press die and molded into the curved surface.
- a protective film may be provided on the antifouling layer of the antifouling substrate in order to protect the protrusions on the antifouling substrate from damage.
- a predetermined structure may be imparted to the surface of the substrate 11 by, for example, UV transfer, thermal transfer, pressure transfer, melt extrusion, or the like.
- the antifouling layer 12 has a fine uneven structure on the fingerprint-resistant surface S.
- This uneven structure is a random nanostructure. More specifically, the concavo-convex structure is constituted by a plurality of nano-sized structures 12 a that are randomly provided on the surface of the substrate 11. In this way, the uneven structure can be a random nanostructure, thereby preventing spectroscopy.
- the concave-convex structure has, for example, an extended structure in which convex portions and concave portions are extended one-dimensionally or two-dimensionally, or a needle-shaped structure in which needle-shaped convex portions are provided two-dimensionally.
- These structures have fluctuations in shape. Since the structure has fluctuations in this way, spectroscopy can be prevented.
- the fluctuation is, for example, the fluctuation in the width direction of the convex portion in the concavo-convex structure, the fluctuation in the width direction of the concave portion in the concavo-convex structure, These are fluctuations in the protruding direction of the convex part, and fluctuations in the concave direction of the concave part in the concavo-convex structure.
- the fluctuation is, for example, the fluctuation of the size of the needle-like convex part and the pitch between the adjacent needle-like convex parts (adjacent needle-like convex part). The distance between the vertices of the part).
- the fluctuation of the size of the needle-like convex portion includes the fluctuation of the bottom surface of the convex portion and the height of the convex portion.
- the antifouling layer 12 may further include a base layer 12b between the base material 11 and the plurality of structures 12a.
- the base layer 12b is a layer integrally formed with the structure 12a on the bottom surface side of the structure 12a, and is made of the same material as the structure 12a.
- the antifouling layer 12 is a surface-modified layer containing at least one of a first compound having an ester bond at a portion other than the terminal and a second compound having a cyclic hydrocarbon group. When the antifouling layer 12 contains at least one of the first compound and the second compound, the fingerprint wiping property can be improved.
- the term “end” refers to the end of the main chain and the side chain.
- the antifouling layer 12 is a coating layer formed by, for example, a wet process or a dry process.
- the antifouling layer 12 preferably further contains a third compound having a chain hydrocarbon group at the terminal together with the second compound.
- fingerprint wiping property can be further improved.
- the term “end” refers to the end of the main chain and the side chain.
- the content ratio of the second compound and the third compound in the antifouling layer 12 is not particularly limited, but the third compound has a property of being easily collected on the fingerprint-resistant surface S. The content ratio is preferably selected in consideration of this property.
- the antifouling layer 12 includes, for example, at least one selected from the group consisting of an energy ray curable resin composition, a thermosetting resin composition, and a thermoplastic resin composition. These resin compositions contain, for example, at least one of a first compound and a second compound. When these resin compositions contain the 2nd compound, it is preferred to further contain the 3rd compound with this 2nd compound.
- the antifouling layer 12 may be a polymerization initiator, a light stabilizer, an ultraviolet absorber, a catalyst, a colorant, an antistatic agent, a lubricant, a leveling agent, an antifoaming agent, a polymerization accelerator, an antioxidant, It may further contain additives such as a flame retardant, an infrared absorber, a surfactant, a surface modifier, a thixotropic agent, and a plasticizer. Further, the antifouling layer 12 may further include light scattering particles such as an organic resin filler that scatters light in order to impart an anti-glare (AG) function to the fingerprint-resistant surface S.
- AG anti-glare
- the light scattering particles may protrude from the anti-fingerprint surface S of the antifouling layer 12 or may be covered with a resin or the like contained in the antifouling layer 12. Further, the light scattering particles may or may not be in contact with the underlying substrate 11.
- the average film thickness of the antifouling layer 12 is, for example, in the range of monomolecular thickness to 1 mm, preferably monomolecular thickness to 100 ⁇ m, particularly preferably monomolecular thickness to 10 ⁇ m.
- the first compound and / or the second compound is, for example, at least one of the main component and subcomponent of the constituent material of the antifouling layer 12.
- the main component is, for example, a base resin
- the subcomponent is, for example, an additive such as the above-described leveling agent.
- the first compound, the second compound, and the third compound are preferably additives. This is because deterioration of the hardness of the base resin can be suppressed.
- an additive is a leveling agent.
- the first compound, the second compound, and the third compound are additives such as a leveling agent
- the first compound, the second compound, and the third compound are bonded to the base resin by a polymerization reaction or the like.
- a polymerization reaction or the like Preferably it is. This is because the durability of the fingerprint-resistant surface S can be improved.
- the plurality of structures 12 a have a convex shape with respect to the surface of the substrate 11.
- the plurality of structures 12 a are randomly provided on the surface of the base material 11.
- a stripe shape, a mesh shape, or a needle shape can be used as the shape of the structure 12a.
- FIG. 1A shows an example in which the structures 12a are striped.
- a stripe shape, a mesh shape, or a needle shape can be used as the shape of the structure 12a.
- the stripe shape and the mesh shape are shapes when viewed from a direction perpendicular to the fingerprint-resistant surface S.
- the needle shape is a shape when viewed from the in-plane direction of the anti-fingerprint surface S.
- the structure 12a having a stripe shape or a mesh shape has random fluctuations in the height direction of the structure body 12a (that is, the width direction of the base material 11) and the width direction of the structure body 12a (that is, the in-plane direction of the base material 11).
- the structure 12a having a needle shape is randomly provided two-dimensionally in the in-plane direction of the substrate 11.
- the height of the needle-like structure 12a is randomly displaced.
- the stripe shape not only a structure in which a plurality of structures 12a are continuously extended in one direction, but also a structure in which a plurality of structures 12a are intermittently extended in one direction. Is also included.
- the stripe shape includes a structure in which a plurality of structures 12a having random lengths extending in one direction are two-dimensionally filled and arranged.
- the average pitch Pm of the structures 12a is preferably in the range of 1 nm to 1 mm, more preferably 5 nm to 1 ⁇ m, and even more preferably 10 nm to 500 nm.
- the average arrangement pitch Pm is 1 nm or more and 1 mm or less, the fingerprint pattern is effectively spread. Note that the pitch of the individual structures 12a may vary.
- the average pitch Pm of the structures 12a is obtained as follows. First, the anti-fingerprint surface S is observed with an atomic force microscope (AFM). Next, any two adjacent structures 12a are selected from the cross-sectional profile of the AFM image, and the distance between these structures (the shortest distance between the tops of the minimum repeating structure) is obtained as the pitch. Next, this procedure is performed at any 10 locations on the fingerprint-proof surface to obtain the pitches P1, P2,. Next, these pitches P1, P2,..., P10 are simply averaged (arithmetic average) to obtain an average pitch Pm.
- AFM atomic force microscope
- the arithmetic average roughness Ra of the fingerprint-resistant surface S is preferably in the range of 1 nm to 1 mm, more preferably 2 nm to 1 ⁇ m, and even more preferably 5 nm to 100 nm.
- the arithmetic average roughness Ra is 1 nm or more and 1 mm or less, the fingerprint pattern is effectively spread.
- the arithmetic average roughness Ra of the anti-fingerprint surface S is obtained as follows. First, the fingerprint-resistant surface S is observed with an atomic force microscope (AFM) with a visual field of 3 ⁇ m ⁇ 3 ⁇ m. Next, the arithmetic average roughness ra is obtained from the cross-sectional profile of the AFM image. Next, this procedure is performed at any 10 locations on the fingerprint-proof surface to obtain ra1, ra2,. Next, these ra1, ra2,..., Ra10 are simply averaged (arithmetic average) to obtain the arithmetic average roughness Ra.
- AFM atomic force microscope
- a positive capillary pressure can be expressed with respect to the liquid.
- the positive capillary pressure acts on the droplet on the fingerprint-resistant surface S, so that the droplet can be thinly wetted and spread.
- the capillary pressure acting in the direction away from the droplet on the fingerprint-resistant surface S is defined as a positive capillary pressure.
- the first compound may have an ester bond at a portion other than the terminal, and may be an organic material, an organic-inorganic composite material, a polymer material, or a monomolecular material.
- the first compound is not particularly limited as long as it has an ester bond, and any functional group, bonding site, hetero atom, halogen atom, metal atom, etc. You may have.
- a compound having a structure represented by the following formula (1) or (2) in the molecule can be used as the first compound.
- R 1 is a group containing an atom such as C, N, S, O, Si, P or Ti.
- Examples of the group containing these atoms include a hydrocarbon group, a sulfo group (including a sulfonate salt). ), Sulfonyl group, sulfonamide group, carboxylic acid group (including carboxylate), amino group, amide group, phosphate group (including phosphate and phosphate ester), phosphino group, silanol group, epoxy group, isocyanate group , A cyano group, a thiol group, a hydroxyl group, etc.
- R 2 is a group having 2 or more carbon atoms, for example, a group containing atoms such as C, N, S, O, Si, P, or Ti.
- Groups containing these atoms include, for example, hydrocarbon groups, sulfo groups (including sulfonates), sulfonyl groups, sulfonamido groups, carboxylic acid groups (including carboxylates), amino groups, amide groups, phosphate groups ( Contains phosphate and phosphate ), Phosphino group, silanol group, epoxy group, isocyanate group, cyano group, thiol group or hydroxyl group.)
- R 1 and R 2 are each independently a group containing an atom such as C, N, S, O, Si, P or Ti.
- group containing these atoms include a hydrocarbon group, Sulfo group (including sulfonate), sulfonyl group, sulfonamide group, carboxylic acid group (including carboxylate), amino group, amide group, phosphate group (including phosphate and phosphate ester), phosphino group, silanol Group, epoxy group, isocyanate group, cyano group, thiol group or hydroxyl group.
- the second compound has a cyclic hydrocarbon group.
- the cyclic hydrocarbon group may be, for example, an unsaturated cyclic hydrocarbon group or a saturated cyclic hydrocarbon group, and has both an unsaturated cyclic hydrocarbon group and a saturated cyclic hydrocarbon group in the molecule. Also good.
- the antifouling layer 12 may contain both the second compound having an unsaturated cyclic hydrocarbon group and the second compound having a saturated cyclic hydrocarbon group.
- the cyclic hydrocarbon group may be monocyclic or polycyclic. Moreover, these cyclic hydrocarbon groups may have another substituent.
- substituents include, for example, hydrocarbon groups, sulfo groups (including sulfonates), sulfonyl groups, sulfonamido groups, carboxylic acid groups (including carboxylates), amino groups, amide groups, phosphate groups (phosphorus groups). Acid salts and phosphate esters), phosphino groups, silanol groups, epoxy groups, isocyanate groups, cyano groups, thiol groups or hydroxyl groups.
- the second compound may be an organic material, an organic-inorganic composite material, a polymer material, or a monomolecular material as long as it contains a cyclic hydrocarbon group.
- the second compound has a cyclic hydrocarbon group
- the saturated cyclic hydrocarbon group include groups having a monocyclo, bicyclo, tricyclo, or tetracyclo structure having 5 or more carbon atoms.
- the unsaturated cyclic hydrocarbon group include a phenyl group, a naphthyl group, a pyrenyl group, a pentacenyl group, and an anthryl group.
- organic material for example, a compound having a structure represented by the following formula (3) in the molecule can be used.
- organic-inorganic composite material for example, a compound having a structure represented by the following formula (4) in the molecule can be used.
- the third compound has a chain hydrocarbon group (acyclic hydrocarbon group) at the terminal.
- the chain hydrocarbon group may be, for example, an unsaturated chain hydrocarbon group or a saturated chain hydrocarbon group, and both the unsaturated chain hydrocarbon group and the saturated chain hydrocarbon group are intramolecular. You may have.
- the chain hydrocarbon group may be either a straight chain or a branched chain, and may have both a straight chain hydrocarbon group and a branched chain hydrocarbon group in the molecule.
- the chain hydrocarbon group may have another substituent.
- substituents include, for example, hydrocarbon groups, sulfo groups (including sulfonates), sulfonyl groups, sulfonamido groups, carboxylic acid groups (including carboxylates), amino groups, amide groups, phosphate groups (phosphorus). Acid salts and phosphate esters), phosphino groups, silanol groups, epoxy groups, isocyanate groups, cyano groups, thiol groups or hydroxyl groups.
- the third compound may be an organic material, an organic-inorganic composite material, a polymer material, or a monomolecular material as long as it is a compound having a chain hydrocarbon group at the terminal.
- the third compound has a chain hydrocarbon group at the terminal, the molecular structure other than that is not particularly limited, and any functional group, bonding site, hetero atom, halogen atom and metal You may have an atom.
- the unsaturated chain hydrocarbon group include unsaturated chain hydrocarbon groups having 2 or more carbon atoms.
- a propene group, a butene group, a pentene group, a hexene group, a heptene group, an octene group, a decene group, a dodecene group, a tetradecene group, a hexadecene group, an octadecene group, a dococene group, and the like can be given.
- the saturated chain hydrocarbon group include saturated chain hydrocarbon groups having 2 or more carbon atoms.
- organic material for example, a compound having a structure represented by the following formula (5) in the molecule can be used.
- organic-inorganic composite material for example, a compound having a structure represented by the following formula (6) in the molecule can be used.
- Whether or not the antifouling substrate has the fingerprint-resistant surface S can be confirmed as follows, for example. First, the dynamic contact angle of the surface of the antifouling substrate is measured, and whether or not the advancing contact angle of oleic acid is 15 ° or less and the receding contact angle of oleic acid is within a range of 10 ° or less. Check. If the oleic acid advancing contact angle and the oleic acid receding contact angle are within the above ranges, it can be determined that the antifouling substrate has the fingerprint-resistant surface S. The surface shape of the fingerprint-resistant surface S can be confirmed by surface observation with a scanning electron microscope, an atomic force microscope, or the like.
- a material on the surface of the antifouling substrate is extracted with a solvent, and then composition analysis is performed by gas chromatograph mass spectrometry (GC-MASS). If at least one of the first compound and the second compound described above is detected, it can be determined that the antifouling substrate has the fingerprint-resistant surface S. You may make it confirm whether the antifouling base material has the anti-fingerprint surface S combining the above-mentioned two confirmation methods.
- GC-MASS gas chromatograph mass spectrometry
- FIG. 2A is a plan view showing a configuration example of a plate-shaped master.
- FIG. 2B is a cross-sectional view taken along line aa shown in FIG. 2A.
- FIG. 2C is an enlarged cross-sectional view of a part of FIG. 2B.
- the plate-shaped master 31 is a master for producing an antifouling substrate having the above-described configuration, and more specifically, a master for molding a plurality of structures 12a on the above-described substrate surface.
- the master 31 has, for example, a surface provided with a fine concavo-convex structure, and the surface is a molding surface for molding a plurality of structures 12a on the substrate surface.
- a plurality of structures 32 are provided on the molding surface.
- the structure 32 has a concave shape with respect to the molding surface.
- a metal material can be used.
- the metal material for example, Ni, NiP, Cr, Cu, Al, Fe, or an alloy thereof can be used.
- the alloy it is preferable to use stainless steel (SUS).
- stainless steel (SUS) include, but are not limited to, SUS304, SUS420J2, and the like.
- the plurality of structures 32 provided on the molding surface of the plate-shaped master 31 and the plurality of structures 12a provided on the surface of the base material 11 have an inverted concavo-convex relationship. That is, the arrangement, size, shape, arrangement pitch, height, and the like of the structures 32 of the plate-shaped master 31 are the same as those of the structures 12 a of the base material 11.
- FIG. 3 is a schematic diagram showing a configuration example of a laser processing apparatus for producing a plate-shaped master.
- the laser body 40 is, for example, IFRIT (trade name) manufactured by Cyber Laser Corporation.
- the wavelength of the laser used for laser processing is, for example, 800 nm. However, the wavelength of the laser used for laser processing may be 400 nm or 266 nm.
- the repetition frequency is preferably larger in consideration of the processing time and the narrow pitch of the unevenness to be formed, and is preferably 1000 Hz or more.
- the pulse width of the laser is preferably shorter, and is preferably about 200 femtoseconds (10 ⁇ 15 seconds) to 1 picosecond (10 ⁇ 12 seconds).
- the laser body 40 emits laser light linearly polarized in the vertical direction. Therefore, in this apparatus, linear polarization or circular polarization in a desired direction is obtained by rotating the polarization direction using a wave plate 41 (for example, a ⁇ / 2 wave plate). Further, in the present apparatus, a part of the laser light is extracted using the aperture 42 having a square opening. This is because the intensity distribution of the laser beam is a Gaussian distribution, and only the vicinity of the center is used to obtain a laser beam having a uniform in-plane intensity distribution. In the present apparatus, the laser beam is narrowed down using two orthogonal cylindrical lenses 43 so as to obtain a desired beam size. When processing the plate-shaped master 31, the linear stage 44 is moved at a constant speed.
- the beam spot of the laser irradiated on the master 31 is preferably rectangular.
- the beam spot can be shaped using, for example, an aperture or a cylindrical lens.
- the intensity distribution of the beam spot is preferably as uniform as possible. This is because it is desired to make the in-plane distribution such as the depth of the unevenness formed in the mold as uniform as possible.
- the size of the beam spot is smaller than the area to be processed, it is necessary to give an uneven shape to all the areas to be processed by scanning the beam.
- the master (form) used for forming the fingerprint-resistant surface S is, for example, an ultra-short pulse width of 1 picosecond ( 10-12 seconds) or less on a substrate such as a metal such as SUS, NiP, Cu, Al, or Fe. It is formed by drawing a pattern using a pulse laser, so-called femtosecond laser.
- the polarization of the laser beam may be linearly polarized light, circularly polarized light, or elliptically polarized light.
- a pattern having desired irregularities can be formed by appropriately setting the laser wavelength, repetition frequency, pulse width, beam spot shape, polarization, laser intensity applied to the sample, laser scanning speed, and the like.
- the fluence is an energy density (J / cm 2 ) per pulse, and is obtained by the following equation.
- F P / (fREPT ⁇ S)
- S Lx ⁇ Ly
- F fluence
- P laser power
- fREPT laser repetition frequency
- S area at the laser irradiation position
- Lx ⁇ Ly beam size
- N fREPT ⁇ Ly / v Ly: Beam size in laser scanning direction
- v Laser scanning speed
- the material of the master 31 may be changed to obtain a desired shape.
- the shape to be laser processed varies depending on the material of the master 31.
- a semiconductor material such as DLC (diamond-like carbon) may be coated on the surface of the master. Examples of the method for coating the surface of the master with a semiconductor material include plasma CVD and sputtering.
- DLC DLC mixed with fluorine (F) (hereinafter referred to as FDLC), titanium nitride, chromium nitride, or the like can be used as the semiconductor material to be coated.
- the thickness of the film may be about 1 ⁇ m, for example.
- [Method for producing antifouling substrate] 4A to 5C are process diagrams for explaining an example of a method for manufacturing an antifouling substrate according to the first embodiment of the present technology.
- a plate-shaped master 31 is prepared.
- a surface 31A that is a surface to be processed of the master 31 is in a mirror state, for example.
- the surface 31A does not have to be in a mirror state.
- the surface 31A may have irregularities finer than the transfer pattern, or is equivalent to or more than the transfer pattern. Also rough irregularities may be formed.
- the surface 31A of the master 31 is laser processed as follows. First, a pattern is drawn on the surface 31A of the master 31 using an ultrashort pulse laser having a pulse width of 1 picosecond (10 ⁇ 12 seconds) or less, so-called femtosecond laser. For example, as shown in FIG. 4B, the surface 31A of the master 31 is irradiated with femtosecond laser light Lf and the irradiation spot is scanned with respect to the surface 31A.
- the laser wavelength, the repetition frequency, the pulse width, the beam spot shape, the polarization, the intensity of the laser applied to the surface 31A, the laser scanning speed, etc. are appropriately set, as shown in FIG. A plurality of structures 32 are formed.
- the shape transfer method includes a transfer method using an energy ray curable resin (hereinafter referred to as “energy ray transfer method”), a transfer method using a thermosetting resin (hereinafter referred to as “thermosetting transfer method”), or the like.
- energy ray transfer method an energy ray curable resin
- thermosetting transfer method a transfer method using a thermosetting resin
- thermal transfer method a transfer method using a thermoplastic resin composition
- the energy ray transfer method includes a 2P transfer method (Photo Polymerization: a shape imparting method using photocuring).
- a 2P transfer method Photo Polymerization: a shape imparting method using photocuring.
- the structure forming process will be described by dividing it into a structure forming process using an energy ray transfer method or a thermosetting transfer method and a structure forming process using a thermal transfer method.
- [Structure formation process using energy ray transfer method or thermosetting transfer method] (Preparation process of resin composition) 5A to 5C are process diagrams for explaining an example of the structure forming process using the energy beam transfer method or the thermosetting transfer method.
- the resin composition is dissolved in a solvent and diluted as necessary.
- various additives may be added to the resin composition as necessary. Dilution with a solvent is performed as necessary, and when dilution is unnecessary, the resin composition may be used without a solvent.
- the resin composition contains at least one of an energy ray curable resin composition and a thermosetting resin composition.
- the energy ray curable resin composition means a resin composition that can be cured by irradiation with energy rays.
- Energy rays are polymerization reactions of radicals such as electron beams, ultraviolet rays, infrared rays, laser beams, visible rays, ionizing radiation (X rays, ⁇ rays, ⁇ rays, ⁇ rays, etc.), microwaves, high frequencies, cations, anions, etc. Shows energy lines that can trigger.
- the energy ray curable resin composition may be used by mixing with other resin compositions as necessary, for example, by mixing with other curable resin compositions such as a thermosetting resin composition.
- the energy ray curable resin composition may be an organic-inorganic hybrid material. Moreover, you may make it mix and use 2 or more types of energy beam curable resin compositions. As the energy ray curable resin composition, it is preferable to use an ultraviolet curable resin composition that is cured by ultraviolet rays.
- the energy ray curable resin composition and the thermosetting resin composition include, for example, at least one of a first compound having an ester bond at a portion other than a terminal and a second compound having a cyclic hydrocarbon group. .
- the energy ray curable resin composition and / or thermosetting resin composition further includes a third compound having a chain hydrocarbon group at the terminal in addition to the second compound, from the viewpoint of improving fingerprint wiping properties. It is preferable to include.
- the first compound, the second compound, and the third compound may be additives.
- the additive is preferably a leveling agent.
- the ultraviolet curable resin composition contains, for example, a (meth) acrylate having a (meth) acryloyl group and an initiator.
- the (meth) acryloyl group means an acryloyl group or a methacryloyl group.
- (Meth) acrylate means acrylate or methacrylate.
- the ultraviolet curable resin composition includes, for example, a monofunctional monomer, a bifunctional monomer, a polyfunctional monomer, and the like. Specifically, the ultraviolet curable resin composition is a single material or a mixture of the following materials.
- Monofunctional monomers include, for example, carboxylic acids (acrylic acid), hydroxys (2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate), alkyls, alicyclics (isobutyl acrylate, t-butyl acrylate) , Isooctyl acrylate, lauryl acrylate, stearyl acrylate, isobornyl acrylate, cyclohexyl acrylate), other functional monomers (2-methoxyethyl acrylate, methoxyethylene crycol acrylate, 2-ethoxyethyl acrylate, tetrahydrofurfuryl acrylate, benzyl acrylate, Ethyl carbitol acrylate, phenoxyethyl acrylate, N, N-dimethylaminoethyl acrylate, N, N -Dimethylaminopropylacrylamide, N, N-di
- bifunctional monomer examples include tri (propylene glycol) diacrylate, trimethylolpropane diallyl ether, urethane acrylate, and the like.
- polyfunctional monomer examples include trimethylolpropane triacrylate, dipentaerythritol penta and hexaacrylate, and ditrimethylolpropane tetraacrylate.
- the initiator examples include 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, and the like. Can be mentioned.
- the solvent is used by being blended in the resin composition from the viewpoint of, for example, the coating property and stability of the resin component and the smoothness of the coating film.
- the solvent for example, water or an organic solvent can be used.
- aromatic solvents such as toluene and xylene
- alcohols such as methyl alcohol, ethyl alcohol, n-propyl alcohol, iso-propyl alcohol, n-butyl alcohol, iso-butyl alcohol, propylene glycol monomethyl ether Solvents
- ester solvents such as methyl acetate, ethyl acetate, butyl acetate, cellosolve acetate
- ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone
- Glycol ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl
- a high boiling point solvent can be further added to control the evaporation rate of the solvent.
- a high boiling point solvent can be further added to control the evaporation rate of the solvent.
- solvents may be
- the prepared resin composition 33 is apply
- Application methods include, for example, wire bar coating, blade coating, spin coating, reverse roll coating, die coating, spray coating, roll coating, gravure coating, micro gravure coating, lip coating, air knife coating, curtain coating, comma coating method A dipping method or the like can be used.
- the printing method for example, a relief printing method, an offset printing method, a gravure printing method, an intaglio printing method, a rubber plate printing method, an ink jet method, a screen printing method and the like can be used.
- the drying conditions are not particularly limited, and may be natural drying or artificial drying that adjusts the drying temperature, drying time, and the like.
- the drying temperature and the drying time can be appropriately determined depending on the boiling point of the solvent contained in the paint. In that case, it is preferable to select the drying temperature and the drying time in a range in which the base material 11 is not deformed by heat shrinkage in consideration of the heat resistance of the base material 11.
- FIG. 5B the plate-shaped master 31 and the resin composition 33 applied to the surface of the substrate 11 are brought into close contact with each other, and the resin composition 33 is cured, and then the cured resin composition.
- the base material 11 integrated with 33 is peeled off.
- FIG. 5C the antifouling base material in which the some structure 12a was formed in the surface of the base material 11 is obtained. Under the present circumstances, you may make it further form the base layer 12b between the structure 12a and the base material 11 as needed (refer FIG. 1C).
- the curing method varies depending on the type of the resin composition 33.
- an energy ray curable resin composition is used as the resin composition 33
- the plate-shaped master 51 is pressed against the resin composition 33 to bring them into close contact with each other, and energy rays such as ultraviolet rays (ultraviolet light) are used as an energy ray source.
- the resin composition 33 is cured by irradiating the resin composition 33 from 34 through the substrate 11.
- the energy ray source 34 can emit energy rays such as electron beam, ultraviolet ray, infrared ray, laser beam, visible ray, gamma ray, ionizing radiation (X ray, ⁇ ray, ⁇ ray, ⁇ ray, etc.), microwave, or high frequency. Any material can be used as long as it is not particularly limited, but those capable of emitting ultraviolet rays are preferable from the viewpoint of production equipment.
- the integrated irradiation dose is preferably selected as appropriate in consideration of the curing characteristics of the resin composition, the suppression of yellowing of the resin composition and the substrate 11, and the like. Moreover, it is preferable to select suitably as atmosphere of irradiation according to the kind of resin composition, For example, the atmosphere of inert gas, such as air, nitrogen, and argon, is mentioned.
- the plate-like master 31 is made of a material that can transmit energy rays (for example, quartz). You may make it irradiate an energy beam with respect to the resin composition 33 from the back surface (surface on the opposite side to a shaping
- the plate-shaped master 31 When a thermosetting resin composition is used as the resin composition 33, the plate-shaped master 31 is pressed against the resin composition 33 to bring them into close contact with each other and the resin composition 33 is heated to the curing temperature by the plate-shaped master 31. And cure. At this time, a cooling roll may be pressed against the surface of the base material 11 on the side opposite to the side on which the resin composition 33 is applied or printed to prevent heat loss of the base material 11.
- the plate-like master 31 is provided with a heat source such as a heater in the inside or the back thereof, and is configured to be able to heat the resin composition 33 that is in close contact with the molding surface of the plate-like master 31.
- FIG. 6A a base material 11 having a resin layer 35 as a transfer layer provided on the surface is formed.
- the resin layer 35 includes, for example, a thermoplastic resin composition.
- the thermoplastic resin composition contains at least one of the first compound and the second compound.
- the thermoplastic resin composition contains the second compound, it is preferable that the thermoplastic resin composition further contains a third compound together with the second compound.
- the plate-shaped master 31 is pressed against the resin layer 35 to bring them into close contact with each other and, for example, the resin layer 35 is heated near or above its glass transition point to thereby obtain a plate-shaped master.
- the shape of the molding surface 31 is transferred.
- the shape-transferred resin layer 35 is peeled off from the plate-shaped master 31 together with the base material 11.
- the antifouling base material in which the some structure 12a was formed in the surface of the base material 11 is obtained. Under the present circumstances, you may make it further form the base layer 12b between the structure 12a and the base material 11 as needed (refer FIG. 1C).
- a cooling roll may be pressed against the surface of the base material 11 on the side opposite to the side where the resin layer 35 is provided to prevent heat loss of the base material 11.
- the antifouling layer 12 includes at least one of a first compound having an ester bond at a portion other than the terminal and a second compound having a cyclic hydrocarbon group, A plurality of structures 12 a are provided on the fingerprint-resistant surface S. Therefore, when a fingerprint is attached to the anti-fingerprint surface S of the antifouling substrate, the fingerprint pattern spreads wet without doing anything, making it difficult to see the attached fingerprint. Further, since the fine uneven surface S has a fluctuation in shape, it is possible to prevent spectroscopy.
- the fingerprint adhering to the anti-fingerprint surface S of the antifouling substrate can be rubbed with a finger or the like to make it slightly wet and spread, making it inconspicuous. Therefore, the fingerprint wiping property with a finger or the like can be improved.
- this antifouling substrate or the antifouling layer 12 is applied to an electronic device such as an input device or a display device, fingerprints can be made inconspicuous while these devices are being used. Therefore, an electronic device having excellent fingerprint resistance can be provided.
- the antifouling layer 12 has an example in which the antifouling layer 12 includes both the second compound having a cyclic hydrocarbon group and the third compound having a chain hydrocarbon group at the terminal.
- the present technology is not limited to this example.
- the antifouling layer 12 may include a fourth compound having a cyclic hydrocarbon group and having a chain hydrocarbon group at the terminal. Also in this case, the fingerprint wiping property similar to that of the first embodiment described above can be obtained.
- the configuration in which the antifouling layer 12 is provided adjacent to the surface of the substrate 11 is described as an example.
- the configuration of the antifouling substrate is limited to this example. is not.
- the modification of an antifouling base material is demonstrated.
- FIG. 7A is a cross-sectional view illustrating a configuration example of the antifouling substrate according to the first modification.
- the antifouling substrate is further provided with an anchor layer 13 provided between the substrate 11 and the antifouling layer 12, and the antifouling substrate according to the first embodiment is provided. It is different from the material.
- a plurality of structures 12 a may be configured by providing a fine uneven structure on the surface of the anchor layer 13 and providing the antifouling layer 12 following the uneven structure.
- the material of the anchor layer 13 for example, a wide variety of conventionally known natural polymer resins and synthetic polymer resins can be used.
- these resins for example, transparent thermoplastic resins, transparent curable resins that are cured by irradiation with ionizing radiation or heat can be used.
- thermoplastic resin for example, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polymethyl methacrylate, nitrocellulose, chlorinated polyethylene, chlorinated polypropylene, ethyl cellulose, hydroxypropyl methyl cellulose, and the like can be used.
- the transparent curable resin for example, methacrylate, melamine acrylate, urethane acrylate, isocyanate, epoxy resin, polyimide resin, or the like can be used.
- the ionizing radiation for example, an electron beam, light (for example, ultraviolet ray, visible ray, etc.), gamma ray, electron beam and the like can be used, and ultraviolet ray is preferable from the viewpoint of production equipment.
- the material of the anchor layer 13 may further include an additive.
- the additives include surfactants, viscosity modifiers, dispersants, curing accelerating catalysts, plasticizers, stabilizers such as antioxidants and antisulfurizing agents, and the like.
- FIG. 7B is a cross-sectional view illustrating a configuration example of the antifouling substrate according to the second modification.
- this antifouling substrate is further provided with a hard coat layer 14 provided between the substrate 11 and the antifouling layer 12, and the antifouling property according to the first embodiment. It is different from the substrate.
- a resin substrate such as a plastic film
- a plurality of structures 12 a may be configured by providing a fine uneven structure on the surface of the hard coat layer 14 and providing the antifouling layer 12 following the uneven structure.
- the material of the hard coat layer 14 for example, it can be widely selected from conventionally known natural polymer resins and synthetic polymer resins.
- these resins for example, transparent thermoplastic resins, ionizing radiation, or transparent curable resins that are cured by heat can be used.
- the thermoplastic resin for example, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polymethyl methacrylate, nitrocellulose, chlorinated polyethylene, chlorinated polypropylene, ethyl cellulose, hydroxypropyl methyl cellulose, and the like can be used.
- the transparent curable resin for example, methacrylate, melamine acrylate, urethane acrylate, isocyanate, epoxy resin, polyimide resin, or the like can be used.
- the ionizing radiation for example, an electron beam, light (for example, ultraviolet ray, visible ray, etc.), gamma ray, electron beam and the like can be used, and ultraviolet ray is preferable from the viewpoint of production equipment.
- the material of the hard coat layer 14 may further contain an additive.
- the additives include surfactants, viscosity modifiers, dispersants, curing accelerating catalysts, plasticizers, stabilizers such as antioxidants and antisulfurizing agents, and the like.
- the hard coat layer 14 may further include light scattering particles such as an organic resin filler that scatters light in order to impart an AG (Anti-Glare) function to the anti-fingerprint surface S. In this case, the light scattering particles may protrude from the surface of the hard coat layer 14 or the fingerprint-resistant surface S of the antifouling layer 12 or may be covered with a resin contained in the hard coat layer 14 or the antifouling layer 12.
- the light scattering particles may or may not be in contact with the base material 11 which is the lower layer. Both the hard coat layer 14 and the antifouling layer 12 may further contain light scattering particles. Further, instead of the AG (Anti-Glare) function or in addition to the AG (Anti-Glare) function, an AR (Anti-Reflection) function may be imparted to the antifouling substrate.
- the AR (Anti-Reflection) function can be imparted to, for example, forming an AR layer on the hard coat layer 14.
- the AR layer for example, a single layer film of a low refractive index layer, or a multilayer film in which low refractive index layers and high refractive index layers are alternately stacked can be used.
- FIG. 7C is a cross-sectional view illustrating a configuration example of the antifouling substrate according to the third modification. As shown in FIG. 7C, this antifouling substrate is provided between the hard coat layer 14 provided between the substrate 11 and the antifouling layer 12 and between the substrate 11 and the hard coat layer 14.
- the anti-stain substrate according to the first embodiment is different in that the anchor layer 13 is further provided.
- a resin substrate such as a plastic film is used as the substrate 11, it is particularly preferable to provide the hard coat layer 14 as described above.
- FIG. 8A is a cross-sectional view illustrating a configuration example of an antifouling substrate according to a fourth modification.
- this antifouling substrate is different from the antifouling substrate according to the first embodiment in that it further includes hard coat layers 14 on both surfaces of the substrate 11.
- the antifouling layer 12 is provided on one surface of the hard coat layers 14 provided on both surfaces of the substrate 11.
- a resin substrate such as a plastic film
- FIG. 8B is a cross-sectional view illustrating a configuration example of the antifouling substrate according to the fifth modification.
- this antifouling substrate is different from the antifouling substrate according to the first embodiment in that it further includes an anchor layer 13 and a hard coat layer 14 on both surfaces of the substrate 11. ing.
- Anchor layer 13 is provided between substrate 11 and hard coat layer 14.
- the antifouling layer 12 is provided on one surface of the hard coat layers 14 provided on both surfaces of the substrate 11.
- a resin substrate such as a plastic film
- FIG. 8C is a cross-sectional view showing a configuration example of the antifouling substrate according to the sixth modification.
- This antifouling substrate is a transparent conductive substrate having antifouling properties, and as shown in FIG. 8C, a transparent conductive layer is formed on the surface of the substrate 11 on the side opposite to the antifouling layer 12 side. 15 in that the antifouling substrate according to the first embodiment is different.
- the transparent conductive layer 15 may be a transparent electrode having a predetermined electrode pattern. Examples of the electrode pattern include a stripe shape, but are not limited thereto. You may make it further provide an overcoat layer in the surface of the transparent conductive layer 15 as needed. You may make it further provide a hard-coat layer and / or an anchor layer between the base material 11 and the transparent conductive layer 15 as needed.
- the material of the transparent conductive layer 15 for example, one or more selected from the group consisting of electrically conductive metal oxide materials, metal materials, carbon materials, conductive polymers, and the like can be used.
- the metal oxide material include indium tin oxide (ITO), zinc oxide, indium oxide, antimony-added tin oxide, fluorine-added tin oxide, aluminum-added zinc oxide, gallium-added zinc oxide, silicon-added zinc oxide, and zinc oxide.
- ITO indium tin oxide
- zinc oxide indium oxide-tin oxide system
- zinc oxide-indium oxide-magnesium oxide system and the like.
- metal material for example, metal nanofillers such as metal nanoparticles and metal nanowires can be used.
- Such materials include copper, silver, gold, platinum, palladium, nickel, tin, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantel, titanium, bismuth, Examples thereof include metals such as antimony and lead, and alloys thereof.
- the carbon material include carbon black, carbon fiber, fullerene, graphene, carbon nanotube, carbon microcoil, and nanohorn.
- the conductive polymer for example, substituted or unsubstituted polyaniline, polypyrrole, polythiophene, and one or two (co) polymers selected from these can be used.
- a PVD method such as a sputtering method, a vacuum evaporation method, an ion plating method, a CVD method, a coating method, a printing method, or the like can be used, but the method is not limited thereto. It is not a thing.
- FIG. 9A is a cross-sectional view illustrating a configuration example of an antifouling substrate according to the second embodiment of the present technology.
- FIG. 9B is an enlarged cross-sectional view of a part of FIG. 9A.
- this antifouling substrate is different from the first embodiment in that a substrate 21 and a plurality of structures 22 are integrally formed.
- the material of the base material 21 and the structure 22 the same material as that of the antifouling layer 12 in the first embodiment described above is used.
- the material of the base material 21 and the structure 22 preferably includes a thermoplastic resin composition.
- the thermoplastic resin composition preferably contains at least one of the first compound and the second compound.
- the base material 21 and the structure 22 are the same as the base material 11 and the structure 12a in the first embodiment described above, except for the constituent materials.
- a melt extrusion method or a transfer method can be used as a method for producing the antifouling substrate.
- a melt extrusion method for example, a method of transferring the shape of the roll surface to the resin material by niping with two rolls immediately after the thermoplastic resin composition is discharged from the die into a film or the like is used.
- a roll master can be used as one of the two rolls.
- the roll master will be described later.
- the transfer method for example, a thermal transfer method in which the shape of the molding surface of the master disk is transferred by pressing the molding surface of the master disk against the substrate and heating near or above its glass transition point can be used.
- the master the plate-like master 31 in the first embodiment described above can be used.
- FIG. 10A is a cross-sectional view illustrating a configuration example of an antifouling substrate according to the third embodiment of the present technology.
- FIG. 10B is an enlarged cross-sectional view of a part of FIG. 10A.
- the antifouling base material includes a base material 11 and an antifouling structure layer 23 provided on the surface of the base material 11.
- the antifouling structure layer 23 includes a fine structure layer 24 provided on the surface of the substrate 11 and an antifouling layer 25 provided on the fine structure surface of the fine structure layer 24. Note that in the third embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.
- a plurality of surface structures (first structures) 23 a are provided on the fingerprint-resistant surface S of the antifouling layer 25.
- a plurality of internal structures (second structures) 24 a are provided on the surface of the fine structure layer 24.
- the surface structure 23a is configured by providing an antifouling layer 25 so as to follow the internal structure 24a.
- the arrangement, shape, pitch (average pitch), arithmetic average roughness, and the like of the surface structure 23a are the same as those of the structure 12a in the first embodiment.
- the fine structure layer 24 may further include a base layer 24b between the surface of the substrate 11 and the internal structure 24a as necessary. You may have the structure by which the base material 11 and the fine structure layer 24 were integrally molded.
- the material of the antifouling layer 25 is the same as the material of the antifouling layer 12 in the first embodiment.
- the fine structure layer 24 may be a functional layer such as an anchor layer or a hard coat layer.
- the film thickness of the antifouling layer 25 is selected so that, for example, when the antifouling layer 25 is formed on the surface of the fine structure layer 24, the shape of the internal structure 24a is not buried in the fine structure layer 24. .
- the film thickness of the antifouling layer 25 is in the range of, for example, a monomolecular thickness of 10 ⁇ m or less, preferably a monomolecular thickness of 1 ⁇ m or less, particularly preferably a monomolecular thickness of 100 nm or less.
- a resin composition containing at least one of a first compound having an ester bond at a portion other than the terminal and a second compound having a cyclic hydrocarbon group is prepared.
- this resin composition the same resin composition as that used for forming the antifouling layer 12 in the first embodiment described above can be used.
- the prepared resin composition is applied or printed on the surface of the substrate 11 provided with the plurality of internal structures 24a.
- the resin composition is applied or printed so as to follow the surface shape of the internal structure 24a.
- the drying process is provided in the next process, you may make it a resin composition imitate the surface shape of the internal structure 24a after a drying process.
- the resin composition is dried and cured as necessary.
- the antifouling layer 25 is formed on the plurality of internal structures 24a so as to follow the surfaces of the internal structures 24a. That is, an anti-fingerprint surface S having a plurality of surface structures 23 a is formed on the surface of the substrate 11.
- the intended antifouling substrate is obtained.
- the antifouling layer 25 is provided so as to follow the plurality of internal structures 24a of the fine structure layer 24, and the plurality of surface structures 23a are configured on the anti-fingerprint surface S. The same effect as that of the first embodiment can be obtained.
- the antifouling substrate according to the fourth embodiment is the antifouling substrate according to the third embodiment in that the adsorbing compound 25a is adsorbed on the surface of the internal structure 24a and the antifouling layer 25 is formed. It is different from the conductive substrate.
- a functional layer (anchor layer, hard coat layer, etc.) other than the antifouling layer 25 may be further provided on the surface of the substrate 11.
- the antifouling layer 25 is, for example, a monomolecular layer formed by the adsorption compound 25a.
- the region where the adsorbing compound 25a is adsorbed is not limited to one surface of the substrate 11 on which the internal structure 24a is provided, but may be both surfaces of the substrate 11 or a partial region thereof.
- the adsorptive compound 25a may be selectively adsorbed only on a surface frequently touched with a hand or a finger or a predetermined region.
- the adsorption position of the adsorption compound 25a on the surface of the internal structure 24a may be either the side chain or the end of the main chain of the adsorption compound 25a, and both may be adsorbed on the surface of the substrate 11.
- FIG. 11A shows a configuration in which one end of the main chain of the adsorption compound 25a is adsorbed on the surface of the internal structure 24a.
- FIG. 11B shows a configuration in which the end of the side chain of the adsorption compound 25a is adsorbed on the surface of the internal structure 24a.
- FIG. 11C shows a configuration in which the main chain of the adsorption compound 25a is adsorbed on the surface of the internal structure 24a.
- the adsorption may be either physical adsorption or chemical adsorption, but chemical adsorption is preferable from the viewpoint of durability.
- Specific examples of the adsorption include adsorption by an acid-base reaction, a covalent bond, an ionic bond, a hydrogen bond, and the like.
- adsorbing compound 25a for example, a compound obtained by further providing an adsorbing group that adsorbs to the surface of the substrate 11 to the first compound and the second compound in the first embodiment described above can be used.
- the position where the adsorbing group is provided may be either the end or the side chain of the adsorbing compound 25a, and a plurality of adsorbing groups may be provided in one adsorbing compound 25a.
- the adsorbing group only needs to be adsorbed on the internal structure 24a.
- sulfo group including sulfonate
- sulfonyl group carboxylic acid group (including carboxylate)
- amino group including carboxylate
- phosphate group including phosphate and phosphate ester
- phosphino group epoxy group
- Isocyanate group thiol group and the like. It suffices that at least one such adsorbing group exists in the adsorbing compound 25a.
- the first compound having an adsorbing group for example, a compound having a structure represented by the following formula (7) in the molecule can be used.
- X is, for example, a sulfo group (including a sulfonate), a sulfonyl group, a carboxylic acid group (including a carboxylate), an amino group, a phosphate group (including a phosphate and a phosphate ester), and a phosphino group. , Epoxy group, isocyanate group or thiol group.
- the second compound having an adsorbing group for example, a compound having a structure represented by the following formula (8) in the molecule can be used.
- X is, for example, a sulfo group (including a sulfonate), a sulfonyl group, a carboxylic acid group (including a carboxylate), an amino group, a phosphate group (including a phosphate and a phosphate ester), and a phosphino group. , Epoxy group, isocyanate group or thiol group.
- the third compound having an adsorbing group for example, a compound having a structure represented by the following formula (9) in the molecule can be used.
- X is, for example, a sulfo group (including a sulfonate), a sulfonyl group, a carboxylic acid group (including a carboxylate), an amino group, a phosphate group (including a phosphate and a phosphate ester), and a phosphino group. , Epoxy group, isocyanate group or thiol group.
- a treatment solution is prepared by dissolving the adsorption compound 25a in a solvent.
- the adsorbing compound 25a is a liquid at normal temperature, or when the adsorbing compound 25a is heated to a liquid state, the adsorbing compound 25a may be used as it is without being dissolved in a solvent.
- the adsorption compound 25a is adsorbed. Increasing the amount of the adsorbed compound in the treatment solution improves the adsorption rate, so that the compound concentration is preferably large, specifically 0.01 mass% or more.
- a solvent capable of dissolving the adsorption compound 25a at a predetermined concentration can be appropriately selected and used.
- aromatic solvents such as toluene and xylene
- alcohols such as methyl alcohol, ethyl alcohol, n-propyl alcohol, iso-propyl alcohol, n-butyl alcohol, iso-butyl alcohol, propylene glycol monomethyl ether Solvents; ester solvents such as methyl acetate, ethyl acetate, butyl acetate, cellosolve acetate
- ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone; 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol,
- Glycol ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, propylene glycol methyl ether
- the base material 11 that is the processing target is immersed in the processing solution, or a certain amount of processing solution is applied or printed on one or both surfaces of the base material 11 that is the processing target.
- coating methods include wire bar coating, blade coating, spin coating, reverse roll coating, die coating, spray coating, roll coating, gravure coating, micro gravure coating, lip coating, air knife coating, curtain coating, and comma coating.
- a dipping method or the like can be used.
- the printing method for example, a relief printing method, an offset printing method, a gravure printing method, an intaglio printing method, a rubber plate printing method, an ink jet method, a screen printing method and the like can be used.
- the base material 11 may be washed with a good solvent for the adsorption compound 25a to wash away the unadsorbed adsorption compound 25a. Then, if necessary, the adsorption process is completed by drying.
- a drying method for example, natural drying or artificial drying using a heating device or the like may be used.
- the adsorption speed of the adsorption compound 25a can be increased by performing a heat treatment and / or an ultrasonic treatment while the base material 11 as the treatment object is immersed.
- the coating method when the treatment solution is applied to the substrate 11, heat treatment and / or ultrasonic treatment for the substrate 11 may be used in combination. After the application, the substrate 11 may be washed with a good solvent for the adsorption compound 25a as needed to wash away the unadsorbed adsorption compound 25a. Then, if necessary, the adsorption process is completed by drying.
- a drying method for example, natural drying or artificial drying using a heating device or the like may be used.
- the desired amount of treatment solution applied need not be achieved by a single application, and the desired amount of treatment solution applied can be achieved by repeating the above-described application and cleaning steps multiple times. Good.
- the adsorption compound 25a is adsorbed on the surface of the internal structure 24a and the antifouling layer 25 is formed on the surface of the internal structure 24a. Similar effects can be obtained.
- the method using the wet process is described as an example of the method for forming the antifouling layer 25.
- the method for forming the antifouling layer 25 is limited to this example. Instead, it is also possible to use a dry process. That is, the antifouling layer 25 of the third embodiment or the fourth embodiment described above can be directly formed on the surface of the internal structure 24a by a dry process.
- dry process examples include sputtering, thermal CVD (Chemical Vapor Deposition), plasma CVD, and ALD (Atomic). Layer Deposition) method, ion plating method and the like can be used.
- the fifth embodiment is different from the first embodiment in that an antifouling substrate is produced using a roll master.
- FIG. 12A is a perspective view illustrating a configuration example of a roll master.
- FIG. 12B is a cross-sectional view along the line aa shown in FIG. 12A.
- FIG. 12C is a cross-sectional view illustrating a part of FIG. 12B in an enlarged manner.
- the roll master 51 is a master for producing an antifouling substrate having the above-described configuration, and more specifically, a master for molding a plurality of structures 12a on the above-described substrate surface.
- the roll master 51 has, for example, a columnar shape or a cylindrical shape, and the columnar surface or the cylindrical surface is a forming surface for forming the plurality of structures 12a on the substrate surface.
- a plurality of structures 52 are provided on the molding surface.
- the structure 52 has a concave shape with respect to the molding surface.
- the plurality of structures 52 provided on the molding surface of the roll master 51 and the plurality of structures 12a provided on the surface of the base material 11 have an inverted concavo-convex relationship. That is, the arrangement, size, shape, arrangement pitch, height, and the like of the structures 52 of the roll master 51 are the same as those of the structures 12 a of the base material 11.
- FIG. 13 is a schematic diagram illustrating a configuration example of a laser processing apparatus for producing a roll master.
- the laser processing apparatus is the same as that of the above-described first embodiment except that the roll processing master 51 is rotated instead of the linear stage 44.
- [Method for producing antifouling substrate] 14A to 16B are process diagrams for explaining an example of a method for manufacturing an antifouling substrate according to the fifth embodiment of the present technology. Note that in the fifth embodiment, the same portions as those in the first or third embodiment are denoted by the same reference numerals, and description thereof is omitted.
- a columnar or cylindrical roll master 51 is prepared.
- the surface 51A which is the work surface of the roll master 51, is in a mirror state, for example. Note that the surface 51A may not be in a mirror state.
- the surface 51A may be provided with irregularities finer than the transfer pattern, or is equivalent to or more than the transfer pattern. Also rough irregularities may be formed.
- the surface 51A of the roll master 51 is laser processed as follows. First, a pattern is drawn on the surface 51A of the roll master 51 using an ultrashort pulse laser having a pulse width of 1 picosecond (10 ⁇ 12 seconds) or less, so-called femtosecond laser. For example, as shown in FIG. 14B, the surface 51A of the roll master 51 is irradiated with femtosecond laser light Lf, and the irradiation spot is scanned with respect to the surface 51A.
- the laser wavelength, the repetition frequency, the pulse width, the beam spot shape, the polarization, the intensity of the laser irradiated to the surface 51A, the scanning speed of the laser, etc. are appropriately set, as shown in FIG. A plurality of structures 52 having the structure is formed.
- [Structure formation process using energy ray transfer method or thermosetting transfer method] (Preparation process of resin composition) 15A and 15B are process diagrams for explaining an example of a structure forming process using an energy beam transfer method or a thermosetting transfer method.
- the resin composition is dissolved in a solvent and diluted as necessary.
- various additives may be added to the resin composition as necessary. Dilution with a solvent is performed as necessary, and when dilution is unnecessary, the resin composition may be used without a solvent.
- the prepared resin composition 33 is apply
- the curing method varies depending on the type of the resin composition 33.
- the roll master 51 is pressed against the resin composition 33 to bring them into close contact with each other, and energy rays such as ultraviolet rays (ultraviolet light) are emitted from the energy ray source 34.
- the resin composition 33 is cured by irradiating the resin composition 33.
- the roll original recording 51 is comprised with the material (for example, quartz) which can permeate
- the composition 33 may be irradiated with energy rays.
- the roll master 51 When using a thermosetting resin composition as the resin composition 33, the roll master 51 is pressed against the resin composition 33 to bring them into close contact with each other, and the resin composition 33 is heated to the curing temperature by the roll master 51 and cured. . At this time, a cooling roll may be pressed against the surface of the base material 11 on the side opposite to the side on which the resin composition 33 is applied or printed to prevent heat loss of the base material 11.
- the roll master 51 includes a heat source such as a heater in the inside thereof, and is configured to be able to heat the resin composition 33 in close contact with the molding surface of the roll master 51.
- FIG. 16A and 16B are process diagrams for explaining an example of a structure forming process using the thermal transfer method.
- the base material 21 contains, for example, a thermoplastic resin composition.
- the thermoplastic resin composition contains at least one of the first compound and the second compound.
- the thermoplastic resin composition contains the second compound, it is preferable that the thermoplastic resin composition further contains a third compound together with the second compound.
- the roll master 51 is pressed against the base material 21 to bring them into close contact with each other.
- the base 21 is heated near or above its glass transition point, thereby forming the molding surface of the roll master 51.
- the shape is transferred.
- the shape-transferred base material 21 is peeled from the roll master 51. Thereby, the antifouling base material in which the plurality of structures 22 are formed on the surface of the base material 21 is obtained.
- a cooling roll may be pressed against the surface of the base material 21 on the side opposite to the side on which the plurality of structures 22 are formed to prevent heat loss of the base material 21.
- the example of thermal transfer described above the example in which the roll master 51 is pressed against the base material 21 to form the structure 22 on the surface of the base material 21 has been described, but the example of thermal transfer is not limited to this.
- the resin layer 35 is formed on the surface of the base material 11
- the roll master 51 is pressed against the resin layer 35
- the structure 12 a is applied to the surface of the resin layer 35. May be formed.
- FIG. 17 is a perspective view illustrating a configuration example of the display device according to the sixth embodiment of the present technology.
- an antifouling body 100 is provided on the display surface S 1 of the display device 101.
- an antifouling layer for example, an antifouling layer, an antifouling structure layer or an antifouling substrate is used.
- the antifouling layer for example, the antifouling layer 12 according to the first embodiment is used.
- the antifouling structure layer for example, the antifouling structure layer 23 according to the third or fourth embodiment is used.
- the antifouling substrate for example, any of the antifouling substrates according to the first to fourth embodiments is used.
- the antifouling substrate As an antifouling body, it is possible to adopt a configuration of bonding via a bonding layer antifouling substrate on display surface S 1 of the display device 101.
- this configuration it is preferable to use a sheet having transparency and flexibility as the base material 11 of the antifouling base material.
- Examples of the display device 101 include a liquid crystal display, a CRT (Cathode Ray Tube) display, and a plasma display (Plasma).
- Various display devices such as a display panel (PDP), an electro luminescence (EL) display, and a surface-conduction electron-emitter display (SED) can be used.
- PDP display panel
- EL electro luminescence
- SED surface-conduction electron-emitter display
- a fingerprint adhering to the display surface S 1 of the display device 101 by including in the rubbed thin wetting and spreading the fingers can be inconspicuous. Therefore, the visibility of the display device 101 can be further improved.
- FIG. 18A is a perspective view illustrating a configuration example of a display device according to the seventh embodiment of the present technology.
- the input device 102 is provided on the display surface S 1 of the display device 101.
- the antifouling body 100 is provided on the input surface S 2 of the input device 102.
- the display device 101 and the input device 102 are bonded together via a bonding layer made of, for example, an adhesive.
- the antifouling body 100 for example, an antifouling layer, an antifouling structure layer or an antifouling substrate is used.
- the antifouling layer for example, the antifouling layer 12 according to the first embodiment is used.
- the antifouling structure layer for example, the antifouling structure layer 23 according to the third or fourth embodiment is used.
- the antifouling substrate for example, any of the antifouling substrates according to the first to fourth embodiments is used.
- the antifouling substrate it is possible to adopt a configuration of bonding via a bonding layer antifouling substrate on input surface S 2 of the input device 102.
- this configuration it is preferable to use a sheet having transparency and flexibility as the base material 11 of the antifouling base material.
- a resistive touch panel or a capacitive touch panel can be used, but the touch panel system is not limited to this.
- the resistive film type touch panel include a matrix resistive film type touch panel.
- Examples of the capacitive touch panel include a wire sensor type or an ITO grid type projected capacitive touch panel.
- the input surface S 2 of the input device 102 may be a fingerprint resistant surface S, if the fingerprint input surface S 2 of the input device 102 is attached, the fingerprint without doing anything The pattern spreads out and the attached fingerprint becomes difficult to see. Therefore, the visibility of the display device 101 provided with the input device 102 can be improved.
- a fingerprint adhering to the input surface S 2 of the input device 102 by rubbing lightly wet and spread with a finger or the like can be made less noticeable. Therefore, the visibility of the display device 101 provided with the input device 102 can be further improved.
- FIG. 18B is an exploded perspective view illustrating a modification of the input device according to the seventh embodiment of the present technology.
- a front panel (surface member) 103 may be further provided on the input surface S ⁇ b > 2 of the input device 102.
- an antifouling member 100 is provided on the panel surface S 3 of the front panel 103.
- the input device 102 and the front panel (surface member) 103 are bonded together by a bonding layer made of, for example, an adhesive.
- An electronic apparatus includes the display device 101 according to the sixth embodiment, the seventh embodiment, or a modification thereof.
- An antifouling body is provided on the surface of the casing of the electronic device as necessary.
- an antifouling layer for example, the antifouling layer 12 according to the first embodiment is used.
- the antifouling structure layer for example, the antifouling structure layer 23 according to the third or fourth embodiment is used.
- the antifouling substrate for example, any of the antifouling substrates according to the first to fourth embodiments is used. You may make it comprise the housing
- FIG. 19A is an external view illustrating an example of a television device as an electronic apparatus.
- the television device 111 includes a housing 112 and a display device 113 accommodated in the housing 112.
- the display device 113 is the display device 101 according to the sixth embodiment, the seventh embodiment, or a modification thereof.
- An antifouling body may be provided on the surface of the housing 112 as necessary, or the housing 112 itself may be formed of an antifouling substrate as necessary.
- FIG. 19B is an external view showing an example of a notebook personal computer as an electronic apparatus.
- the notebook personal computer 121 includes a computer main body 122 and a display device 125.
- the computer main body 122 and the display device 125 are housed in a housing 123 and a housing 124, respectively.
- the display device 125 is the display device 101 according to the sixth embodiment, the seventh embodiment, or a modification thereof.
- An antifouling body may be provided on the surfaces of the housing 123 and the housing 124 as necessary, or the housing 123 and the housing 124 may be formed of an antifouling base material as necessary.
- FIG. 20A is an external view illustrating an example of a mobile phone as an electronic device.
- the mobile phone 131 is a so-called smartphone, and includes a housing 132 and a display device 133 accommodated in the housing 132.
- the display device 133 is the display device 101 according to the seventh embodiment or its modification.
- An antifouling body may be provided on the surface of the housing 132 as necessary, or the housing 132 itself may be formed of an antifouling substrate as necessary.
- FIG. 20B is an external view illustrating an example of a tablet computer as an electronic device.
- the tablet computer 141 includes a housing 142 and a display device 143 accommodated in the housing 142.
- the display device 143 is the display device 101 according to the seventh embodiment or a modification thereof.
- An antifouling body may be provided on the surface of the housing 142 as necessary, or the housing 142 itself may be formed of an antifouling substrate as necessary.
- the electronic device since the electronic device includes the display device 101 according to the sixth embodiment, the seventh embodiment, or a modification thereof, the visibility of the display device 101 of the electronic device is improved. Can be made.
- the dirt on the housing surface can be made inconspicuous.
- the fingerprint attached to the surface of the casing of the electronic device can be made inconspicuous by rubbing with a finger etc. Therefore, the dirt on the surface of the housing can be made less noticeable.
- the apparatus shown in FIG. 3 was used as the laser processing apparatus.
- the laser body 40 IFRIT (trade name) manufactured by Cyber Laser Co., Ltd. was used.
- the laser wavelength was 800 nm
- the repetition frequency was 1000 Hz
- the pulse width was 220 fs.
- Example 1 a master was produced by coating DLC on the substrate surface. Next, a fine concavo-convex structure was formed on the surface of the DLC film of the master using a femtosecond laser. At this time, laser processing was performed under the laser processing conditions shown in Table 1. Thus, a plate-shaped master for shape transfer was obtained. Note that the size of the master was a rectangular shape of 2 cm ⁇ 2 cm.
- UV curable resin an ultraviolet curable resin composition
- Example 5 First, in the same manner as in Examples 1 to 4 described above, a fine concavo-convex structure was formed on the surface of a ZEONOR film (manufactured by ZEON Corporation, registered trademark) by UV imprinting. Next, a coating layer was further formed on the surface of the fine concavo-convex structure as follows.
- a UV curable resin having the following composition was applied by spin coating on the shape transfer surface of the obtained optical film, and dried to form a coating film following a plurality of protrusions on the surface of the optical film.
- the antifouling layer was formed on the surface by irradiating the coating film with ultraviolet rays and curing. Thus, the intended antifouling film was obtained.
- composition of UV curable antifouling resin Compound having the structure represented by the following formula (10): 1.5% by mass Photopolymerization initiator (manufactured by BASF Japan, trade name: Irgacure 184): 0.075% by mass Cyclohexanone: 96.325% by mass (Second compound having a cyclic hydrocarbon group)
- Example 6 An antifouling film was produced in the same manner as in Example 5 except that a UV curable resin having the following composition was applied to the shape transfer surface of the optical film by spin coating.
- a UV curable resin a resin containing a first compound having an ester bond at a portion other than the terminal was used.
- Example 7 An antifouling film was produced in the same manner as in Example 5 except that a UV curable resin having the following composition was applied to the shape transfer surface of the optical film by spin coating.
- a UV curable resin a resin containing a first compound having an ester bond at a portion other than the terminal was used.
- UV curable resin Acrylate oligomer having fluorine atom and siloxane moiety: 1.75% by mass Dipentaerythritol hexaacrylate (DPHA): 1.75% by mass Photopolymerization initiator (BASF Japan, trade name: Irgacure 184): 0.175% by mass Cyclohexanone: 96.325% by mass
- FIG. 21A, FIG. 22A, FIG. 23A, FIG. 24A, and FIG. 25A show the AFM images of the antireflection film surfaces of Example 1, Example 2, Example 3, Example 4, and Example 5, respectively.
- 21B, FIG. 22B, FIG. 23B, FIG. 24B, and FIG. 25B show cross-sectional profiles along the line aa in FIG. 21A, FIG. 22A, FIG. 23A, FIG.
- the average pitch Pm was obtained from the cross-sectional profile of the AFM image as follows. First, any two adjacent structures were selected from the cross-sectional profile of the AFM image, and the distance between these structures (the shortest distance between the tops of the minimum repeating structure) was obtained as the pitch. Next, this procedure was performed at any 10 locations on the fingerprint-resistant surface, and the pitches P1, P2,. Next, these pitches P1, P2,..., P10 were simply averaged (arithmetic average) to obtain an average pitch Pm.
- the arithmetic average roughness Ra was obtained from the AFM image as follows. First, the fingerprint-resistant surface S is observed with an atomic force microscope (AFM) with a visual field of 3 ⁇ m ⁇ 3 ⁇ m. Next, the arithmetic average roughness ra is obtained from the cross-sectional profile of the AFM image. Next, this procedure is performed at any 10 locations on the fingerprint-proof surface to obtain ra1, ra2,. Next, these ra1, ra2,..., Ra10 are simply averaged (arithmetic average) to obtain the arithmetic average roughness Ra.
- AFM atomic force microscope
- Table 1 shows the materials and laser processing conditions of the masters of Examples 1 to 7 and Comparative Example 1.
- Table 2 shows the evaluation results of the antifouling films of Examples 1 to 7 and Comparative Example 1.
- Tables 1 and 2 show the following.
- Example 7 the surface friction force was reduced as compared with Example 6 by blending an acrylate oligomer having a fluorine atom and a siloxane moiety in Example 7. Also in Example 6, since there are surface irregularities, the wiping comfort when the fingerprint adhering to the surface is wiped with a tissue (Erière) is good. This is presumably because the frictional force on the tissue was lowered due to surface irregularities. In Example 7 in which the surface friction force was further reduced, the wiping comfort was further improved.
- the present technology can also employ the following configurations.
- (1) It has a surface with a fine relief structure,
- the uneven structure includes at least one of a first compound having an ester bond at a portion other than a terminal and a second compound having a cyclic hydrocarbon group.
- (2) The antifouling body according to (1), wherein the uneven structure is fluctuating.
- (3) The uneven structure according to any one of (1) to (2), wherein the uneven structure includes a random nanostructure.
- the arithmetic average roughness of the surface is the antifouling body according to any one of (1) to (4), which is in the range of 5 nm to 100 nm.
- a substrate having a surface An antifouling layer provided on the surface of the substrate, The antifouling layer according to any one of (1) to (5), wherein the antifouling layer has the surface provided with the uneven structure.
- the antifouling layer contains at least one resin composition of an energy ray curable resin composition and a thermosetting resin composition, The antifouling body according to (6), wherein the resin composition contains at least one of the first compound and the second compound.
- the additive is a leveling agent.
- a plurality of structures are provided on the surface of the substrate, The antifouling body according to (6), wherein the antifouling layer is provided so as to follow the surfaces of the plurality of structures of the substrate.
- (11) The antifouling body according to (10), wherein at least one of the first compound and the second compound is adsorbed on the surfaces of the plurality of structures of the substrate.
- the structure includes a thermoplastic resin composition, The thermoplastic resin composition according to any one of (1) to (5), wherein the thermoplastic resin composition includes at least one of the first compound and the second compound.
- the first compound is represented by the following formula (1) or formula (2):
- the antifouling body according to any one of (1) to (5), wherein the second compound is represented by the following formula (3) or formula (4).
- R 1 is a group containing C, N, S, O, Si, P or Ti
- R 2 is a group having 2 or more carbon atoms.
- R 1 and R 2 are each independently a group containing C, N, S, O, Si, P or Ti.
- the antifouling layer further contains a third compound having a chain hydrocarbon group at the terminal together with the second compound.
- the third compound is represented by the following formula (5) or formula (6).
- An antifouling article comprising the antifouling body according to any one of (1) to (17).
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Abstract
Description
微細な凹凸構造が設けられた表面を有し、
凹凸構造は、末端以外の部分にエステル結合を有する第1の化合物、および環状炭化水素基を有する第2の化合物の少なくとも一方を含んでいる防汚体である。
微細な凹凸構造が設けられた入力面を有し、
凹凸構造は、末端以外の部分にエステル結合を有する第1の化合物、および環状炭化水素基を有する第2の化合物の少なくとも一方を含んでいる入力装置である。
微細な凹凸構造が設けられた表示面を有し、
凹凸構造は、末端以外の部分にエステル結合を有する第1の化合物、および環状炭化水素基を有する第2の化合物の少なくとも一方を含んでいる表示装置である。
微細な凹凸構造が設けられた表面を有し、
凹凸構造は、末端以外の部分にエステル結合を有する第1の化合物、および環状炭化水素基を有する第2の化合物の少なくとも一方を含んでいる電子機器である。
微細な凹凸構造が設けられた表面を有し、
凹凸構造は、末端以外の部分にエステル結合を有する第1の化合物、および環状炭化水素基を有する第2の化合物の少なくとも一方を含んでいる防汚性物品である。
1.第1の実施形態(耐指紋表面を有する防汚性基材の例)
2.第2の実施形態(耐指紋表面を有する防汚性基材の例)
3.第3の実施形態(耐指紋表面を有する防汚性基材の例)
4.第4の実施形態(耐指紋表面を有する防汚性基材の例)
5.第5の実施形態(防汚性基材の製造方法の例)
6.第6の実施形態(耐指紋表面を有する表示装置の例)
7.第7の実施形態(耐指紋表面を有する入力装置の例)
8.第8の実施形態(耐指紋表面を有する電子機器の例)
[防汚性基材の構成]
図1Aは、本技術の第1の実施形態に係る防汚性基材の平面図である。図1Bは、図1Aに示したa-a線に沿った断面図である。図1Cは、図1Bの一部を拡大して表す断面図である。防汚性基材(防汚体)は、耐指紋機能を有する耐指紋表面(防汚性表面)Sを有している。この耐指紋表面Sは、後述する特定の分子構造を含有する化合物を含み、さらに表面に微細な凹凸構造を有している。このため、耐指紋表面Sに付着した指紋が、何もせずとも濡れ広がり、見えにくくなり易い。また、耐指紋表面Sに付着した指紋を指などで擦ってうすく濡れ広がらせて、目立たなくすることができる。微細凹凸面Sは、形状に揺らぎを有している。このように形状に揺らぎを有することで、分光を防ぐことができる。
Display Panel:PDP)、エレクトロルミネッセンス(Electro Luminescence:EL)ディスプレイ、および表面伝導型電子放出素子ディスプレイ(Surface-conduction Electron-emitter Display:SED)などの各種表示装置が挙げられる。
基材11は、例えば、透明性を有する無機基材またはプラスチック基材である。基材11の形状としては、例えば、フィルム状、シート状、板状、ブロック状などを用いることができる。無機基材の材料としては、例えば、石英、サファイア、ガラスなどが挙げられる。プラスチック基材の材料としては、例えば、公知の高分子材料を用いることができる。公知の高分子材料としては、具体的には例えば、トリアセチルセルロース(TAC)、ポリエステル(TPEE)、ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート(PEN)、ポリイミド(PI)、ポリアミド(PA)、アラミド、ポリエチレン(PE)、ポリアクリレート、ポリエーテルスルフォン、ポリスルフォン、ポリプロピレン(PP)、ポリスチレン、ジアセチルセルロース、ポリ塩化ビニル、アクリル樹脂(PMMA)、ポリカーボネート(PC)、エポキシ樹脂、尿素樹脂、ウレタン樹脂、メラミン樹脂、フェノール樹脂、アクリロニトリル・ブタジエン・スチレン共重合体、シクロオレフィンポリマー(COP)、シクロオレフィンコポリマー(COC)、PC/PMMA積層体、ゴム添加PMMAなどが挙げられる。基材に図柄や模様が印刷或いは蒸着されていても良い。外装用途に使用する場合、基材11は透明性を有しなくても良い。材料としては、例えば、ステンレス鋼、マグネシウム合金、アルミニウム、アルミニウム合金、チタン合金、ガルバリウム鋼、炭素繊維強化プラスチックなどが挙げられる。
防汚層12は、耐指紋表面Sに微細な凹凸構造を有している。この凹凸構造は、ランダムなナノ構造である。より具体的には、この凹凸構造は、基材11の表面にランダムに設けられたナノサイズの複数の構造体12aにより構成されている。このように凹凸構造をランダムなナノ構造とすることで、分光を防ぐことができる。
複数の構造体12aは、基材11の表面に対して凸状を有している。複数の構造体12aは、基材11の表面にランダムに設けられている。構造体12aの形状としては、例えば、ストライプ状、網目状または針状を用いることができる。図1Aでは、構造体12aがストライプ状である例が示されている。構造体12aの形状としては、例えば、ストライプ状、網目状または針状を用いることができる。ここで、ストライプ状および網目状とは、耐指紋表面Sに対して垂直な方向から見たときの形状である。また、針状とは、耐指紋表面Sの面内方向から見たときの形状である。
まず、耐指紋表面Sを原子間力顕微鏡(AFM:Atomic Force Microscope)により観察する。次に、そのAFM像の断面プロファイルから、隣接する任意の2つの構造体12aを選び出し、それらの構造体間の距離(最小繰り返し構造のトップ間の最短距離)をピッチとして求める。次に、この手順を耐指紋表面の任意の10箇所で行い、ピッチP1、P2、・・・、P10を求める。次に、これらのピッチP1、P2、・・・、P10を単純に平均(算術平均)して平均ピッチPmを求める。
まず、耐指紋表面Sを原子間力顕微鏡(AFM:Atomic Force Microscope)により視野3μm×3μmで観察する。次に、そのAFM像の断面プロファイルから、算術平均粗さra求める。次に、この手順を耐指紋表面の任意の10箇所で行い、ra1、ra2、・・・、ra10を求める。次に、これらのra1、ra2、・・・、ra10を単純に平均(算術平均)して算術平均粗さRaを求める。
第1の化合物は、末端以外の部分にエステル結合を有していればよく、有機材料でも有機-無機の複合材料でも、また高分子材料でも単分子材料でも構わない。また、第1の化合物は、エステル結合を有してさえいれば、それ以外の分子構造については特に限定されるものではなく、いかなる官能基、結合部位、ヘテロ原子、ハロゲン原子および金属原子などを有していてもよい。第1の化合物としては、例えば、下記の式(1)または式(2)に示す構造を分子内に有する化合物を用いることができる。
(式中、R1はC、N、S、O、Si、PまたはTiなどの原子を含む基である。これらの原子を含む基は、例えば、炭化水素基、スルホ基(スルホン酸塩含む)、スルホニル基、スルホンアミド基、カルボン酸基(カルボン酸塩含む)、アミノ基、アミド基、リン酸基(リン酸塩、リン酸エステル含む)、フォスフィノ基、シラノール基、エポキシ基、イソシアネート基、シアノ基、チオール基または水酸基などである。R2は炭素数が2個以上の基であり、例えば、C、N、S、O、Si、PまたはTiなどの原子を含む基である。これらの原子を含む基は、例えば、炭化水素基、スルホ基(スルホン酸塩含む)、スルホニル基、スルホンアミド基、カルボン酸基(カルボン酸塩含む)、アミノ基、アミド基、リン酸基(リン酸塩、リン酸エステル含む)、フォスフィノ基、シラノール基、エポキシ基、イソシアネート基、シアノ基、チオール基または水酸基などである。)
第2の化合物は、環状炭化水素基を有している。環状炭化水素基は、例えば、不飽和環状炭化水素基および飽和環状炭化水素基のいずれであってもよく、不飽和環状炭化水素基および飽和環状炭化水素基の両方を分子内に有していてもよい。防汚層12が、不飽和環状炭化水素基を有する第2の化合物と飽和環状炭化水素基を有する第2の化合物とを両方含んでいてもよい。環状炭化水素基は単環式および多環式のいずれであってもよい。またこれらの環状炭化水素基は別の置換基を有していてもよい。別の置換基としては、例えば、炭化水素基、スルホ基(スルホン酸塩含む)、スルホニル基、スルホンアミド基、カルボン酸基(カルボン酸塩含む)、アミノ基、アミド基、リン酸基(リン酸塩、リン酸エステル含む)、フォスフィノ基、シラノール基、エポキシ基、イソシアネート基、シアノ基、チオール基または水酸基などである。第2の化合物は、環状炭化水素基を含んでいれば有機材料でも有機-無機の複合材料でも、また高分子材料でも単分子材料でも構わない。第2の化合物は、環状炭化水素基を有してさえいれば、それ以外の分子構造については特に限定されるものではなく、いかなる官能基、結合部位、ヘテロ原子、ハロゲン原子および金属原子などを有していてもよい。飽和環状炭化水素基としては、例えば、炭素数5以上のモノシクロ、ビシクロ、トリシクロ、テトラシクロ構造などを有する基を挙げることができる。より具体的には、シクロペンチル基、シクロヘキシル基、シクロヘプチル基、シクロオクチル基、シクロノニル基、シクロデシル基、シクロドデシル基、アダマンチル基、ノルアダマンチル基、トリシクロデシル基、テトラシクロドデシル基、ノルボルニル基、イソボルニル基、ステロイド基などを挙げることができる。不飽和環状炭化水素基としては、例えば、フェニル基、ナフチル基、ピレニル基、ペンタセニル基、アントリル基などを挙げることができる。
第3の化合物は、末端に鎖状炭化水素基(非環系炭化水素基)を有している。鎖状炭化水素基は、例えば、不飽和鎖状炭化水素基および飽和鎖状炭化水素基のいずれであってもよく、不飽和鎖状炭化水素基および飽和鎖状炭化水素基の両方を分子内に有していてもよい。鎖状炭化水素基は直鎖および分岐鎖のいずれであってもよく、直鎖の炭化水素基および分岐鎖の炭化水素基の両方を分子内に有していてもよい。また、鎖状炭化水素基は別の置換基を有していてもよい。別の置換基としては、例えば、炭化水素基、スルホ基(スルホン酸塩含む)、スルホニル基、スルホンアミド基、カルボン酸基(カルボン酸塩含む)、アミノ基、アミド基、リン酸基(リン酸塩、リン酸エステル含む)、フォスフィノ基、シラノール基、エポキシ基、イソシアネート基、シアノ基、チオール基または水酸基などが挙げられる。
防汚性基材が耐指紋表面Sを有しているか否かは、例えば以下のようにして確認することができる。まず、防汚性基材の表面の動的接触角を測定し、オレイン酸の前進接触角が15°以下であり、オレイン酸の後退接触角が10°以下の範囲内であるか否かを確認する。そして、オレイン酸の前進接触角およびオレイン酸の後退接触角が上記範囲内であれば、防汚性基材が耐指紋表面Sを有していると判断できる。また、耐指紋表面Sの表面形状は、走査型電子顕微鏡や原子間力顕微鏡などによる表面観察により確認が可能である。
まず、防汚性基材の表面の材料を溶剤で抽出後、組成分析をガスクロマトグラフ質量分析法(Gas Chromatograph-Mass Spectrometry:GC-MASS)で行う。そして、上述の第1の化合物および第2の化合物の少なくとも一方が検出されれば、防汚性基材が耐指紋表面Sを有していると判断できる。
上述の2つの確認方法を組み合わせて、防汚性基材が耐指紋表面Sを有しているか否かを確認するようにしてもよい。
図2Aは、板状の原盤の一構成例を示す平面図である。図2Bは、図2Aに示したa-a線に沿った断面図である。図2Cは、図2Bの一部を拡大して表す断面図である。板状の原盤31は、上述した構成を有する防汚性基材を作製するための原盤、より具体的には、上述した基材表面に複数の構造体12aを成形するための原盤である。原盤31は、例えば、微細な凹凸構造が設けられた表面を有し、その表面が基材表面に複数の構造体12aを成形するための成形面である。この成形面には、例えば、複数の構造体32が設けられている。構造体32は、成形面に対して凹状を有している。原盤31の材料としては、金属材料を用いることができる。金属材料としては、例えば、Ni、NiP、Cr、Cu、Al、Fe、またはその合金を用いることができる。合金としては、ステンレス鋼(SUS)を用いることが好ましい。ステンレス鋼(SUS)としては、例えば、SUS304、SUS420J2などが挙げられるが、これに限定されるものではない。
図3は、板状の原盤を作製するためのレーザ加工装置の一構成例を示す概略図である。レーザ本体40は、例えば、サイバーレーザー株式会社製のIFRIT(商品名)である。レーザ加工に用いるレーザの波長は、例えば800nmである。ただし、レーザ加工に用いるレーザの波長は、400nmや266nmなどでもかまわない。繰り返し周波数は、加工時間と、形成される凹凸の狭ピッチ化とを考慮すると、大きいほうが好ましく、1000Hz以上であることが好ましい。レーザのパルス幅は短い方が好ましく、200フェムト秒(10-15秒)~1ピコ秒(10-12秒)程度であることが好ましい。
F=P/(fREPT×S)
S=Lx×Ly
F:フルエンス
P:レーザのパワー
fREPT:レーザの繰り返し周波数
S:レーザの照射位置での面積
Lx×Ly:ビームサイズ
なお、パルス数Nは、1箇所に照射されたパルスの数であり、以下の式で求められるものである。
N=fREPT×Ly/v
Ly:レーザの走査方向のビームサイズ
v:レーザの走査速度
図4A~図5Cは、本技術の第1の実施形態に係る防汚性基材の製造方法の一例を説明するための工程図である。
まず、図4Aに示すように、板状の原盤31を準備する。この原盤31の被加工面である表面31Aは、例えば、鏡面状態となっている。なお、この表面31Aは鏡面状態となっていなくてもよく、例えば、表面31Aに、転写用のパターンよりも細かな凹凸が形成されていてもよいし、転写用のパターンと同等か、それよりも粗い凹凸が形成されていてもよい。
次に、上述のようにして得られた板状の原盤31を用いて、樹脂材料に形状転写し、基材11の表面に複数の構造体12aを形成することにより、上述の第1の実施形態に係る防汚性基材を作製する。形状転写の方法としては、例えばエネルギー線硬化性樹脂を用いる転写法(以下「エネルギー線転写法」という。)、熱硬化性樹脂を用いる転写法(以下「熱硬化転写法」という。)、または熱可塑性樹脂組成物を用いる転写法(以下「熱転写法」という。)を用いることができる。ここで、エネルギー線転写法には、2P転写法(Photo Polymerization:光硬化を利用した形状付与法)も含まれる。以下、構造形成工程を、エネルギー線転写法または熱硬化転写法を用いた構造形成工程と、熱転写法を用いた構造形成工程とに分けて説明する。
(樹脂組成物の調製工程)
図5A~図5Cは、エネルギー線転写法または熱硬化転写法を用いた構造形成工程の一例を説明するための工程図である。まず、必要に応じて樹脂組成物を溶媒に溶かして希釈する。この際、必要に応じて樹脂組成物に各種添加剤を添加するようにしてもよい。溶媒による希釈は必要に応じて行われ、希釈不要の場合には、樹脂組成物を無溶媒で用いてもよい。
次に、図5Aに示すように、調製した樹脂組成物33を基材の表面に塗布または印刷する。塗布方法としては、例えば、ワイヤーバーコーティング、ブレードコーティング、スピンコーティング、リバースロールコーティング、ダイコーティング、スプレーコーティング、ロールコーティング、グラビアコーティング、マイクログラビアコーティング、リップコーティング、エアーナイフコーティング、カーテンコーティング、コンマコート法、ディッピング法などを用いることができる。印刷方式としては、例えば、凸版印刷法、オフセット印刷法、グラビア印刷法、凹版印刷法、ゴム版印刷法、インクジェット法、スクリーン印刷法などを用いることができる。
次に、樹脂組成物33が溶媒を含んでいる場合には、必要に応じて樹脂組成物を乾燥させることにより、溶媒を揮発させる。乾燥条件は特に限定されるものではなく、自然乾燥であっても、乾燥温度や乾燥時間などを調整する人工的乾燥であってもよい。但し、乾燥時に塗料表面に風を当てる場合、塗膜表面に風紋が生じないようすることが好ましい。また、乾燥温度および乾燥時間は塗料中に含まれる溶媒の沸点によって適宜決定することが可能である。その場合、乾燥温度および乾燥時間は、基材11の耐熱性を配慮し、熱収縮により基材11の変形が起きない範囲で選定することが好ましい。
次に、図5Bに示すように、板状の原盤31と、基材11の表面に塗布された樹脂組成物33とを密着させ、樹脂組成物33を硬化させた後、硬化した樹脂組成物33と一体となった基材11を剥離する。これにより、図5Cに示すように、複数の構造体12aが基材11の表面に形成された防汚性基材が得られる。この際、必要に応じて、構造体12aと基材11との間に基底層12bをさらに形成するようにしてもよい(図1C参照)。
図6A~図6Cは、熱転写法を用いた構造形成工程の一例を説明するための工程図である。まず、図6Aに示すように、転写層としての樹脂層35が表面に設けられた基材11を形成する。樹脂層35は、例えば、熱可塑性樹脂組成物を含んでいる。熱可塑性樹脂組成物は、第1の化合物および第2の化合物の少なくとも一方を含んでいる。熱可塑性樹脂組成物が、第2の化合物を含む場合には、この第2の化合物と共に第3の化合物をさらに含んでいることが好ましい。
第1の実施形態によれば、防汚層12が末端以外の部分にエステル結合を有する第1の化合物、および環状炭化水素基を有する第2の化合物の少なくとも一方を含み、防汚層12の耐指紋表面Sには複数の構造体12aが設けられている。したがって、防汚性基材の耐指紋表面Sに指紋を付着させた場合、何もせずとも指紋のパターンが濡れ広がり、付着した指紋が見えにくくなる。また、微細凹凸面Sが形状に揺らぎを有することで、分光を防ぐことができる。
上述の第1の実施形態では、防汚層12が、環状炭化水素基を有する第2の化合物と、末端に鎖状炭化水素基を有する第3の化合物との両方の化合物を含む構成を例として説明したが、本技術はこの例に限定されるものではない。防汚層12が、環状炭化水素基を有し、かつ、末端に鎖状炭化水素基を有する第4の化合物を含む構成を採用してもよい。この場合にも、上述の第1の実施形態と同様の指紋払拭性を得ることができる。
図7Aは、第1の変形例に係る防汚性基材の一構成例を示す断面図である。この防汚性基材は、図7Aに示すように、基材11と防汚層12との間に設けられたアンカー層13をさらに備える点において、第1の実施形態に係る防汚性基材とは異なっている。このように基材11と防汚層12との間に設けられたアンカー層13を備えることで、基材11と防汚層12との密着性を向上させることができる。アンカー層13の表面に微細な凹凸構造を設け、この凹凸構造に倣うようにして防汚層12を設けることで、複数の構造体12aを構成するようにしてもよい。
図7Bは、第2の変形例に係る防汚性基材の一構成例を示す断面図である。この防汚性基材は、図7Bに示すように、基材11と防汚層12との間に設けられたハードコート層14をさらに備える点において、第1の実施形態に係る防汚性基材とは異なっている。基材11としてプラスチックフィルムなどの樹脂基材を用いる場合には、このようにハードコート層14を設けることが特に好ましい。上述したように基材11と防汚層12との間にハードコート層14を備えることで、実用特性(例えば耐久性や鉛筆硬度など)を向上させることができる。ハードコート層14の表面に微細な凹凸構造を設け、この凹凸構造に倣うようにして防汚層12を設けることで、複数の構造体12aを構成するようにしてもよい。
図7Cは、第3の変形例に係る防汚性基材の一構成例を示す断面図である。この防汚性基材は、図7Cに示すように、基材11と防汚層12との間に設けられたハードコート層14と、基材11とハードコート層14との間に設けられたアンカー層13とをさらに備える点において、第1の実施形態に係る防汚性基材とは異なっている。基材11としてプラスチックフィルムなどの樹脂基材を用いる場合には、このようにハードコート層14を設けることが特に好ましい。
図8Aは、第4の変形例に係る防汚性基材の一構成例を示す断面図である。この防汚性基材は、図8Aに示すように、基材11の両面にハードコート層14をさらに備える点において、第1の実施形態に係る防汚性基材とは異なっている。防汚層12は、基材11の両面に設けられたハードコート層14のうちの一方の表面上に設けられる。基材11としてプラスチックフィルムなどの樹脂基材を用いる場合には、このようにハードコート層14を設けることが特に好ましい。
図8Bは、第5の変形例に係る防汚性基材の一構成例を示す断面図である。この防汚性基材は、図8Bに示すように、基材11の両面にアンカー層13およびハードコート層14をさらに備える点において、第1の実施形態に係る防汚性基材とは異なっている。アンカー層13が、基材11とハードコート層14との間に設けられる。防汚層12は、基材11の両面に設けられたハードコート層14のうちの一方の表面上に設けられる。基材11としてプラスチックフィルムなどの樹脂基材を用いる場合には、このようにハードコート層14を設けることが特に好ましい。
図8Cは、第6の変形例に係る防汚性基材の一構成例を示す断面図である。この防汚性基材は、防汚性を有する透明導電性基材であり、図8Cに示すように、防汚層12の側とは反対側となる基材11の表面に、透明導電層15をさらに備える点において、第1の実施形態に係る防汚性基材とは異なっている。透明導電層15は、所定の電極パターンを有する透明電極であってもよい。電極パターンとしては、ストライプ状などが挙げられるが、これに限定されるものではない。透明導電層15の表面に必要に応じてオーバーコート層をさらに備えるようにしてもよい。基材11と透明導電層15との間に必要に応じてハードコート層および/またはアンカー層をさらに備えるようにしてもよい。
図9Aは、本技術の第2の実施形態に係る防汚性基材の一構成例を示す断面図である。図9Bは、図9Aの一部を拡大して表す断面図である。この防汚性基材は、図9Aおよび図9Bに示すように、基材21と複数の構造体22とが一体的に形成されている点において、第1の実施形態とは異なっている。基材21と構造体22の材料としては、上述の第1の実施形態における防汚層12と同様の材料が用いられる。具体的には、基材21と構造体22の材料としては、熱可塑性樹脂組成物を含むものが好ましい。この場合、熱可塑性樹脂組成物は、第1の化合物および第2の化合物の少なくとも一方を含んでいることが好ましい。基材21および構造体22はそれぞれ、構成材料以外の点では上述の第1の実施形態における基材11および構造体12aと同様である。
第2の実施形態では、基材21と複数の構造体22とが一体的に形成されているので、防汚性基材の構成を簡略化することができる。また、基材21と複数の構造体22とが透明性を有している場合には、基材21と複数の構造体22との間の界面反射を抑制することができる。
[防汚性基材の構成]
図10Aは、本技術の第3の実施形態に係る防汚性基材の一構成例を示す断面図である。図10Bは、図10Aの一部を拡大して表す断面図である。この防汚性基材は、基材11と、この基材11の表面に設けられた防汚構造層23とを備える。防汚構造層23は、基材11の表面に設けられた微細構造層24と、この微細構造層24の微細構造面に設けられた防汚層25とを備える。なお、第3の実施形態において第1の実施形態と同様の箇所には同一の符号を付して説明を省略する。
次に、上述の構成を有する防汚性基材の製造方法について説明する。
まず、上述の第1の化合物および第2の化合物のいずれの材料も含まれていない従来公知のエネルギー線硬化性樹脂または熱硬化性樹脂を用いる以外は、上述の第1の実施形態と同様にして、基材11の表面に内部構造体24aを形成する。但し、内部構造体24aの高さおよびアスペクト比などは、後工程で形成される表面構造体23aの高さおよびアスペクト比などが上述の第1の実施形態における構造体12aと同様になるように設定される。この工程において、必要に応じて基材11の表面と内部構造体24aとの間に基底層24bを設けるようにしてもよい。
第3の実施形態では、微細構造層24の複数の内部構造体24aに倣うように防汚層25を設け、複数の表面構造体23aを耐指紋表面Sに構成しているので、上述の第1の実施形態と同様の効果を得ることができる。
図11A~図11Cは、本技術の第4の実施形態に係る防汚性基材の構成例を示す模式図である。第4の実施形態に係る防汚性基材は、内部構造体24aの表面に吸着化合物25aが吸着されて、防汚層25が形成されている点において、第3の実施形態に係る防汚性基材とは異なっている。ここで、基材11の表面に防汚層25以外の機能層(アンカー層、ハードコート層など)がさらに設けられていてもよい。防汚層25は、例えば、吸着化合物25aにより形成される単分子層である。吸着化合物25aが吸着される領域は、内部構造体24aが設けられた基材11の一方の表面に限定されるものではなく、基材11の両方の表面、またはそれらの一部の領域であってもよく、手や指などで頻繁に触れる表面または所定の領域のみに選択的に吸着化合物25aを吸着させるようにしてもよい。
以下、ウエットプロセスを用いた防汚性基材の製造方法の一例について説明する。
まず、吸着化合物25aを溶媒に溶かして処理溶液を調製する。吸着化合物25aが常温で液体である場合、または加熱処理などを施して液体状態にした場合には、吸着化合物25aを溶媒に溶かさずに、そのまま用いるようにしてもよい。この処理溶液が内部構造体24aの表面に接近することで、吸着化合物25aが吸着される。処理溶液中の吸着化合物の量を増やしたほうが吸着速度は向上するため、化合物濃度は大きいほうが好ましく、具体的には0.01質量%以上が好ましい。
次に、例えば、処理対象物である基材11を処理溶液に浸漬するか、もしくは処理対象物である基材11の一方または両方の表面に一定量の処理溶液を塗布または印刷する。
第4の実施形態によれば、内部構造体24aの表面に吸着化合物25aを吸着させて、防汚層25を内部構造体24aの表面に形成しているので、上述の第1の実施形態と同様の効果を得ることができる。
上述の第3の実施形態および第4の実施形態では、防汚層25の形成方法としてウエットプロセスを用いる方法を例として説明したが、防汚層25の形成方法はこの例に限定されるものではなく、ドライプロセスを用いることも可能である。すなわち、ドライプロセスにより、上述の第3の実施形態または第4の実施形態の防汚層25を内部構造体24aの表面に直接成膜することも可能である。
Layer Deposition)法、イオンプレーティング法などを用いることができる。
第5の実施形態は、ロール原盤を用いて防汚性基材を製造する点において、第1の実施形態とは異なっている。
図12Aは、ロール原盤の一構成例を示す斜視図である。図12Bは、図12Aに示したa-a線に沿った断面図である。図12Cは、図12Bの一部を拡大して表す断面図である。ロール原盤51は、上述した構成を有する防汚性基材を作製するための原盤、より具体的には、上述した基材表面に複数の構造体12aを成形するための原盤である。ロール原盤51は、例えば、円柱状または円筒状の形状を有し、その円柱面または円筒面が基材表面に複数の構造体12aを成形するための成形面とされる。この成形面には、例えば、複数の構造体52が設けられている。構造体52は、成形面に対して凹状を有している。
図13は、ロール原盤を作製するためのレーザ加工装置の一構成例を示す概略図である。レーザ加工装置は、リニアステージ44に代えて、ロール原盤51を回転させる構成を有している点以外は、上述の第1の実施形態と同様である。
図14A~図16Bは、本技術の第5の実施形態に係る防汚性基材の製造方法の一例を説明するための工程図である。なお、第5の実施形態において第1または第3の実施形態と同様の箇所には同一の符号を付して説明を省略する。
まず、図14Aに示すように、円柱状または円筒状のロール原盤51を準備する。このロール原盤51の被加工面である表面51Aは、例えば、鏡面状態となっている。なお、この表面51Aは鏡面状態となっていなくてもよく、例えば、表面51Aに、転写用のパターンよりも細かな凹凸が形成されていてもよいし、転写用のパターンと同等か、それよりも粗い凹凸が形成されていてもよい。
次に、上述のようにして得られたロール原盤51を用いて、樹脂材料に形状転写し、基材11の表面に複数の構造体12aを形成することにより、上述の第1の実施形態に係る防汚性基材を作製する。形状転写の方法としては、例えばエネルギー線転写法、熱硬化転写法、または熱転写法を用いることができる。以下、構造形成工程を、エネルギー線転写法または熱硬化転写法を用いた構造形成工程と、熱転写法を用いた構造形成工程とに分けて説明する。
(樹脂組成物の調製工程)
図15A、図15Bは、エネルギー線転写法または熱硬化転写法を用いた構造形成工程の一例を説明するための工程図である。まず、必要に応じて樹脂組成物を溶媒に溶かして希釈する。この際、必要に応じて樹脂組成物に各種添加剤を添加するようにしてもよい。溶媒による希釈は必要に応じて行われ、希釈不要の場合には、樹脂組成物を無溶媒で用いてもよい。
次に、図15Aに示すように、調製した樹脂組成物33を基材の表面に塗布または印刷する。
次に、樹脂組成物33が溶媒を含んでいる場合には、必要に応じて樹脂組成物を乾燥させることにより、溶媒を揮発させる。
次に、ロール原盤51と、基材11の表面に塗布された樹脂組成物33とを密着させ、樹脂組成物33を硬化させた後、硬化した樹脂組成物33と一体となった基材11をロール原盤51から剥離する。これにより、複数の構造体12aが基材11の表面に形成された防汚性基材が得られる。この際、必要に応じて、構造体12aと基材11との間に基底層12bをさらに形成するようにしてもよい(図1C参照)。
図16A、図16Bは、熱転写法を用いた構造形成工程の一例を説明するための工程図である。まず、図16Aに示すように、基材21を形成する。基材21は、例えば、熱可塑性樹脂組成物を含んでいる。熱可塑性樹脂組成物は、第1の化合物および第2の化合物の少なくとも一方を含んでいる。熱可塑性樹脂組成物が、第2の化合物を含む場合には、この第2の化合物と共に第3の化合物をさらに含んでいることが好ましい。
第5の実施形態によれば、原盤としてロール原盤51を用いるので、ロール・ツー・ロール工程などにより防汚性基材を作製することができる。したがって、防汚性基材の生産性を向上させることができる。
図17は、本技術の第6の実施形態に係る表示装置の一構成例を示す斜視図である。図17に示すように、表示装置101の表示面S1に防汚体100が設けられている。防汚体100としては、例えば、防汚層、防汚構造層または防汚性基材が用いられる。防汚層としては、例えば、第1の実施形態に係る防汚層12が用いられる。防汚構造層としては、例えば、第3または第4の実施形態に係る防汚構造層23が用いられる。防汚性基材としては、例えば、第1~第4の実施形態に係る防汚性基材のいずれかが用いられる。防汚体として防汚性基材を用いる場合には、防汚性基材を表示装置101の表示面S1に貼合層を介して貼り合わせる構成を採用することができる。この構成を採用する場合には、防汚性基材の基材11としては、透明性および可撓性を有するシートなどを用いることが好ましい。
Display Panel:PDP)、エレクトロルミネッセンス(Electro Luminescence:EL)ディスプレイ、表面伝導型電子放出素子ディスプレイ(Surface-conduction Electron-emitter Display:SED)などの各種表示装置を用いることができる。
第6の実施形態によれば、表示装置101の表示面S1を耐指紋表面Sとすることができるので、表示装置101の表示面S1に指紋が付着した場合、何もせずとも指紋のパターンが濡れ広がり、付着した指紋が見えにくくなる。したがって、表示装置101の視認性を向上させることができる。
図18Aは、本技術の第7の実施形態に係る表示装置の一構成例を示す斜視図である。図18Aに示すように、表示装置101の表示面S1上に入力装置102が設けられている。そして、入力装置102の入力面S2上に防汚体100が設けられている。表示装置101と入力装置102とは、例えば粘着剤などからなる貼合層を介して貼り合わされている。防汚体100としては、例えば、防汚層、防汚構造層または防汚性基材が用いられる。防汚層としては、例えば、第1の実施形態に係る防汚層12が用いられる。防汚構造層としては、例えば、第3または第4の実施形態に係る防汚構造層23が用いられる。防汚性基材としては、例えば、第1~第4の実施形態に係る防汚性基材のいずれかが用いられる。防汚体として防汚性基材を用いる場合には、防汚性基材を入力装置102の入力面S2に貼合層を介して貼り合わせる構成を採用することができる。この構成を採用する場合には、防汚性基材の基材11としては、透明性および可撓性を有するシートなどを用いることが好ましい。
第7の実施形態によれば、入力装置102の入力面S2を耐指紋表面Sとすることができるので、入力装置102の入力面S2に指紋が付着した場合、何もせずとも指紋のパターンが濡れ広がり、付着した指紋が見えにくくなる。したがって、入力装置102が設けられた表示装置101の視認性を向上させることができる。
図18Bは、本技術の第7の実施形態に係る入力装置の変形例を示す分解斜視図である。図18Bに示すように、入力装置102の入力面S2にフロントパネル(表面部材)103をさらに備えるようにしてもよい。この場合、フロントパネル103のパネル表面S3に防汚体100が設けられる。入力装置102とフロントパネル(表面部材)103とは、例えば粘着剤などからなる貼合層により貼り合わされる。
本技術の第8の実施形態に係る電子機器は、第6の実施形態、または第7の実施形態もしくはその変形例に係る表示装置101を備えている。この電子機器の筐体の表面には、必要に応じて防汚体が設けられている。防汚体としては、防汚層、防汚構造層または防汚性基材が用いられる。防汚層としては、例えば、第1の実施形態に係る防汚層12が用いられる。防汚構造層としては、例えば、第3または第4の実施形態に係る防汚構造層23が用いられる。防汚性基材としては、例えば、第1~第4の実施形態に係る防汚性基材のいずれかが用いられる。防汚性基材自体により電子機器の筐体を構成するようにしてもよい。
以下に、本技術の第8の実施形態に係る電子機器の例について説明する。
第8の実施形態によれば、電子機器が第6の実施形態、または第7の実施形態もしくはその変形例に係る表示装置101を備えているので、電子機器の表示装置101の視認性を向上させることができる。
まず、基材表面にDLCを被膜することにより、原盤を作製した。次に、この原盤のDLC膜の表面に対して、フェムト秒レーザを利用して微細な凹凸構造を形成した。この際、表1に示すレーザ加工条件にてレーザ加工を行った。以上により、形状転写用の板状の原盤が得られた。なお、原盤のサイズは、2cm×2cmの矩形状とした。
まず、上述の実施例1~4と同様にして、UVインプリントにより微細な凹凸構造をゼオノアフィルム(日本ゼオン株式会社製、登録商標)の表面に形成した。次に、以下のようにして微細な凹凸構造の表面にコーティング層をさらに形成した。
下記の式(10)に示す構造を有する化合物:1.5質量%
光重合開始剤(BASFジャパン社製、商品名:イルガキュア184):0.075質量%
シクロヘキサノン: 96.325質量%
(環状炭化水素基を有する第2の化合物)
光学フィルムの形状転写面に、下記配合を有するUV硬化性樹脂をスピンコートで塗布したこと以外は実施例5と同様にして防汚性フィルムを作製した。ここで、UV硬化性樹脂としては、末端以外の部分にエステル結合を有する第1の化合物を含むものを用いた。
ジペンタエリスリトール ヘキサアクリレート(DPHA):3.5質量%
光重合開始剤(BASFジャパン社製、商品名:イルガキュア184):0.175質量%
シクロヘキサノン:96.325質量%
光学フィルムの形状転写面に、下記配合を有するUV硬化性樹脂をスピンコートで塗布したこと以外は実施例5と同様にして防汚性フィルムを作製した。ここで、UV硬化性樹脂としては、末端以外の部分にエステル結合を有する第1の化合物を含むものを用いた。
フッ素原子及びシロキサン部位を有するアクリレートオリゴマー:1.75質量%
ジペンタエリスリトール ヘキサアクリレート(DPHA):1.75質量%
光重合開始剤(BASFジャパン社製、商品名:イルガキュア184):0.175質量%
シクロヘキサノン:96.325質量%
ゼオノアフィルムの表面にUV硬化性樹脂を塗布し、形状転写せずに硬化することにより、平坦な表面を有する防汚性フィルムを得た。なお、UV硬化性樹脂としては、上述の実施例1~7と同様のものを用いた。
上述のようにして得られた実施例1~7、比較例1の防汚性フィルムの(a)転写面の凹凸形状(表面構造、平均ピッチ、算術平均粗さ)、(b)AR機能、(c)指紋のパターン見え、および(d)指払拭性を評価した。
(表面構造)
微細な凹凸構造を有する耐指紋表面を原子間力顕微鏡(AFM:Atomic Force
Microscope)により観察し、表面構造を確認した。図21A、図22A、図23A、図24A、図25Aはそれぞれ、実施例1、実施例2、実施例3、実施例4、実施例5の反射防止フィルム表面のAFM像を示す。図21B、図22B、図23B、図24B、図25Bはそれぞれ、図21A、図22A、図23A、図24A、図25Aのa-a線に沿った断面プロファイルを示す。
平均ピッチPmはAFM像の断面プロファイルから以下のようにして求めた。まず、AFM像の断面プロファイルから、隣接する任意の2つの構造体を選び出し、それらの構造体間の距離(最小繰り返し構造のトップ間の最短距離)をピッチとして求めた。次に、この手順を耐指紋表面の任意の10箇所で行い、ピッチP1、P2、・・・、P10を求めた。次に、これらのピッチP1、P2、・・・、P10を単純に平均(算術平均)して平均ピッチPmを求めた。
算術平均粗さRaはAFM像から以下のようにして求めた。
まず、耐指紋表面Sを原子間力顕微鏡(AFM:Atomic Force Microscope)により視野3μm×3μmで観察する。次に、そのAFM像の断面プロファイルから、算術平均粗さra求める。次に、この手順を耐指紋表面の任意の10箇所で行い、ra1、ra2、・・・、ra10を求める。次に、これらのra1、ra2、・・・、ra10を単純に平均(算術平均)して算術平均粗さRaを求める。
防汚性フィルムのAR機能を以下のようにして評価した。
防汚性フィルムをその評価面(耐指紋表面)が上になるように黒色アクリル板(三菱レイヨン株式会社製、商品名:アクリライト)に両面粘着シート(日東電工株式会社製、商品名:LUCIACS CS9621T)を用いて貼合した。次に、外光を斜め45°から入射させ、以下の基準で評価を行った。
×:構造がない部分と比較しても差が分からない場合
○:構造がない部分と比較して黒みが増していた場合
◎:構造がない部分と比較して評価結果「○」よりもさらに黒みが増していた場合
防汚性フィルムをその評価面(耐指紋表面)が上になるように黒色アクリル板(三菱レイヨン株式会社製、商品名:アクリライト)に両面粘着シート(日東電工株式会社製、商品名:LUCIACS CS9621T)を用いて貼合した。次に、耐指紋表面に指紋を付着させ、3分後に蛍光灯を写し込み、目視で表面を観察し、以下の基準で評価をおこなった。
×:指紋のパターンが消えなかった場合
○:指紋のパターンが消え、付着した指紋が見えにくくなっていた場合
◎:指紋のパターンが消え、評価結果「○」よりもさらに付着した指紋が見えにくくなっていた場合
耐指紋表面にわざと通常よりも液量の多い指紋を付着させ、指で10往復払拭後に蛍光灯を写し込み、目視で表面を観察し、以下の基準で評価をおこなった。
◎:油よごれがなくなっていた場合
○:油よごれがわずかに残っていた程度の場合
×:油よごれがかなり残っていた場合
複数のナノ構造体を耐指紋表面に形成すると共に、それらの構造体に第2の化合物を含ませることで、指紋のパターン見えを抑制することができる。
複数のナノ構造体を耐指紋表面に形成することで、AR機能を得ることができる。
(1)
微細な凹凸構造が設けられた表面を有し、
上記凹凸構造は、末端以外の部分にエステル結合を有する第1の化合物、および環状炭化水素基を有する第2の化合物の少なくとも一方を含んでいる防汚体。
(2)
上記凹凸構造は揺らいでいる(1)に記載の防汚体。
(3)
上記凹凸構造は、ランダムなナノ構造により構成されている(1)から(2)のいずれかに記載の防汚体。
(4)
上記凹凸構造は、ストライプ状、網目状または針状の構造体を含んでいる(1)から(3)のいずれかに記載の防汚体。
(5)
上記表面の算術平均粗さは、5nm以上100nm以下の範囲内である(1)から(4)のいずれかに記載の防汚体。
(6)
表面を有する基材と、
上記基材の表面に設けられた防汚層と
を備え、
上記防汚層は、上記凹凸構造が設けられた上記表面を有している(1)から(5)のいずれかに記載の防汚体。
(7)
上記防汚層は、エネルギー線硬化性樹脂組成物および熱硬化性樹脂組成物の少なくとも一方の樹脂組成物を含み、
上記樹脂組成物は、上記第1の化合物、および上記第2の化合物の少なくとも一方を含んでいる(6)に記載の防汚体。
(8)
上記第1の化合物および上記第2の化合物は、添加剤である(1)から(7)のいずれかに記載の防汚体。
(9)
上記添加剤は、レベリング剤である(8)に記載の防汚体。
(10)
上記基材の表面には複数の構造体が設けられ、
上記基材の複数の構造体の表面に倣うように上記防汚層が設けられている(6)に記載の防汚体。
(11)
上記第1の化合物および上記第2の化合物の少なくとも一方は、上記基材の複数の構造体の表面に吸着されている(10)に記載の防汚体。
(12)
上記防汚層は、上記第1の化合物および上記第2の化合物の少なくとも一方を含む単分子層である(11)に記載の防汚体。
(13)
上記構造体は、熱可塑性樹脂組成物を含み、
上記熱可塑性樹脂組成物は、上記第1の化合物および上記第2の化合物の少なくとも一方を含んでいる(1)から(5)のいずれかに記載の防汚体。
(14)
上記第1の化合物は、下記の式(1)または式(2)で表され、
上記第2の化合物は、下記の式(3)または式(4)で表される(1)から(5)のいずれかに記載の防汚体。
(式中、R1は、C、N、S、O、Si、PまたはTiを含む基、R2は、炭素数が2個以上の基である。)
(式中、R1、R2はそれぞれ独立に、C、N、S、O、Si、PまたはTiを含む基である。)
(15)
上記防汚層が、上記第2の化合物とともに、末端に鎖状炭化水素基を有する第3の化合物をさらに含んでいる(1)から(5)のいずれかに記載の防汚体。
(16)
上記第3の化合物は、下記の式(5)または式(6)で表される(15)に記載の防汚体。
(17)
上記凹凸構造間の凹部は、上記表面にある液体に対して正の毛管圧力を及ぼす(1)から(16)のいずれかに記載の防汚体。
(18)
防汚体が設けられた入力面を有し、
上記防汚体は、(1)から(17)のいずれかに記載の防汚体である入力装置。
(19)
防汚体が設けられた表示面を有し、
上記防汚体は、(1)から(17)のいずれかに記載の防汚体である表示装置。
(20)
(1)から(17)のいずれかに記載の防汚体を備える電子機器。
(21)
(1)から(17)のいずれかに記載の防汚体を備える防汚性物品。
12、25 防汚層
12a、22 構造体
12b、24b 基底層
13 アンカー層
14 ハードコート層
15 透明導電層
23 防汚構造層
23a 表面構造体(第1構造体)
24 微細構造層
24a 内部構造体(第2構造体)
25a 吸着化合物
31 板状の原盤
32、52 構造体
51 ロール原盤
101、113、125、133、143 表示装置
102 入力装置
103 フロントパネル
111 テレビ装置
112、123、124、132、142 筐体
121 ノート型パーソナルコンピュータ
131 携帯電話
141 タブレット型コンピュータ
S 耐指紋表面(防汚性表面)
S1 表示面
S2 入力面
Claims (21)
- 微細な凹凸構造が設けられた表面を有し、
上記凹凸構造は、末端以外の部分にエステル結合を有する第1の化合物、および環状炭化水素基を有する第2の化合物の少なくとも一方を含んでいる防汚体。 - 上記凹凸構造は揺らぎを有している請求項1に記載の防汚体。
- 上記凹凸構造は、ランダムなナノ構造である請求項1又は2に記載の防汚体。
- 上記凹凸構造は、ストライプ状、網目状または針状の構造体を含んでいる請求項1~3のいずれかに記載の防汚体。
- 上記表面の算術平均粗さは、5nm以上100nm以下の範囲内である請求項1~4のいずれかに記載の防汚体。
- 表面を有する基材と、
上記基材の表面に設けられた防汚層と
を備え、
上記防汚層は、上記凹凸構造が設けられた上記表面を有している請求項1に記載の防汚体。 - 上記防汚層は、エネルギー線硬化性樹脂組成物および熱硬化性樹脂組成物の少なくとも一方の樹脂組成物を含み、
上記樹脂組成物は、上記第1の化合物、および上記第2の化合物の少なくとも一方を含んでいる請求項6に記載の防汚体。 - 上記第1の化合物および上記第2の化合物は、添加剤である請求項1~7のいずれかに記載の防汚体。
- 上記添加剤は、レベリング剤である請求項8に記載の防汚体。
- 上記基材の表面には複数の構造体が設けられ、
上記基材の複数の構造体の表面に倣うように上記防汚層が設けられている請求項6に記載の防汚体。 - 上記第1の化合物および上記第2の化合物の少なくとも一方は、上記基材の複数の構造体の表面に吸着されている請求項10に記載の防汚体。
- 上記防汚層は、上記第1の化合物および上記第2の化合物の少なくとも一方を含む単分子層である請求項11に記載の防汚体。
- 上記構造体は、熱可塑性樹脂組成物を含み、
上記熱可塑性樹脂組成物は、上記第1の化合物および上記第2の化合物の少なくとも一方を含んでいる請求項1~5のいずれかに記載の防汚体。 - 上記防汚層が、上記第2の化合物とともに、末端に鎖状炭化水素基を有する第3の化合物をさらに含んでいる請求項1~5のいずれかに記載の防汚体。
- 上記凹凸構造間の凹部は、上記表面にある液体に対して正の毛管圧力を及ぼす請求項1~16のいずれかに記載の防汚体。
- 微細な凹凸構造が設けられた入力面を有し、
上記凹凸構造は、末端以外の部分にエステル結合を有する第1の化合物、および環状炭化水素基を有する第2の化合物の少なくとも一方を含んでいる入力装置。 - 微細な凹凸構造が設けられた表示面を有し、
上記凹凸構造は、末端以外の部分にエステル結合を有する第1の化合物、および環状炭化水素基を有する第2の化合物の少なくとも一方を含んでいる表示装置。 - 微細な凹凸構造が設けられた表面を有し、
上記凹凸構造は、末端以外の部分にエステル結合を有する第1の化合物、および環状炭化水素基を有する第2の化合物の少なくとも一方を含んでいる電子機器。 - 微細な凹凸構造が設けられた表面を有し、
上記凹凸構造は、末端以外の部分にエステル結合を有する第1の化合物、および環状炭化水素基を有する第2の化合物の少なくとも一方を含んでいる防汚性物品。
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CN201380046126.6A CN104583814A (zh) | 2012-09-05 | 2013-09-05 | 防污体、显示装置、输入装置和电子设备 |
KR1020157005401A KR20150048755A (ko) | 2012-09-05 | 2013-09-05 | 방오체, 표시 장치, 입력 장치 및 전자 기기 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015162347A1 (fr) * | 2014-04-25 | 2015-10-29 | Peugeot Citroen Automobiles Sa | Procédé de traitement de surface d'une pièce transparente et pièce ainsi traitée |
US20170282227A1 (en) * | 2016-03-31 | 2017-10-05 | BSH Hausgeräte GmbH | Surface coating for high-quality white and / or grayware |
US20180045957A1 (en) * | 2015-03-06 | 2018-02-15 | Jxtg Nippon Oil & Energy Corporation | See-through layered body, transparent screen comprising same, and image projection device comprising same |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5835195B2 (ja) * | 2012-11-29 | 2015-12-24 | 東京エレクトロン株式会社 | 乾燥処理用の高圧容器の製造方法及び基板処理装置の製造方法 |
WO2015147685A1 (ru) | 2014-03-28 | 2015-10-01 | Открытое акционерное общество "Акционерная компания по транспорту нефти "Транснефть" (ОАО "АК "Транснефть") | Способ установки неподвижной ороры в проектное положение |
CA2942828C (en) | 2014-03-28 | 2021-02-09 | Public Joint Stock Company "Transneft" | Stationary pipeline support |
EP3124842B1 (en) * | 2014-03-28 | 2023-02-22 | Public Joint Stock Company "Transneft" | Movable pipeline-support and support assembly thereof |
CN106575178B (zh) * | 2014-08-29 | 2019-09-13 | 富士胶片株式会社 | 触摸传感器膜的制造方法、触摸传感器膜及触摸屏 |
JP6693641B2 (ja) * | 2015-03-26 | 2020-05-13 | 天馬微電子有限公司 | 触覚提示装置及び電子機器並びに触覚提示装置の駆動方法 |
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CN104965244B (zh) * | 2015-06-30 | 2018-10-12 | 深圳市聚飞光学材料有限公司 | 一种光学膜的制作方法及光学膜 |
FI129889B (en) * | 2015-10-09 | 2022-10-31 | Inkron Ltd | Dielectric siloxane particle films and devices containing them |
JP6730694B2 (ja) * | 2016-10-07 | 2020-07-29 | 日産自動車株式会社 | 汚れ消失性積層物、該汚れ消失性積層物を用いた画像表示装置および自動車部品 |
KR102629629B1 (ko) * | 2016-12-07 | 2024-01-29 | 플라트프로그 라보라토리즈 에이비 | 개선된 터치 장치 |
WO2018145305A1 (zh) * | 2017-02-10 | 2018-08-16 | 深圳市汇顶科技股份有限公司 | 生物传感器 |
JP7092262B2 (ja) * | 2020-03-31 | 2022-06-28 | Toto株式会社 | 衛生設備部材 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002194084A (ja) * | 2000-12-27 | 2002-07-10 | Mitsubishi Chemicals Corp | ポリシロキサン構造単位を有する化合物、活性エネルギー線硬化性被覆組成物、及び該組成物の硬化被膜を有する材料 |
JP2007137767A (ja) * | 1991-01-23 | 2007-06-07 | Matsushita Electric Ind Co Ltd | 撥水撥油性ガラス基体 |
JP2010128363A (ja) | 2008-11-28 | 2010-06-10 | Nof Corp | ディスプレイ用表面材及びそれを備えた高精細ディスプレイ |
JP2011006667A (ja) * | 2009-05-25 | 2011-01-13 | Kawamura Inst Of Chem Res | 撥水性膜、及びその製造方法 |
JP4666667B2 (ja) | 2008-08-21 | 2011-04-06 | 信越化学工業株式会社 | 含フッ素表面処理剤及び該表面処理剤で処理された物品 |
WO2012105539A1 (ja) * | 2011-01-31 | 2012-08-09 | 三菱レイヨン株式会社 | 活性エネルギー線硬化性組成物、および微細凹凸構造を表面に有する透明フィルムの製造方法 |
WO2013125081A1 (ja) * | 2012-02-22 | 2013-08-29 | デクセリアルズ株式会社 | 防汚層、防汚性基材、表示装置および入力装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0828766B2 (en) * | 1995-05-30 | 2005-10-05 | Sola International Holdings, Ltd. | High index/high abbe number composition |
US6958366B2 (en) * | 2000-04-12 | 2005-10-25 | Dainippon Ink And Chemicals, Inc. | Antifouling coating composition and novel resin |
JP4627437B2 (ja) * | 2002-11-20 | 2011-02-09 | 株式会社きもと | 指紋消去性フィルム |
JP4517590B2 (ja) * | 2003-06-05 | 2010-08-04 | 三菱化学株式会社 | 耐汚染性付与剤及びそれを用いた耐汚染性物品 |
JP2007187868A (ja) * | 2006-01-13 | 2007-07-26 | Nissan Motor Co Ltd | 濡れ制御性反射防止光学構造体及び自動車用ウインドウガラス |
KR101238769B1 (ko) * | 2009-05-25 | 2013-03-06 | 디아이씨 가부시끼가이샤 | 발수성막, 발수성 및 친수성의 영역을 갖는 패턴화막, 및 그 제조 방법 |
US20120088090A1 (en) * | 2009-06-01 | 2012-04-12 | Tsujiden Co., Ltd. | Fingerprint-erasing cured film, method for manufacturing same, display and touch panel using same, and electronic device using these |
KR101229673B1 (ko) * | 2009-10-29 | 2013-02-04 | 주식회사 엘지화학 | 저반사 및 고접촉각을 갖는 기판 및 이의 제조방법 |
WO2011072227A1 (en) * | 2009-12-10 | 2011-06-16 | Nano Terra Inc. | Structured smudge-resistant anti-reflective coatings and methods of making and using the same |
JP2012014083A (ja) * | 2010-07-02 | 2012-01-19 | Hoya Corp | 光学素子及びそれを用いた撮像装置及びレンズ交換式カメラ |
US8742022B2 (en) * | 2010-12-20 | 2014-06-03 | 3M Innovative Properties Company | Coating compositions comprising non-ionic surfactant exhibiting reduced fingerprint visibility |
-
2012
- 2012-09-05 JP JP2012195376A patent/JP2014052432A/ja active Pending
-
2013
- 2013-09-05 CN CN201380046126.6A patent/CN104583814A/zh active Pending
- 2013-09-05 EP EP13834806.5A patent/EP2894497A4/en not_active Withdrawn
- 2013-09-05 KR KR1020157005401A patent/KR20150048755A/ko not_active Application Discontinuation
- 2013-09-05 WO PCT/JP2013/073890 patent/WO2014038616A1/ja active Application Filing
- 2013-09-05 US US14/425,471 patent/US20150239023A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007137767A (ja) * | 1991-01-23 | 2007-06-07 | Matsushita Electric Ind Co Ltd | 撥水撥油性ガラス基体 |
JP2002194084A (ja) * | 2000-12-27 | 2002-07-10 | Mitsubishi Chemicals Corp | ポリシロキサン構造単位を有する化合物、活性エネルギー線硬化性被覆組成物、及び該組成物の硬化被膜を有する材料 |
JP4666667B2 (ja) | 2008-08-21 | 2011-04-06 | 信越化学工業株式会社 | 含フッ素表面処理剤及び該表面処理剤で処理された物品 |
JP2010128363A (ja) | 2008-11-28 | 2010-06-10 | Nof Corp | ディスプレイ用表面材及びそれを備えた高精細ディスプレイ |
JP2011006667A (ja) * | 2009-05-25 | 2011-01-13 | Kawamura Inst Of Chem Res | 撥水性膜、及びその製造方法 |
WO2012105539A1 (ja) * | 2011-01-31 | 2012-08-09 | 三菱レイヨン株式会社 | 活性エネルギー線硬化性組成物、および微細凹凸構造を表面に有する透明フィルムの製造方法 |
WO2013125081A1 (ja) * | 2012-02-22 | 2013-08-29 | デクセリアルズ株式会社 | 防汚層、防汚性基材、表示装置および入力装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2894497A4 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2015162347A1 (fr) * | 2014-04-25 | 2015-10-29 | Peugeot Citroen Automobiles Sa | Procédé de traitement de surface d'une pièce transparente et pièce ainsi traitée |
FR3020471A1 (fr) * | 2014-04-25 | 2015-10-30 | Peugeot Citroen Automobiles Sa | Procede de traitement de surface d'une piece transparente et piece ainsi traitee |
CN106457707A (zh) * | 2014-04-25 | 2017-02-22 | 标致·雪铁龙汽车公司 | 透明零件的表面处理方法和由该方法处理的零件 |
US20180045957A1 (en) * | 2015-03-06 | 2018-02-15 | Jxtg Nippon Oil & Energy Corporation | See-through layered body, transparent screen comprising same, and image projection device comprising same |
US10585279B2 (en) * | 2015-03-06 | 2020-03-10 | Jxtg Nippon Oil & Energy Corporation | See-through layered body, transparent screen comprising same, and image projection device comprising same |
US20170282227A1 (en) * | 2016-03-31 | 2017-10-05 | BSH Hausgeräte GmbH | Surface coating for high-quality white and / or grayware |
Also Published As
Publication number | Publication date |
---|---|
US20150239023A1 (en) | 2015-08-27 |
CN104583814A (zh) | 2015-04-29 |
EP2894497A4 (en) | 2016-06-08 |
JP2014052432A (ja) | 2014-03-20 |
KR20150048755A (ko) | 2015-05-07 |
EP2894497A1 (en) | 2015-07-15 |
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