JP2007200835A - 有機電界発光表示装置 - Google Patents
有機電界発光表示装置 Download PDFInfo
- Publication number
- JP2007200835A JP2007200835A JP2006145658A JP2006145658A JP2007200835A JP 2007200835 A JP2007200835 A JP 2007200835A JP 2006145658 A JP2006145658 A JP 2006145658A JP 2006145658 A JP2006145658 A JP 2006145658A JP 2007200835 A JP2007200835 A JP 2007200835A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- frit
- light emitting
- organic light
- electrode line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 239000002184 metal Substances 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052760 oxygen Inorganic materials 0.000 abstract description 5
- 239000001301 oxygen Substances 0.000 abstract description 5
- 230000008595 infiltration Effects 0.000 abstract 1
- 238000001764 infiltration Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000003230 hygroscopic agent Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61J—CONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
- A61J3/00—Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
- A61J3/07—Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of capsules or similar small containers for oral use
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
Abstract
【解決手段】画素が形成される画素領域及び前記画素領域以外の非画素領域を含む第1基板と、前記画素領域を含む一領域で前記第1基板と対向するように接合される第2基板と、前記非画素領域と前記第2基板との間に位置し、前記第1基板及び第2基板を接合するフリットと、前記第1基板に形成され、前記フリットと重畳される少なくとも一つの電極ラインとを備え、前記電極ラインは、前記フリットと重畳される交差部領域で少なくとも一つの開口部を備える。
【選択図】図5
Description
図1は、本発明の実施例による有機電界発光表示装置を示す図である。
104b 走査線
104c 第1パッド
106c データ線
106d 第2パッド
200 第1基板
210 画素領域
220 非画素領域
300 第2基板
320 フリット
400 電極ライン
402 開口部
410 走査駆動部
420 データ駆動部
Claims (9)
- 画素が形成される画素領域及び前記画素領域以外の非画素領域を含む第1基板と、
前記画素領域を含む一領域で前記第1基板と対向するように接合される第2基板と、
前記非画素領域と前記第2基板との間に位置し、前記第1基板及び第2基板を接合するフリットと、
前記第1基板に形成され、前記フリットと一部重畳される少なくとも一つの電極ラインを備え、
前記電極ラインは、前記フリットと重畳される交差部領域で少なくとも一つの開口部を備えることを特徴とする有機電界発光表示装置。 - 前記電極ラインは、走査ライン、データライン及び電源供給ラインのうち少なくとも一つを含むことを特徴とする請求項1に記載の有機電界発光表示装置。
- 前記フリットは、レーザまたは赤外線が照射される時に溶融し、前記第1基板と第2基板とを接合することを特徴とする請求項1に記載の有機電界発光表示装置。
- 前記開口部は、電極ラインが所定の形状に一部除去されて形成されることを特徴とする請求項1に記載の有機電界発光表示装置。
- 前記開口部は、四角形、三角形、逆三角形及び円形のうち少なくとも一つの形状に形成されることを特徴とする請求項4に記載の有機電界発光表示装置。
- 前記交差部領域で前記電極ラインの幅は、前記交差部領域以外の幅と異なるように設定されることを特徴とする請求項1に記載の有機電界発光表示装置。
- 前記交差部領域で前記電極ラインの幅は、前記交差部領域以外の幅より広く形成されることを特徴とする請求項6に記載の有機電界発光表示装置。
- 前記画素は、少なくとも一つの薄膜トランジスタ及び有機発光ダイオードを備えることを特徴とする請求項1に記載の有機電界発光表示装置。
- 前記電極ラインは、前記薄膜トランジスタまたは有機発光ダイオードが形成される時に形成され、ゲートメタル、ソース/ドレインメタル、アノードメタル及び半導体層のうち少なくとも一つと同一の物質で形成されることを特徴とする請求項8に記載の有機電界発光表示装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060008460A KR100671638B1 (ko) | 2006-01-26 | 2006-01-26 | 유기 전계 발광 표시장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007200835A true JP2007200835A (ja) | 2007-08-09 |
JP4456090B2 JP4456090B2 (ja) | 2010-04-28 |
Family
ID=38007107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006145658A Active JP4456090B2 (ja) | 2006-01-26 | 2006-05-25 | 有機電界発光表示装置の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7701136B2 (ja) |
EP (1) | EP1814181B1 (ja) |
JP (1) | JP4456090B2 (ja) |
KR (1) | KR100671638B1 (ja) |
CN (1) | CN101009298A (ja) |
TW (1) | TWI369914B (ja) |
Cited By (10)
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---|---|---|---|---|
JP2010067603A (ja) * | 2008-09-12 | 2010-03-25 | Samsung Mobile Display Co Ltd | 有機発光表示装置 |
JP2011028210A (ja) * | 2009-07-21 | 2011-02-10 | Samsung Mobile Display Co Ltd | 平板表示装置及びその製造方法 |
JP2011118331A (ja) * | 2009-12-03 | 2011-06-16 | Samsung Mobile Display Co Ltd | タッチスクリーンパネル一体型平板表示装置 |
WO2012073828A1 (ja) * | 2010-12-03 | 2012-06-07 | 住友化学株式会社 | 電気装置 |
US8748756B2 (en) | 2010-03-11 | 2014-06-10 | Sumitomo Chemical Company, Limited | Electric device and production method therefor |
US9048350B2 (en) | 2011-11-28 | 2015-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Sealed body, light-emitting module and method of manufacturing sealed body |
US9394614B2 (en) | 2013-04-19 | 2016-07-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming projections and depressions, sealing structure, and light-emitting device |
JP2020527289A (ja) * | 2018-01-19 | 2020-09-03 | 昆山国顕光電有限公司Kunshan Go−Visionox Opto−Electronics Co., Ltd. | パッケージ構造 |
US10854696B2 (en) | 2016-02-16 | 2020-12-01 | Tianma Microelectronics Co., Ltd. | Display device including first wiring and second wiring having different melting points |
JP2020202395A (ja) * | 2015-03-20 | 2020-12-17 | 株式会社リコー | 光電変換素子、及び太陽電池 |
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US20070108900A1 (en) * | 2005-11-15 | 2007-05-17 | Boek Heather D | Method and apparatus for the elimination of interference fringes in an OLED device |
US7425166B2 (en) * | 2005-12-06 | 2008-09-16 | Corning Incorporated | Method of sealing glass substrates |
US7597603B2 (en) * | 2005-12-06 | 2009-10-06 | Corning Incorporated | Method of encapsulating a display element |
US7537504B2 (en) * | 2005-12-06 | 2009-05-26 | Corning Incorporated | Method of encapsulating a display element with frit wall and laser beam |
US20070188757A1 (en) * | 2006-02-14 | 2007-08-16 | Jeffrey Michael Amsden | Method of sealing a glass envelope |
US20070267972A1 (en) * | 2006-05-22 | 2007-11-22 | Menegus Harry E | Method for forming a temporary hermetic seal for an OLED display device |
US20080124558A1 (en) * | 2006-08-18 | 2008-05-29 | Heather Debra Boek | Boro-silicate glass frits for hermetic sealing of light emitting device displays |
US20080048556A1 (en) * | 2006-08-24 | 2008-02-28 | Stephan Lvovich Logunov | Method for hermetically sealing an OLED display |
US20080049431A1 (en) * | 2006-08-24 | 2008-02-28 | Heather Debra Boek | Light emitting device including anti-reflection layer(s) |
US7800303B2 (en) * | 2006-11-07 | 2010-09-21 | Corning Incorporated | Seal for light emitting display device, method, and apparatus |
US20080168801A1 (en) * | 2007-01-12 | 2008-07-17 | Paul Stephen Danielson | Method of sealing glass |
US20080200088A1 (en) * | 2007-02-21 | 2008-08-21 | Chong Pyung An | Method for reducing interference fringes in a display device |
US7652305B2 (en) * | 2007-02-23 | 2010-01-26 | Corning Incorporated | Methods and apparatus to improve frit-sealed glass package |
US20080213482A1 (en) * | 2007-03-01 | 2008-09-04 | Stephan Lvovich Logunov | Method of making a mask for sealing a glass package |
US8247730B2 (en) | 2007-09-28 | 2012-08-21 | Corning Incorporated | Method and apparatus for frit sealing with a variable laser beam |
KR101388585B1 (ko) * | 2007-11-16 | 2014-04-23 | 삼성디스플레이 주식회사 | 유기 발광 장치 |
KR100897157B1 (ko) | 2008-02-28 | 2009-05-14 | 삼성모바일디스플레이주식회사 | 유기전계발광 표시장치 |
US8448468B2 (en) | 2008-06-11 | 2013-05-28 | Corning Incorporated | Mask and method for sealing a glass envelope |
US20100095705A1 (en) | 2008-10-20 | 2010-04-22 | Burkhalter Robert S | Method for forming a dry glass-based frit |
KR100959106B1 (ko) | 2008-11-05 | 2010-05-25 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
WO2012007875A1 (en) * | 2010-07-16 | 2012-01-19 | Koninklijke Philips Electronics N.V. | Oled device and method of manufacturing the same |
KR101781506B1 (ko) | 2010-12-23 | 2017-09-26 | 엘지디스플레이 주식회사 | 유기전계 발광소자용 기판 |
US8545281B2 (en) | 2011-04-13 | 2013-10-01 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing electroluminesccent device |
TWI573277B (zh) | 2011-05-05 | 2017-03-01 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
JP5947098B2 (ja) | 2011-05-13 | 2016-07-06 | 株式会社半導体エネルギー研究所 | ガラス封止体の作製方法および発光装置の作製方法 |
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2006
- 2006-01-26 KR KR1020060008460A patent/KR100671638B1/ko active IP Right Grant
- 2006-05-25 JP JP2006145658A patent/JP4456090B2/ja active Active
- 2006-08-31 US US11/514,688 patent/US7701136B2/en active Active
- 2006-11-30 TW TW095144409A patent/TWI369914B/zh active
- 2006-12-27 CN CNA2006101714220A patent/CN101009298A/zh active Pending
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2007
- 2007-01-26 EP EP07250325.3A patent/EP1814181B1/en active Active
Cited By (19)
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JP2010067603A (ja) * | 2008-09-12 | 2010-03-25 | Samsung Mobile Display Co Ltd | 有機発光表示装置 |
JP2011028210A (ja) * | 2009-07-21 | 2011-02-10 | Samsung Mobile Display Co Ltd | 平板表示装置及びその製造方法 |
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US7701136B2 (en) | 2010-04-20 |
US20070170854A1 (en) | 2007-07-26 |
TWI369914B (en) | 2012-08-01 |
EP1814181A2 (en) | 2007-08-01 |
EP1814181B1 (en) | 2017-08-30 |
KR100671638B1 (ko) | 2007-01-19 |
EP1814181A3 (en) | 2011-07-27 |
JP4456090B2 (ja) | 2010-04-28 |
TW200730011A (en) | 2007-08-01 |
CN101009298A (zh) | 2007-08-01 |
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