JP4728169B2 - フリット硬化装置 - Google Patents
フリット硬化装置 Download PDFInfo
- Publication number
- JP4728169B2 JP4728169B2 JP2006143199A JP2006143199A JP4728169B2 JP 4728169 B2 JP4728169 B2 JP 4728169B2 JP 2006143199 A JP2006143199 A JP 2006143199A JP 2006143199 A JP2006143199 A JP 2006143199A JP 4728169 B2 JP4728169 B2 JP 4728169B2
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- JP
- Japan
- Prior art keywords
- chamber
- substrate
- frit
- mother substrate
- mother
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 114
- 230000005540 biological transmission Effects 0.000 claims description 10
- 230000000903 blocking effect Effects 0.000 claims description 7
- 239000000498 cooling water Substances 0.000 claims description 5
- 239000012780 transparent material Substances 0.000 claims description 3
- 238000001723 curing Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 14
- 239000011521 glass Substances 0.000 description 8
- 239000010409 thin film Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 239000003230 hygroscopic agent Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/244—Overlap seam welding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C15/00—Details
- F24C15/14—Spillage trays or grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/206—Laser sealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
- B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C15/00—Details
- F24C15/006—Arrangements for circulation of cooling air
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C3/00—Stoves or ranges for gaseous fuels
- F24C3/08—Arrangement or mounting of burners
- F24C3/085—Arrangement or mounting of burners on ranges
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- General Engineering & Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Joining Of Glass To Other Materials (AREA)
Description
一方、前記従来のフリット硬化装置及びこれを用いた硬化方法に関する技術を記載した文献としては、下記特許文献1等がある。
図1は、本発明の実施例による有機電界発光表示装置を示す図である。
104b 走査線
104c 第1パッド
106c データ線
106d 第2パッド
200 第1基板
210 画素領域
220 非画素領域
300 第2基板
320 フリット
410 走査駆動部
420 データ駆動部
500 第1マザー基板
502 第2マザー基板
600 チャンバ部
601 第1チャンバ
602 第2チャンバ
603 冷却水
604 放出部
605 ランプ
606 放熱シャッタ
610 ステージ
612 マスク
614 透過部
616 遮断部
Claims (4)
- 多数の画素領域及び非画素領域を備える第1マザー基板と、前記第1マザー基板と対向する第2マザー基板とを接合し、前記非画素領域に位置するフリットを硬化するためのフリット硬化装置において、
第1チャンバと、
前記第1チャンバの内部に位置する第2チャンバと、
前記第2チャンバの内部に位置して赤外線を放出するランプと、
前記1チャンバの上部に位置し、前記第1マザー基板及び第2マザー基板を吸い込み固定するステージと、
前記第1チャンバ及び第2チャンバに形成され、前記ステージと対向するように位置して前記ランプから出力された赤外線を部分的に放出する出力窓となる放出部と、
前記第1マザー基板及び第2マザー基板の上に位置し、前記フリットと重畳される部分に位置する透過部及びそれ以外の領域に位置する遮断部を有するマスクとを備え、
前記放出部は、前記ランプからの赤外線と輻射熱とを前記マスクに供給し、
前記チャンバ部の下部に位置し、前記マザー基板が前記ステージに位置する時に前記放出部を開放し、それ以外の場合に前記放出部と重畳されるように位置する放熱シャッタを備え、
前記放熱シャッタは、前記ステージ上の前記第1及び第2マザー基板を移動させながら、必要なときに前記放出部を開放することを特徴とするフリット硬化装置。 - 前記第1チャンバ及び第2チャンバの間には、前記第1チャンバ及び第2チャンバの温度上昇を防止するために冷却水が供給されることを特徴とする請求項1に記載のフリット硬化装置。
- 前記放出部は、透明物質で形成されることを特徴とする請求項1に記載のフリット硬化装置。
- 前記透過部は、前記赤外線及び輻射熱を前記フリットに供給し、前記遮断部は、前記赤外線及び輻射熱が前記第1基板及び第2基板に供給されないように遮断することを特徴とする請求項3に記載のフリット硬化装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060008457A KR100703472B1 (ko) | 2006-01-26 | 2006-01-26 | 프릿 경화 장치 및 이를 이용한 경화 방법 |
KR10-2006-0008457 | 2006-01-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007200834A JP2007200834A (ja) | 2007-08-09 |
JP4728169B2 true JP4728169B2 (ja) | 2011-07-20 |
Family
ID=37913630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006143199A Expired - Fee Related JP4728169B2 (ja) | 2006-01-26 | 2006-05-23 | フリット硬化装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8128449B2 (ja) |
EP (1) | EP1814188A3 (ja) |
JP (1) | JP4728169B2 (ja) |
KR (1) | KR100703472B1 (ja) |
CN (1) | CN100505192C (ja) |
TW (1) | TWI331398B (ja) |
Families Citing this family (29)
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US20070108900A1 (en) * | 2005-11-15 | 2007-05-17 | Boek Heather D | Method and apparatus for the elimination of interference fringes in an OLED device |
US7597603B2 (en) * | 2005-12-06 | 2009-10-06 | Corning Incorporated | Method of encapsulating a display element |
US7537504B2 (en) * | 2005-12-06 | 2009-05-26 | Corning Incorporated | Method of encapsulating a display element with frit wall and laser beam |
US7425166B2 (en) | 2005-12-06 | 2008-09-16 | Corning Incorporated | Method of sealing glass substrates |
US20070188757A1 (en) * | 2006-02-14 | 2007-08-16 | Jeffrey Michael Amsden | Method of sealing a glass envelope |
US20070267972A1 (en) * | 2006-05-22 | 2007-11-22 | Menegus Harry E | Method for forming a temporary hermetic seal for an OLED display device |
US20080124558A1 (en) * | 2006-08-18 | 2008-05-29 | Heather Debra Boek | Boro-silicate glass frits for hermetic sealing of light emitting device displays |
US20080049431A1 (en) * | 2006-08-24 | 2008-02-28 | Heather Debra Boek | Light emitting device including anti-reflection layer(s) |
US20080048556A1 (en) * | 2006-08-24 | 2008-02-28 | Stephan Lvovich Logunov | Method for hermetically sealing an OLED display |
US7800303B2 (en) * | 2006-11-07 | 2010-09-21 | Corning Incorporated | Seal for light emitting display device, method, and apparatus |
KR100787463B1 (ko) | 2007-01-05 | 2007-12-26 | 삼성에스디아이 주식회사 | 글래스 프릿, 실링재 형성용 조성물, 발광 장치 및 발광 장치의 제조방법 |
US20080168801A1 (en) * | 2007-01-12 | 2008-07-17 | Paul Stephen Danielson | Method of sealing glass |
US20080200088A1 (en) * | 2007-02-21 | 2008-08-21 | Chong Pyung An | Method for reducing interference fringes in a display device |
US7652305B2 (en) * | 2007-02-23 | 2010-01-26 | Corning Incorporated | Methods and apparatus to improve frit-sealed glass package |
US20080213482A1 (en) * | 2007-03-01 | 2008-09-04 | Stephan Lvovich Logunov | Method of making a mask for sealing a glass package |
US20090044496A1 (en) * | 2007-08-16 | 2009-02-19 | Botelho John W | Method and apparatus for sealing a glass package |
US8448468B2 (en) | 2008-06-11 | 2013-05-28 | Corning Incorporated | Mask and method for sealing a glass envelope |
JP2010118153A (ja) * | 2008-11-11 | 2010-05-27 | Panasonic Corp | プラズマディスプレイパネルの製造方法 |
DE102009036395A1 (de) * | 2009-04-30 | 2010-11-04 | Osram Opto Semiconductors Gmbh | Bauteil mit einem ersten und einem zweiten Substrat und Verfahren zu dessen Herstellung |
CN102754524B (zh) | 2010-07-23 | 2015-09-02 | 株式会社日本有机雷特显示器 | 显示面板及其制造方法 |
JP5918607B2 (ja) * | 2011-04-15 | 2016-05-18 | 株式会社半導体エネルギー研究所 | ガラス封止体の作製方法 |
JP2013087962A (ja) * | 2011-10-13 | 2013-05-13 | Panasonic Corp | 加熱調理装置 |
US9499428B2 (en) | 2012-07-20 | 2016-11-22 | Ferro Corporation | Formation of glass-based seals using focused infrared radiation |
CN103466922B (zh) * | 2013-09-30 | 2015-12-23 | 上海大学 | 激光封装方法及设备 |
CN104241328B (zh) * | 2014-08-20 | 2017-03-01 | 京东方科技集团股份有限公司 | Pmoled阵列基板及其制作方法、显示装置和掩模板 |
CN104466034A (zh) | 2014-12-15 | 2015-03-25 | 京东方科技集团股份有限公司 | 一种激光烧结设备及烧结方法 |
CN105016778A (zh) * | 2014-12-31 | 2015-11-04 | 李立群 | 一种黄铜、不锈钢复合型精密垫片的制作方法 |
CN105090222B (zh) * | 2014-12-31 | 2017-06-20 | 铜陵爱阀科技有限公司 | 一种高碳钢、不锈钢复合型精密垫片的制作方法 |
CN105016777A (zh) * | 2014-12-31 | 2015-11-04 | 李立群 | 一种高碳钢、黄铜复合型精密垫片的制作方法 |
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JPS60191898U (ja) * | 1984-05-31 | 1985-12-19 | 株式会社サーモ理工 | 輻射加熱装置 |
JPH09102534A (ja) * | 1995-10-04 | 1997-04-15 | Ulvac Japan Ltd | 真空成膜装置に於ける温度制御方法及び装置 |
JPH1064414A (ja) * | 1996-08-16 | 1998-03-06 | Canon Inc | 画像表示装置の製造方法及びその方法の実施のための製造装置 |
JPH1082589A (ja) * | 1996-07-19 | 1998-03-31 | Thermo Riko:Kk | 面加熱型赤外線放射加熱装置 |
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US7371143B2 (en) * | 2004-10-20 | 2008-05-13 | Corning Incorporated | Optimization of parameters for sealing organic emitting light diode (OLED) displays |
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-
2006
- 2006-01-26 KR KR1020060008457A patent/KR100703472B1/ko not_active IP Right Cessation
- 2006-05-23 JP JP2006143199A patent/JP4728169B2/ja not_active Expired - Fee Related
- 2006-09-29 US US11/529,913 patent/US8128449B2/en not_active Expired - Fee Related
- 2006-12-04 TW TW095144930A patent/TWI331398B/zh not_active IP Right Cessation
- 2006-12-29 CN CNB2006101566572A patent/CN100505192C/zh not_active Expired - Fee Related
-
2007
- 2007-01-26 EP EP07250318A patent/EP1814188A3/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60191898U (ja) * | 1984-05-31 | 1985-12-19 | 株式会社サーモ理工 | 輻射加熱装置 |
JPH09102534A (ja) * | 1995-10-04 | 1997-04-15 | Ulvac Japan Ltd | 真空成膜装置に於ける温度制御方法及び装置 |
JPH1082589A (ja) * | 1996-07-19 | 1998-03-31 | Thermo Riko:Kk | 面加熱型赤外線放射加熱装置 |
JPH1064414A (ja) * | 1996-08-16 | 1998-03-06 | Canon Inc | 画像表示装置の製造方法及びその方法の実施のための製造装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2007200834A (ja) | 2007-08-09 |
CN100505192C (zh) | 2009-06-24 |
KR100703472B1 (ko) | 2007-04-03 |
EP1814188A3 (en) | 2011-06-15 |
TW200729478A (en) | 2007-08-01 |
EP1814188A2 (en) | 2007-08-01 |
US8128449B2 (en) | 2012-03-06 |
TWI331398B (en) | 2010-10-01 |
US20070170856A1 (en) | 2007-07-26 |
CN101009232A (zh) | 2007-08-01 |
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