JP2007110126A - 活性層上に誘電体層の形成された側面発光型半導体レーザダイオード - Google Patents
活性層上に誘電体層の形成された側面発光型半導体レーザダイオード Download PDFInfo
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- JP2007110126A JP2007110126A JP2006277767A JP2006277767A JP2007110126A JP 2007110126 A JP2007110126 A JP 2007110126A JP 2006277767 A JP2006277767 A JP 2006277767A JP 2006277767 A JP2006277767 A JP 2006277767A JP 2007110126 A JP2007110126 A JP 2007110126A
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- H01S5/24—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a grooved structure, e.g. V-grooved, crescent active layer in groove, VSIS laser
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- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
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- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/065—Mode locking; Mode suppression; Mode selection ; Self pulsating
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- H01S5/0655—Single transverse or lateral mode emission
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2059—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion
- H01S5/2063—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion obtained by particle bombardment
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2222—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties
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- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
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Abstract
【解決手段】基板上に順次に形成されたn−クラッド層、n−光ガイド層、活性層、p−光ガイド層を備える側面発光型半導体レーザダイオードにおいて、p−光ガイド層上にリッジ形態の誘電体層の形成された側面発光型半導体レーザダイオードである。
【選択図】図2
Description
11 n−AlGaN層
12 n−AlGaNクラッド層
13 InGaN活性層
14 p−AlGaNクラッド層
15,26 p−コンタクト層
16,28 p−電極層
17,29 n−電極層
21 n−半導体層
22 n−クラッド層
23 n−光ガイド層
24 活性層
25 p−光ガイド層
25a 電流制限領域
27 誘電体層
30 電流制限層
31 電流拡散層
Claims (15)
- 基板上に順次に形成されたn−クラッド層、n−光ガイド層、活性層、p−光ガイド層を備える側面発光型半導体レーザダイオードにおいて、
前記p−光ガイド層上にリッジ形態の誘電体層が形成されていることを特徴とする側面発光型半導体レーザダイオード。 - 前記p−光ガイド層及び前記誘電体層間にp−コンタクト層がさらに形成されていることを特徴とする請求項1に記載の側面発光型半導体レーザダイオード。
- 前記誘電体層の側部にp−電極層がさらに形成されていることを特徴とする請求項2に記載の側面発光型半導体レーザダイオード。
- 前記基板及び前記n−クラッド層間にn−半導体層がさらに形成され、前記n−半導体層の一側部にn−電極層が形成されていることを特徴とする請求項1に記載の側面発光型半導体レーザダイオード。
- 前記p−光ガイド層の両側面に電流制限領域が形成されていることを特徴とする請求項1に記載の側面発光型半導体レーザダイオード。
- 前記n−光ガイド層の両側上部に形成され、前記活性層に印加される電流を制限する電流制限層が形成されていることを特徴とする請求項1に記載の側面発光型半導体レーザダイオード。
- 前記p−光ガイド層及び前記p−コンタクト層間に形成された電流拡散層をさらに備えていることを特徴とする請求項2に記載の側面発光型半導体レーザダイオード。
- 前記n−クラッド層は、AlxGaN(x≧0)から形成されていることを特徴とする請求項1に記載の側面発光型半導体レーザダイオード。
- 前記n−光ガイド層は、InxGaN(x≧0)から形成されていることを特徴とする請求項1に記載の側面発光型半導体レーザダイオード。
- 前記活性層は、InxGaN(x≧0)を含むMQW構造により形成されていることを特徴とする請求項1に記載の側面発光型半導体レーザダイオード。
- 前記p−光ガイド層は、InxGaN(x≧0)から形成されていることを特徴とする請求項1に記載の側面発光型半導体レーザダイオード。
- 前記誘電体層は、SiO2、SiNx、HfOx、AlN、Al2O3、TiO2、ZrO2、MnO、Ta2O5のうち少なくともいずれか一つを含んで形成されていることを特徴とする請求項1に記載の側面発光型半導体レーザダイオード。
- 前記p−コンタクト層は、InxGaN(x≧0)から形成されていることを特徴とする請求項2に記載の側面発光型半導体レーザダイオード。
- 前記電流制限層は、非ドープAlGaNまたはp−AlGaNから形成されていることを特徴とする請求項6に記載の側面発光型半導体レーザダイオード。
- 前記電流拡散層は、AlGaNから形成されていることを特徴とする請求項7に記載の側面発光型半導体レーザダイオード。
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KR1020050096159A KR101111720B1 (ko) | 2005-10-12 | 2005-10-12 | 활성층 상에 유전체층이 형성된 측면 발광형 반도체 레이저다이오드 |
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JP2006277767A Ceased JP2007110126A (ja) | 2005-10-12 | 2006-10-11 | 活性層上に誘電体層の形成された側面発光型半導体レーザダイオード |
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US (2) | US7899103B2 (ja) |
JP (1) | JP2007110126A (ja) |
KR (1) | KR101111720B1 (ja) |
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KR102609001B1 (ko) * | 2022-01-18 | 2023-12-04 | 인하대학교 산학협력단 | 질화물 반도체 레이저 소자 및 그의 제조 방법 |
KR102609002B1 (ko) * | 2022-01-18 | 2023-12-04 | 인하대학교 산학협력단 | 질화물 반도체 레이저 소자 및 그의 제조 방법 |
Citations (1)
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JP2006041491A (ja) * | 2004-06-21 | 2006-02-09 | Matsushita Electric Ind Co Ltd | 半導体レーザ素子及びその製造方法 |
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US5123070A (en) * | 1990-09-10 | 1992-06-16 | Tacan Corporation | Method of monolithic temperature-stabilization of a laser diode by evanescent coupling to a temperature stable grating |
JP2783210B2 (ja) * | 1995-09-04 | 1998-08-06 | 日本電気株式会社 | 面発光型ダイオード |
US6097063A (en) * | 1996-01-22 | 2000-08-01 | Fuji Electric Co., Ltd. | Semiconductor device having a plurality of parallel drift regions |
KR100446592B1 (ko) * | 1997-02-05 | 2004-11-16 | 삼성전자주식회사 | 반도체레이저다이오드및그제조방법 |
CN1292458C (zh) * | 1997-04-11 | 2006-12-27 | 日亚化学工业株式会社 | 氮化物半导体的生长方法、氮化物半导体衬底及器件 |
US6207973B1 (en) * | 1998-08-19 | 2001-03-27 | Ricoh Company, Ltd. | Light emitting devices with layered III-V semiconductor structures |
JP3344381B2 (ja) * | 1999-08-23 | 2002-11-11 | 日本電気株式会社 | 半導体装置及びその製造方法 |
JP2001176805A (ja) * | 1999-12-16 | 2001-06-29 | Sony Corp | 窒化物系iii−v族化合物の結晶製造方法、窒化物系iii−v族化合物結晶基板、窒化物系iii−v族化合物結晶膜およびデバイスの製造方法 |
JP2002314203A (ja) * | 2001-04-12 | 2002-10-25 | Pioneer Electronic Corp | 3族窒化物半導体レーザ及びその製造方法 |
JP3876649B2 (ja) * | 2001-06-05 | 2007-02-07 | ソニー株式会社 | 窒化物半導体レーザ及びその製造方法 |
US6455340B1 (en) * | 2001-12-21 | 2002-09-24 | Xerox Corporation | Method of fabricating GaN semiconductor structures using laser-assisted epitaxial liftoff |
JP4590820B2 (ja) * | 2002-12-16 | 2010-12-01 | 富士ゼロックス株式会社 | 面発光型半導体レーザおよびその製造方法 |
JP4507489B2 (ja) | 2002-12-16 | 2010-07-21 | 富士ゼロックス株式会社 | 面発光型半導体レーザ及びその製造方法 |
JP2004241413A (ja) * | 2003-02-03 | 2004-08-26 | Toshiba Corp | 半導体装置 |
US7009215B2 (en) * | 2003-10-24 | 2006-03-07 | General Electric Company | Group III-nitride based resonant cavity light emitting devices fabricated on single crystal gallium nitride substrates |
KR20050087025A (ko) * | 2004-02-24 | 2005-08-31 | 엘지전자 주식회사 | 레이저 다이오드 및 그의 제조 방법 |
JP2005340567A (ja) * | 2004-05-28 | 2005-12-08 | Fuji Xerox Co Ltd | 表面発光型半導体レーザ素子およびその製造方法 |
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- 2005-10-12 KR KR1020050096159A patent/KR101111720B1/ko not_active IP Right Cessation
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- 2006-10-11 JP JP2006277767A patent/JP2007110126A/ja not_active Ceased
- 2006-10-11 US US11/545,546 patent/US7899103B2/en not_active Expired - Fee Related
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- 2011-01-21 US US13/011,674 patent/US20110116525A1/en not_active Abandoned
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JP2006041491A (ja) * | 2004-06-21 | 2006-02-09 | Matsushita Electric Ind Co Ltd | 半導体レーザ素子及びその製造方法 |
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KR20070040629A (ko) | 2007-04-17 |
KR101111720B1 (ko) | 2012-02-15 |
US20110116525A1 (en) | 2011-05-19 |
US7899103B2 (en) | 2011-03-01 |
US20070081570A1 (en) | 2007-04-12 |
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