JP2007227930A - 高出力半導体レーザー素子 - Google Patents
高出力半導体レーザー素子 Download PDFInfo
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- JP2007227930A JP2007227930A JP2007042722A JP2007042722A JP2007227930A JP 2007227930 A JP2007227930 A JP 2007227930A JP 2007042722 A JP2007042722 A JP 2007042722A JP 2007042722 A JP2007042722 A JP 2007042722A JP 2007227930 A JP2007227930 A JP 2007227930A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2018—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers
- H01S5/2022—Absorbing region or layer parallel to the active layer, e.g. to influence transverse modes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
- F26B3/32—Drying solid materials or objects by processes involving the application of heat by development of heat within the materials or objects to be dried, e.g. by fermentation or other microbiological action
- F26B3/34—Drying solid materials or objects by processes involving the application of heat by development of heat within the materials or objects to be dried, e.g. by fermentation or other microbiological action by using electrical effects
- F26B3/347—Electromagnetic heating, e.g. induction heating or heating using microwave energy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B2200/00—Drying processes and machines for solid materials characterised by the specific requirements of the drying good
- F26B2200/04—Garbage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
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- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
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- General Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Health & Medical Sciences (AREA)
- Semiconductor Lasers (AREA)
Abstract
【解決手段】半導体レーザー素子30は、第1及び第2導電型クラッド層32、35と、その間に形成された活性層34及び上記第1及び第2導電型クラッド層と上記活性層との間に形成された第1及び第2光ガイド層33a、33bを含む半導体レーザー素子30において、上記第1及び第2導電型クラッド層の少なくとも一つは、レーザービームの分布と重畳された少なくとも一部領域が意図的にドープされない光損失抑制領域32a、35aである。
【選択図】 図3
Description
32 第1導電型クラッド層
33a、33b 第1及び第2光ガイド層
34 活性層
35 第2導電型クラッド層
32a、35a 光損失抑制領域
36 第2導電型コンタクト層
37 電流遮断層
39a、39b 第1及び第2電極
Claims (7)
- 第1及び第2導電型クラッド層と、その間に形成された活性層及び前記第1及び第2導電型クラッド層と前記活性層との間に形成された第1及び第2光ガイド層を含む半導体レーザー素子において、
前記第1及び第2導電型クラッド層の少なくとも一つは、レーザービームの分布と重畳された少なくとも一部領域が意図的にドープされない光損失抑制領域であることを特徴とする半導体レーザー素子。 - 前記光損失抑制領域は、前記第1または第2光ガイドと接した領域であることを特徴とする請求項1に記載の半導体レーザー素子。
- 前記光損失抑制領域は、前記第1及び第2導電型クラッド層の両方に形成されることを特徴とする請求項1に記載の半導体レーザー素子。
- 前記光損失抑制領域は、前記活性層及び前記第1及び第2光ガイド層と共にレーザービーム分布の80%以上を占める厚さを有することを特徴とする請求項1〜3のいずれか一項に記載の半導体レーザー素子。
- 前記光損失抑制領域は、前記活性層及び前記第1及び第2光ガイド層と共にレーザービーム分布の90%以上を占める厚さを有することを特徴とする請求項4に記載の半導体レーザー素子。
- 前記光損失抑制領域の厚さは、約10〜300nmであることを特徴とする請求項1〜5のいずれか一項に記載の半導体レーザー素子。
- 前記光損失抑制領域のドープ濃度は、1017/cm3以下であることを特徴とする請求項1〜6のいずれか一項に記載の半導体レーザー素子。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060017419A KR20070084973A (ko) | 2006-02-22 | 2006-02-22 | 고출력 반도체 레이저소자 |
Publications (1)
Publication Number | Publication Date |
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JP2007227930A true JP2007227930A (ja) | 2007-09-06 |
Family
ID=38428152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007042722A Pending JP2007227930A (ja) | 2006-02-22 | 2007-02-22 | 高出力半導体レーザー素子 |
Country Status (3)
Country | Link |
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US (1) | US7466737B2 (ja) |
JP (1) | JP2007227930A (ja) |
KR (1) | KR20070084973A (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5002391B2 (ja) * | 2007-09-26 | 2012-08-15 | 三菱電機株式会社 | 半導体レーザ装置 |
JP5328726B2 (ja) | 2009-08-25 | 2013-10-30 | 三星ディスプレイ株式會社 | 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法 |
JP5677785B2 (ja) | 2009-08-27 | 2015-02-25 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法 |
US8876975B2 (en) | 2009-10-19 | 2014-11-04 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
KR101146982B1 (ko) | 2009-11-20 | 2012-05-22 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 및 유기 발광 디스플레이 장치 제조 방법 |
KR101084184B1 (ko) | 2010-01-11 | 2011-11-17 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
KR101174875B1 (ko) | 2010-01-14 | 2012-08-17 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
KR101193186B1 (ko) | 2010-02-01 | 2012-10-19 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
KR101156441B1 (ko) | 2010-03-11 | 2012-06-18 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
KR101202348B1 (ko) | 2010-04-06 | 2012-11-16 | 삼성디스플레이 주식회사 | 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법 |
US8894458B2 (en) | 2010-04-28 | 2014-11-25 | Samsung Display Co., Ltd. | Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method |
KR101223723B1 (ko) | 2010-07-07 | 2013-01-18 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
KR101738531B1 (ko) | 2010-10-22 | 2017-05-23 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
KR101723506B1 (ko) | 2010-10-22 | 2017-04-19 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
KR20120045865A (ko) | 2010-11-01 | 2012-05-09 | 삼성모바일디스플레이주식회사 | 유기층 증착 장치 |
KR20120065789A (ko) | 2010-12-13 | 2012-06-21 | 삼성모바일디스플레이주식회사 | 유기층 증착 장치 |
KR101760897B1 (ko) | 2011-01-12 | 2017-07-25 | 삼성디스플레이 주식회사 | 증착원 및 이를 구비하는 유기막 증착 장치 |
KR101852517B1 (ko) | 2011-05-25 | 2018-04-27 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
KR101840654B1 (ko) | 2011-05-25 | 2018-03-22 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
KR101857249B1 (ko) | 2011-05-27 | 2018-05-14 | 삼성디스플레이 주식회사 | 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치 |
KR101826068B1 (ko) | 2011-07-04 | 2018-02-07 | 삼성디스플레이 주식회사 | 유기층 증착 장치 |
KR20130010730A (ko) | 2011-07-19 | 2013-01-29 | 삼성디스플레이 주식회사 | 증착 소스 및 이를 구비한 증착 장치 |
KR20130015144A (ko) | 2011-08-02 | 2013-02-13 | 삼성디스플레이 주식회사 | 증착원어셈블리, 유기층증착장치 및 이를 이용한 유기발광표시장치의 제조 방법 |
KR101994838B1 (ko) | 2012-09-24 | 2019-10-01 | 삼성디스플레이 주식회사 | 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
Citations (7)
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JPS6482587A (en) * | 1987-09-25 | 1989-03-28 | Sumitomo Electric Industries | Quantum well type semiconductor laser |
JPH05243674A (ja) * | 1992-03-02 | 1993-09-21 | Seiko Epson Corp | 半導体レーザ |
JPH11330605A (ja) * | 1998-05-14 | 1999-11-30 | Anritsu Corp | 半導体レーザ |
JP2000286507A (ja) * | 1999-01-29 | 2000-10-13 | Sharp Corp | 半導体レーザ素子及びその製造方法 |
JP2002009401A (ja) * | 2000-06-16 | 2002-01-11 | Furukawa Electric Co Ltd:The | 半導体レーザ素子 |
JP2002299762A (ja) * | 2001-03-30 | 2002-10-11 | Nichia Chem Ind Ltd | 窒化物半導体素子 |
JP2003338665A (ja) * | 2002-03-15 | 2003-11-28 | Fuji Photo Film Co Ltd | 半導体レーザ素子 |
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US5818860A (en) * | 1996-11-27 | 1998-10-06 | David Sarnoff Research Center, Inc. | High power semiconductor laser diode |
US7279751B2 (en) * | 2004-06-21 | 2007-10-09 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser device and manufacturing method thereof |
JP2007035784A (ja) * | 2005-07-25 | 2007-02-08 | Sumitomo Electric Ind Ltd | 分布帰還型半導体レーザ |
-
2006
- 2006-02-22 KR KR1020060017419A patent/KR20070084973A/ko not_active Application Discontinuation
-
2007
- 2007-02-22 US US11/677,646 patent/US7466737B2/en active Active
- 2007-02-22 JP JP2007042722A patent/JP2007227930A/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6482587A (en) * | 1987-09-25 | 1989-03-28 | Sumitomo Electric Industries | Quantum well type semiconductor laser |
JPH05243674A (ja) * | 1992-03-02 | 1993-09-21 | Seiko Epson Corp | 半導体レーザ |
JPH11330605A (ja) * | 1998-05-14 | 1999-11-30 | Anritsu Corp | 半導体レーザ |
JP2000286507A (ja) * | 1999-01-29 | 2000-10-13 | Sharp Corp | 半導体レーザ素子及びその製造方法 |
JP2002009401A (ja) * | 2000-06-16 | 2002-01-11 | Furukawa Electric Co Ltd:The | 半導体レーザ素子 |
JP2002299762A (ja) * | 2001-03-30 | 2002-10-11 | Nichia Chem Ind Ltd | 窒化物半導体素子 |
JP2003338665A (ja) * | 2002-03-15 | 2003-11-28 | Fuji Photo Film Co Ltd | 半導体レーザ素子 |
Also Published As
Publication number | Publication date |
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US20070195844A1 (en) | 2007-08-23 |
KR20070084973A (ko) | 2007-08-27 |
US7466737B2 (en) | 2008-12-16 |
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Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20120814 |