JP2007106665A - 格子パラメータを変化させる元素を含有する窒化ガリウムデバイス基板 - Google Patents
格子パラメータを変化させる元素を含有する窒化ガリウムデバイス基板 Download PDFInfo
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- 229910002601 GaN Inorganic materials 0.000 title claims abstract description 148
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims abstract description 133
- 239000000758 substrate Substances 0.000 title claims abstract description 107
- 229910052738 indium Inorganic materials 0.000 claims description 61
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 61
- 239000000203 mixture Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 28
- 229910052782 aluminium Inorganic materials 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 description 41
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 18
- 238000005530 etching Methods 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000005693 optoelectronics Effects 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 208000012868 Overgrowth Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- AJGDITRVXRPLBY-UHFFFAOYSA-N aluminum indium Chemical compound [Al].[In] AJGDITRVXRPLBY-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
- H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
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- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
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- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
Abstract
【解決手段】第1の犠牲基板を設け、この第1の犠牲基板上に窒化ガリウムの層を形成し、この窒化ガリウムの層上に、格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの第1の層を形成し、この格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの層に、代替基板を装着し、犠牲基板および窒化ガリウムの層を除去する。
【選択図】図2
Description
Claims (20)
- 窒化ガリウムデバイス基板を形成する方法であって、
第1の犠牲基板を設け、
前記第1の犠牲基板上に、窒化ガリウムの層を形成し、
前記窒化ガリウムの層上に、格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの第1の層を形成し、
前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの第1の層に、代替基板を装着し、
前記犠牲基板および前記窒化ガリウムの層を除去する、方法。 - 前記格子パラメータを変化させる追加的な元素が、アルミニウムおよびインジウムから選択される、請求項1に記載の方法。
- 前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの第1の層の組成が、InxGa1−xN[式中、0≦x≦1]である、請求項2に記載の方法。
- 前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの第1の層の組成が、In0.1Ga0.9Nである、請求項3に記載の方法。
- 前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの第1の層の組成が、AlxGa1−xN[式中、0≦x≦1]である、請求項2に記載の方法。
- 前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの第1の層の組成が、Al0.1Ga0.9Nである、請求項5に記載の方法。
- 前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの第1の層上に、前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの第2の層を形成し、
前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの第2の層に、追加的な代替基板を装着し、
前記基板と、前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの第1の層とを除去する、請求項2に記載の方法。 - 前記格子パラメータを変化させる追加的な元素がインジウムである、請求項7に記載の方法。
- 前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの第2の後続の層の組成が、InxGa1−xN[式中、0≦x≦1]である、請求項8に記載の方法。
- 前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの第2の後続の層の組成が、In0.2Ga0.8Nである、請求項9に記載の方法。
- 基板上に、前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの層を有する、窒化ガリウムデバイス基板。
- 前記格子パラメータを変化させる追加的な元素が、アルミニウムおよびインジウムから選択される、請求項11に記載の基板。
- 前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの層の組成が、InxGa1−xN[式中、0≦x≦1]である、請求項12に記載の基板。
- 前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの層の組成が、In0.1Ga0.9Nである、請求項13に記載の基板。
- 前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの層の組成が、AlxGa1−xN[式中、0≦x≦1]である、請求項12に記載の基板。
- 前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの層の組成が、Al0.1Ga0.9Nである、請求項15に記載の基板。
- 前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの層の組成が、InxGa1−xN[式中、0.1≦x≦0.5]である、請求項12に記載の基板。
- 犠牲基板と、
前記犠牲基板上に設けられている窒化ガリウムの層と、
前記窒化ガリウムの層上に設けられている窒化インジウムガリウムの層と、
前記窒化インジウムガリウムの層に装着された代替基板とを備えており、
前記犠牲基板および前記窒化ガリウムの層を除去することによって、窒化インジウムガリウムデバイス基板が現れる、窒化ガリウムデバイス基板。 - 前記窒化インジウムガリウムの層の組成が、AlxGa1−xN[式中、0≦x≦1]である、請求項18に記載の基板。
- 前記格子パラメータを変化させる追加的な元素を含有する窒化ガリウムの層の組成が、In0.1Ga0.9Nである、請求項19に記載の基板。
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US11/194,237 US7273798B2 (en) | 2005-08-01 | 2005-08-01 | Gallium nitride device substrate containing a lattice parameter altering element |
US11/194237 | 2005-08-01 |
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JP5317398B2 JP5317398B2 (ja) | 2013-10-16 |
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US (2) | US7273798B2 (ja) |
EP (1) | EP1750311A3 (ja) |
JP (1) | JP5317398B2 (ja) |
KR (2) | KR101342329B1 (ja) |
CN (1) | CN1909190B (ja) |
TW (1) | TWI344674B (ja) |
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US10373825B1 (en) | 2018-05-29 | 2019-08-06 | Industry-University Cooperation Foundation Hanyang University | Method for manufacturing gallium nitride substrate using core-shell nanoparticle |
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JP4600641B2 (ja) * | 2004-01-27 | 2010-12-15 | 日立電線株式会社 | 窒化物半導体自立基板及びそれを用いた窒化物半導体発光素子 |
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JP2005515150A (ja) * | 2002-01-22 | 2005-05-26 | エス オー イ テク シリコン オン インシュレータ テクノロジース | 単結晶半導体材料製自立基板の製造方法 |
JP2004266240A (ja) * | 2002-07-08 | 2004-09-24 | Nichia Chem Ind Ltd | 窒化物半導体素子の製造方法及び窒化物半導体素子 |
WO2004084275A2 (en) * | 2003-03-18 | 2004-09-30 | Crystal Photonics, Incorporated | Method for making group iii nitride devices and devices produced thereby |
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TW200721267A (en) | 2007-06-01 |
CN1909190B (zh) | 2012-03-21 |
JP5317398B2 (ja) | 2013-10-16 |
KR20130095692A (ko) | 2013-08-28 |
TWI344674B (en) | 2011-07-01 |
EP1750311A2 (en) | 2007-02-07 |
KR101509309B1 (ko) | 2015-04-06 |
US20070278622A1 (en) | 2007-12-06 |
KR101342329B1 (ko) | 2013-12-16 |
US7273798B2 (en) | 2007-09-25 |
US8039869B2 (en) | 2011-10-18 |
US20070032041A1 (en) | 2007-02-08 |
KR20070015863A (ko) | 2007-02-06 |
EP1750311A3 (en) | 2008-05-28 |
CN1909190A (zh) | 2007-02-07 |
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