JP2007103828A5 - - Google Patents

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Publication number
JP2007103828A5
JP2007103828A5 JP2005294633A JP2005294633A JP2007103828A5 JP 2007103828 A5 JP2007103828 A5 JP 2007103828A5 JP 2005294633 A JP2005294633 A JP 2005294633A JP 2005294633 A JP2005294633 A JP 2005294633A JP 2007103828 A5 JP2007103828 A5 JP 2007103828A5
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JP
Japan
Prior art keywords
insulating layer
floating gate
gate electrode
constituting
semiconductor memory
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Application number
JP2005294633A
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English (en)
Japanese (ja)
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JP4876520B2 (ja
JP2007103828A (ja
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Priority to JP2005294633A priority Critical patent/JP4876520B2/ja
Priority claimed from JP2005294633A external-priority patent/JP4876520B2/ja
Publication of JP2007103828A publication Critical patent/JP2007103828A/ja
Publication of JP2007103828A5 publication Critical patent/JP2007103828A5/ja
Application granted granted Critical
Publication of JP4876520B2 publication Critical patent/JP4876520B2/ja
Expired - Fee Related legal-status Critical Current
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JP2005294633A 2005-10-07 2005-10-07 不揮発性半導体メモリ及びその製造方法 Expired - Fee Related JP4876520B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005294633A JP4876520B2 (ja) 2005-10-07 2005-10-07 不揮発性半導体メモリ及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005294633A JP4876520B2 (ja) 2005-10-07 2005-10-07 不揮発性半導体メモリ及びその製造方法

Publications (3)

Publication Number Publication Date
JP2007103828A JP2007103828A (ja) 2007-04-19
JP2007103828A5 true JP2007103828A5 (enrdf_load_stackoverflow) 2008-11-13
JP4876520B2 JP4876520B2 (ja) 2012-02-15

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ID=38030445

Family Applications (1)

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JP2005294633A Expired - Fee Related JP4876520B2 (ja) 2005-10-07 2005-10-07 不揮発性半導体メモリ及びその製造方法

Country Status (1)

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JP (1) JP4876520B2 (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7846793B2 (en) * 2007-10-03 2010-12-07 Applied Materials, Inc. Plasma surface treatment for SI and metal nanocrystal nucleation
KR101490109B1 (ko) * 2007-10-18 2015-02-12 삼성전자주식회사 반도체 소자와 그의 제조 및 동작방법
US8383432B2 (en) * 2008-08-07 2013-02-26 Sharp Laboratories Of America, Inc. Colloidal-processed silicon particle device
JP5706077B2 (ja) * 2008-10-02 2015-04-22 三星電子株式会社Samsung Electronics Co.,Ltd. 半導体素子とその製造及び動作方法
CN102496631B (zh) * 2011-11-25 2014-05-21 中山大学 背电极结构的ZnO基全透明非挥发存储器及制备方法
US10109429B2 (en) 2013-10-04 2018-10-23 Asahi Kasei Kabushiki Kaisha Solar cell, manufacturing method therefor, semiconductor device, and manufacturing method therefor
CN106328535B (zh) * 2015-07-02 2019-08-27 中芯国际集成电路制造(上海)有限公司 鳍式场效应晶体管及其形成方法
TW201825384A (zh) * 2016-08-22 2018-07-16 國立研究開發法人科學技術振興機構 記憶組件
CN112582541B (zh) * 2020-12-06 2022-07-29 南开大学 一种基于二维叠层异质结构的垂直单分子膜场效应晶体管及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4635410B2 (ja) * 2002-07-02 2011-02-23 ソニー株式会社 半導体装置及びその製造方法
JP4056817B2 (ja) * 2002-07-23 2008-03-05 光正 小柳 不揮発性半導体記憶素子の製造方法
JP4514087B2 (ja) * 2002-09-25 2010-07-28 シャープ株式会社 メモリ膜構造、メモリ素子及びその製造方法、並びに、半導体集積回路及びそれを用いた携帯電子機器
JP4563652B2 (ja) * 2003-03-13 2010-10-13 シャープ株式会社 メモリ機能体および微粒子形成方法並びにメモリ素子、半導体装置および電子機器
JP5419326B2 (ja) * 2003-10-06 2014-02-19 マサチューセッツ インスティテュート オブ テクノロジー 不揮発性メモリデバイス
JP4420692B2 (ja) * 2004-02-10 2010-02-24 シャープ株式会社 メモリ素子の製造方法
JP4696520B2 (ja) * 2004-10-05 2011-06-08 ソニー株式会社 電界効果型トランジスタ及びその製造方法

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