JP2008124188A5 - - Google Patents

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Publication number
JP2008124188A5
JP2008124188A5 JP2006305111A JP2006305111A JP2008124188A5 JP 2008124188 A5 JP2008124188 A5 JP 2008124188A5 JP 2006305111 A JP2006305111 A JP 2006305111A JP 2006305111 A JP2006305111 A JP 2006305111A JP 2008124188 A5 JP2008124188 A5 JP 2008124188A5
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JP
Japan
Prior art keywords
wire
fine
insulating
electrode structure
thin wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006305111A
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English (en)
Japanese (ja)
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JP2008124188A (ja
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Publication date
Application filed filed Critical
Priority to JP2006305111A priority Critical patent/JP2008124188A/ja
Priority claimed from JP2006305111A external-priority patent/JP2008124188A/ja
Publication of JP2008124188A publication Critical patent/JP2008124188A/ja
Publication of JP2008124188A5 publication Critical patent/JP2008124188A5/ja
Pending legal-status Critical Current

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JP2006305111A 2006-11-10 2006-11-10 電極構造体及びその製造方法、並びに電子デバイス Pending JP2008124188A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006305111A JP2008124188A (ja) 2006-11-10 2006-11-10 電極構造体及びその製造方法、並びに電子デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006305111A JP2008124188A (ja) 2006-11-10 2006-11-10 電極構造体及びその製造方法、並びに電子デバイス

Publications (2)

Publication Number Publication Date
JP2008124188A JP2008124188A (ja) 2008-05-29
JP2008124188A5 true JP2008124188A5 (enrdf_load_stackoverflow) 2009-12-03

Family

ID=39508633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006305111A Pending JP2008124188A (ja) 2006-11-10 2006-11-10 電極構造体及びその製造方法、並びに電子デバイス

Country Status (1)

Country Link
JP (1) JP2008124188A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5360528B2 (ja) * 2008-05-07 2013-12-04 国立大学法人北陸先端科学技術大学院大学 ギャップで分断された薄膜の製造方法、およびこれを用いたデバイスの製造方法
US8114787B2 (en) 2009-02-19 2012-02-14 Empire Technology Development Llc Integrated circuit nanowires
KR101407209B1 (ko) * 2010-10-07 2014-06-16 포항공과대학교 산학협력단 미세 패턴 형성 방법 및 이를 이용한 미세 채널 트랜지스터 및 미세 채널 발광트랜지스터의 형성방법
CN108072683B (zh) * 2016-11-10 2021-04-23 元太科技工业股份有限公司 感测元件及其形成方法
US11784227B2 (en) 2017-10-13 2023-10-10 Wayne State University Method for fabricating wafer scale/nano sub micron gap electrodes and arrays via photolithography
GB2587793B (en) 2019-08-21 2023-03-22 Pragmatic Printing Ltd Electronic circuit comprising transistor and resistor
GB2610886B (en) 2019-08-21 2023-09-13 Pragmatic Printing Ltd Resistor geometry

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2373095A (en) * 2001-03-09 2002-09-11 Seiko Epson Corp Patterning substrates with evaporation residues

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