JP2007092064A5 - - Google Patents
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- Publication number
- JP2007092064A5 JP2007092064A5 JP2006257391A JP2006257391A JP2007092064A5 JP 2007092064 A5 JP2007092064 A5 JP 2007092064A5 JP 2006257391 A JP2006257391 A JP 2006257391A JP 2006257391 A JP2006257391 A JP 2006257391A JP 2007092064 A5 JP2007092064 A5 JP 2007092064A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing composition
- acid
- oxidant
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 44
- 239000000203 mixture Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 7
- 239000007800 oxidant agent Substances 0.000 claims description 7
- 150000003851 azoles Chemical class 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000008119 colloidal silica Substances 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 3
- 239000012964 benzotriazole Substances 0.000 claims description 3
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 claims description 2
- SDXAWLJRERMRKF-UHFFFAOYSA-N 3,5-dimethyl-1h-pyrazole Chemical compound CC=1C=C(C)NN=1 SDXAWLJRERMRKF-UHFFFAOYSA-N 0.000 claims description 2
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 claims description 2
- 150000003863 ammonium salts Chemical class 0.000 claims description 2
- 150000007522 mineralic acids Chemical class 0.000 claims description 2
- 150000007524 organic acids Chemical class 0.000 claims description 2
- 235000005985 organic acids Nutrition 0.000 claims description 2
- 159000000000 sodium salts Chemical class 0.000 claims description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims 4
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims 1
- 159000000001 potassium salts Chemical class 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 5
- 239000006061 abrasive grain Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/238,256 | 2005-09-29 | ||
| US11/238,256 US20070068902A1 (en) | 2005-09-29 | 2005-09-29 | Polishing composition and polishing method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012020207A Division JP5775470B2 (ja) | 2005-09-29 | 2012-02-01 | 研磨用組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007092064A JP2007092064A (ja) | 2007-04-12 |
| JP2007092064A5 true JP2007092064A5 (enExample) | 2012-03-15 |
| JP5025204B2 JP5025204B2 (ja) | 2012-09-12 |
Family
ID=37434808
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006257391A Active JP5025204B2 (ja) | 2005-09-29 | 2006-09-22 | 研磨用組成物及び磁気ディスク用基板の製造方法 |
| JP2012020207A Active JP5775470B2 (ja) | 2005-09-29 | 2012-02-01 | 研磨用組成物 |
| JP2013181661A Active JP5816663B2 (ja) | 2005-09-29 | 2013-09-02 | スクラッチ低減方法及びスクラッチ低減剤 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012020207A Active JP5775470B2 (ja) | 2005-09-29 | 2012-02-01 | 研磨用組成物 |
| JP2013181661A Active JP5816663B2 (ja) | 2005-09-29 | 2013-09-02 | スクラッチ低減方法及びスクラッチ低減剤 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20070068902A1 (enExample) |
| JP (3) | JP5025204B2 (enExample) |
| CN (1) | CN1939994A (enExample) |
| GB (1) | GB2430680A (enExample) |
| MY (1) | MY150651A (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2322322B2 (en) * | 2008-06-13 | 2022-10-05 | Fujimi Incorporated | Aluminum oxide particle and polishing composition containing the same |
| JP5473544B2 (ja) * | 2008-11-06 | 2014-04-16 | 花王株式会社 | 磁気ディスク基板用研磨液組成物 |
| US20110203186A1 (en) * | 2008-11-06 | 2011-08-25 | Yoshiaki Oshima | Polishing liquid composition for magnetic disk substrate |
| CN101463292B (zh) * | 2008-11-28 | 2011-11-02 | 江苏海迅实业集团股份有限公司 | 一种车船玻璃表面处理剂 |
| TWI454561B (zh) * | 2008-12-30 | 2014-10-01 | Uwiz Technology Co Ltd | A polishing composition for planarizing the metal layer |
| JP5473587B2 (ja) * | 2009-12-24 | 2014-04-16 | 花王株式会社 | 磁気ディスク基板用研磨液組成物 |
| JP5657247B2 (ja) * | 2009-12-25 | 2015-01-21 | 花王株式会社 | 研磨液組成物 |
| CN103160207A (zh) * | 2011-12-16 | 2013-06-19 | 安集微电子（上海）有限公司 | 一种金属化学机械抛光浆料及其应用 |
| JP6101444B2 (ja) * | 2012-08-01 | 2017-03-22 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた磁気ディスク用基板の製造方法 |
| JP6015259B2 (ja) * | 2012-09-06 | 2016-10-26 | 旭硝子株式会社 | 情報記録媒体用ガラス基板の製造方法および磁気ディスクの製造方法 |
| JP6110716B2 (ja) * | 2013-04-11 | 2017-04-05 | 山口精研工業株式会社 | Ｎｉ−Ｐメッキされたアルミ磁気ディスク基板仕上げ研磨用研磨剤組成物、Ｎｉ−Ｐメッキされたアルミ磁気ディスク基板の研磨方法、Ｎｉ−Ｐメッキされたアルミ磁気ディスク基板の製造方法、及びＮｉ−Ｐメッキされたアルミ磁気ディスク基板 |
| JP2014101518A (ja) * | 2014-01-06 | 2014-06-05 | Fujimi Inc | 研磨用組成物、研磨方法、及び研磨パッドの弾力性低下抑制方法 |
| JP6415967B2 (ja) * | 2014-12-22 | 2018-10-31 | 花王株式会社 | 研磨液組成物 |
| US20190077991A1 (en) * | 2015-10-09 | 2019-03-14 | Fujimi Incorporated | Polishing composition and polishing method using same, and method for producing polishing-completed object to be polished using same |
| CN106916536B (zh) * | 2015-12-25 | 2021-04-20 | 安集微电子（上海）有限公司 | 一种碱性化学机械抛光液 |
| JP6775453B2 (ja) * | 2017-03-23 | 2020-10-28 | 山口精研工業株式会社 | 磁気ディスク基板用研磨剤組成物 |
| JP7246231B2 (ja) * | 2019-03-29 | 2023-03-27 | 株式会社フジミインコーポレーテッド | 研磨用組成物および磁気ディスク基板製造方法 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2725192B2 (ja) * | 1988-12-09 | 1998-03-09 | 株式会社フジミインコーポレーテッド | 研磨剤組成物 |
| US5428721A (en) * | 1990-02-07 | 1995-06-27 | Kabushiki Kaisha Toshiba | Data processing apparatus for editing image by using image conversion |
| US5391258A (en) * | 1993-05-26 | 1995-02-21 | Rodel, Inc. | Compositions and methods for polishing |
| US5575885A (en) * | 1993-12-14 | 1996-11-19 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing semiconductor device |
| JP3397501B2 (ja) * | 1994-07-12 | 2003-04-14 | 株式会社東芝 | 研磨剤および研磨方法 |
| US5858813A (en) * | 1996-05-10 | 1999-01-12 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers and films |
| US5954997A (en) * | 1996-12-09 | 1999-09-21 | Cabot Corporation | Chemical mechanical polishing slurry useful for copper substrates |
| US6126853A (en) * | 1996-12-09 | 2000-10-03 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
| JP4053165B2 (ja) * | 1998-12-01 | 2008-02-27 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いた研磨方法 |
| KR100447551B1 (ko) * | 1999-01-18 | 2004-09-08 | 가부시끼가이샤 도시바 | 복합 입자 및 그의 제조 방법, 수계 분산체, 화학 기계연마용 수계 분산체 조성물 및 반도체 장치의 제조 방법 |
| CN100335580C (zh) * | 1999-08-13 | 2007-09-05 | 卡伯特微电子公司 | 含有阻化化合物的抛光系统及其使用方法 |
| US7041599B1 (en) * | 1999-12-21 | 2006-05-09 | Applied Materials Inc. | High through-put Cu CMP with significantly reduced erosion and dishing |
| US6569215B2 (en) * | 2000-04-17 | 2003-05-27 | Showa Denko Kabushiki Kaisha | Composition for polishing magnetic disk substrate |
| JP2002075927A (ja) * | 2000-08-24 | 2002-03-15 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
| JP2002164307A (ja) * | 2000-11-24 | 2002-06-07 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
| JP2002198331A (ja) * | 2000-12-26 | 2002-07-12 | Jsr Corp | 研磨方法 |
| JP2002231666A (ja) * | 2001-01-31 | 2002-08-16 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
| JP2002270546A (ja) * | 2001-03-07 | 2002-09-20 | Hitachi Chem Co Ltd | 導体用研磨液及びこれを用いた研磨方法 |
| US7160432B2 (en) * | 2001-03-14 | 2007-01-09 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| JP4231632B2 (ja) * | 2001-04-27 | 2009-03-04 | 花王株式会社 | 研磨液組成物 |
| SG144688A1 (en) * | 2001-07-23 | 2008-08-28 | Fujimi Inc | Polishing composition and polishing method employing it |
| US20040253809A1 (en) * | 2001-08-18 | 2004-12-16 | Yao Xiang Yu | Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
| WO2003036705A1 (en) * | 2001-10-26 | 2003-05-01 | Asahi Glass Company, Limited | Polishing compound, method for production thereof and polishing method |
| JP2003297779A (ja) * | 2002-03-29 | 2003-10-17 | Sumitomo Bakelite Co Ltd | 研磨用組成物並びに研磨方法 |
| JP4083502B2 (ja) * | 2002-08-19 | 2008-04-30 | 株式会社フジミインコーポレーテッド | 研磨方法及びそれに用いられる研磨用組成物 |
| JP2004153086A (ja) * | 2002-10-31 | 2004-05-27 | Showa Denko Kk | 金属研磨組成物、金属膜の研磨方法および基板の製造方法 |
| JP4202157B2 (ja) * | 2003-02-28 | 2008-12-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US6918820B2 (en) * | 2003-04-11 | 2005-07-19 | Eastman Kodak Company | Polishing compositions comprising polymeric cores having inorganic surface particles and method of use |
| JP4618987B2 (ja) * | 2003-05-26 | 2011-01-26 | 日立化成工業株式会社 | 研磨液及び研磨方法 |
| JP2005064285A (ja) * | 2003-08-14 | 2005-03-10 | Hitachi Chem Co Ltd | Ｃｍｐ用研磨液及び研磨方法 |
| JP2005136256A (ja) * | 2003-10-31 | 2005-05-26 | Sumitomo Bakelite Co Ltd | 研磨用組成物 |
| US20050097825A1 (en) * | 2003-11-06 | 2005-05-12 | Jinru Bian | Compositions and methods for a barrier removal |
| TWI288046B (en) * | 2003-11-14 | 2007-10-11 | Showa Denko Kk | Polishing composition and polishing method |
| JP2005268664A (ja) * | 2004-03-19 | 2005-09-29 | Fujimi Inc | 研磨用組成物 |
| US20060000808A1 (en) * | 2004-07-01 | 2006-01-05 | Fuji Photo Film Co., Ltd. | Polishing solution of metal and chemical mechanical polishing method |
-
2005
- 2005-09-29 US US11/238,256 patent/US20070068902A1/en not_active Abandoned
-
2006
- 2006-09-22 JP JP2006257391A patent/JP5025204B2/ja active Active
- 2006-09-27 MY MYPI20064221 patent/MY150651A/en unknown
- 2006-09-28 GB GB0619096A patent/GB2430680A/en not_active Withdrawn
- 2006-09-28 CN CNA2006101421605A patent/CN1939994A/zh active Pending
-
2007
- 2007-09-14 US US11/855,665 patent/US20080003928A1/en not_active Abandoned
-
2012
- 2012-02-01 JP JP2012020207A patent/JP5775470B2/ja active Active
-
2013
- 2013-09-02 JP JP2013181661A patent/JP5816663B2/ja active Active
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