MY150651A - Polishing composition and polishing method - Google Patents

Polishing composition and polishing method

Info

Publication number
MY150651A
MY150651A MYPI20064221A MY150651A MY 150651 A MY150651 A MY 150651A MY PI20064221 A MYPI20064221 A MY PI20064221A MY 150651 A MY150651 A MY 150651A
Authority
MY
Malaysia
Prior art keywords
polishing
polishing composition
acid
composition
azoles
Prior art date
Application number
Other languages
English (en)
Inventor
Yasushi Matsunami
Junichi Hirano
Jie Lin
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of MY150651A publication Critical patent/MY150651A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
MYPI20064221 2005-09-29 2006-09-27 Polishing composition and polishing method MY150651A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/238,256 US20070068902A1 (en) 2005-09-29 2005-09-29 Polishing composition and polishing method

Publications (1)

Publication Number Publication Date
MY150651A true MY150651A (en) 2014-02-14

Family

ID=37434808

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20064221 MY150651A (en) 2005-09-29 2006-09-27 Polishing composition and polishing method

Country Status (5)

Country Link
US (2) US20070068902A1 (enExample)
JP (3) JP5025204B2 (enExample)
CN (1) CN1939994A (enExample)
GB (1) GB2430680A (enExample)
MY (1) MY150651A (enExample)

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EP2322322B2 (en) * 2008-06-13 2022-10-05 Fujimi Incorporated Aluminum oxide particle and polishing composition containing the same
JP5473544B2 (ja) * 2008-11-06 2014-04-16 花王株式会社 磁気ディスク基板用研磨液組成物
US20110203186A1 (en) * 2008-11-06 2011-08-25 Yoshiaki Oshima Polishing liquid composition for magnetic disk substrate
CN101463292B (zh) * 2008-11-28 2011-11-02 江苏海迅实业集团股份有限公司 一种车船玻璃表面处理剂
TWI454561B (zh) * 2008-12-30 2014-10-01 Uwiz Technology Co Ltd A polishing composition for planarizing the metal layer
JP5473587B2 (ja) * 2009-12-24 2014-04-16 花王株式会社 磁気ディスク基板用研磨液組成物
JP5657247B2 (ja) * 2009-12-25 2015-01-21 花王株式会社 研磨液組成物
CN103160207A (zh) * 2011-12-16 2013-06-19 安集微电子（上海）有限公司 一种金属化学机械抛光浆料及其应用
JP6101444B2 (ja) * 2012-08-01 2017-03-22 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた磁気ディスク用基板の製造方法
JP6015259B2 (ja) * 2012-09-06 2016-10-26 旭硝子株式会社 情報記録媒体用ガラス基板の製造方法および磁気ディスクの製造方法
JP6110716B2 (ja) * 2013-04-11 2017-04-05 山口精研工業株式会社 Ｎｉ−Ｐメッキされたアルミ磁気ディスク基板仕上げ研磨用研磨剤組成物、Ｎｉ−Ｐメッキされたアルミ磁気ディスク基板の研磨方法、Ｎｉ−Ｐメッキされたアルミ磁気ディスク基板の製造方法、及びＮｉ−Ｐメッキされたアルミ磁気ディスク基板
JP2014101518A (ja) * 2014-01-06 2014-06-05 Fujimi Inc 研磨用組成物、研磨方法、及び研磨パッドの弾力性低下抑制方法
JP6415967B2 (ja) * 2014-12-22 2018-10-31 花王株式会社 研磨液組成物
US20190077991A1 (en) * 2015-10-09 2019-03-14 Fujimi Incorporated Polishing composition and polishing method using same, and method for producing polishing-completed object to be polished using same
CN106916536B (zh) * 2015-12-25 2021-04-20 安集微电子（上海）有限公司 一种碱性化学机械抛光液
JP6775453B2 (ja) * 2017-03-23 2020-10-28 山口精研工業株式会社 磁気ディスク基板用研磨剤組成物
JP7246231B2 (ja) * 2019-03-29 2023-03-27 株式会社フジミインコーポレーテッド 研磨用組成物および磁気ディスク基板製造方法

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JP2725192B2 (ja) * 1988-12-09 1998-03-09 株式会社フジミインコーポレーテッド 研磨剤組成物
US5428721A (en) * 1990-02-07 1995-06-27 Kabushiki Kaisha Toshiba Data processing apparatus for editing image by using image conversion
US5391258A (en) * 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
US5575885A (en) * 1993-12-14 1996-11-19 Kabushiki Kaisha Toshiba Copper-based metal polishing solution and method for manufacturing semiconductor device
JP3397501B2 (ja) * 1994-07-12 2003-04-14 株式会社東芝 研磨剤および研磨方法
US5858813A (en) * 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
US5954997A (en) * 1996-12-09 1999-09-21 Cabot Corporation Chemical mechanical polishing slurry useful for copper substrates
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CN100335580C (zh) * 1999-08-13 2007-09-05 卡伯特微电子公司 含有阻化化合物的抛光系统及其使用方法
US7041599B1 (en) * 1999-12-21 2006-05-09 Applied Materials Inc. High through-put Cu CMP with significantly reduced erosion and dishing
US6569215B2 (en) * 2000-04-17 2003-05-27 Showa Denko Kabushiki Kaisha Composition for polishing magnetic disk substrate
JP2002075927A (ja) * 2000-08-24 2002-03-15 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP2002164307A (ja) * 2000-11-24 2002-06-07 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP2002198331A (ja) * 2000-12-26 2002-07-12 Jsr Corp 研磨方法
JP2002231666A (ja) * 2001-01-31 2002-08-16 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
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JP4231632B2 (ja) * 2001-04-27 2009-03-04 花王株式会社 研磨液組成物
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US20040253809A1 (en) * 2001-08-18 2004-12-16 Yao Xiang Yu Forming a semiconductor structure using a combination of planarizing methods and electropolishing
WO2003036705A1 (en) * 2001-10-26 2003-05-01 Asahi Glass Company, Limited Polishing compound, method for production thereof and polishing method
JP2003297779A (ja) * 2002-03-29 2003-10-17 Sumitomo Bakelite Co Ltd 研磨用組成物並びに研磨方法
JP4083502B2 (ja) * 2002-08-19 2008-04-30 株式会社フジミインコーポレーテッド 研磨方法及びそれに用いられる研磨用組成物
JP2004153086A (ja) * 2002-10-31 2004-05-27 Showa Denko Kk 金属研磨組成物、金属膜の研磨方法および基板の製造方法
JP4202157B2 (ja) * 2003-02-28 2008-12-24 株式会社フジミインコーポレーテッド 研磨用組成物
US6918820B2 (en) * 2003-04-11 2005-07-19 Eastman Kodak Company Polishing compositions comprising polymeric cores having inorganic surface particles and method of use
JP4618987B2 (ja) * 2003-05-26 2011-01-26 日立化成工業株式会社 研磨液及び研磨方法
JP2005064285A (ja) * 2003-08-14 2005-03-10 Hitachi Chem Co Ltd Ｃｍｐ用研磨液及び研磨方法
JP2005136256A (ja) * 2003-10-31 2005-05-26 Sumitomo Bakelite Co Ltd 研磨用組成物
US20050097825A1 (en) * 2003-11-06 2005-05-12 Jinru Bian Compositions and methods for a barrier removal
TWI288046B (en) * 2003-11-14 2007-10-11 Showa Denko Kk Polishing composition and polishing method
JP2005268664A (ja) * 2004-03-19 2005-09-29 Fujimi Inc 研磨用組成物
US20060000808A1 (en) * 2004-07-01 2006-01-05 Fuji Photo Film Co., Ltd. Polishing solution of metal and chemical mechanical polishing method

Also Published As

Publication number Publication date
JP2007092064A (ja) 2007-04-12
JP5775470B2 (ja) 2015-09-09
JP5816663B2 (ja) 2015-11-18
JP2014029759A (ja) 2014-02-13
JP5025204B2 (ja) 2012-09-12
GB0619096D0 (en) 2006-11-08
US20080003928A1 (en) 2008-01-03
GB2430680A (en) 2007-04-04
US20070068902A1 (en) 2007-03-29
JP2012131026A (ja) 2012-07-12
CN1939994A (zh) 2007-04-04

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