JP5025204B2 - 研磨用組成物及び磁気ディスク用基板の製造方法 - Google Patents

研磨用組成物及び磁気ディスク用基板の製造方法 Download PDF

Info

Publication number
JP5025204B2
JP5025204B2 JP2006257391A JP2006257391A JP5025204B2 JP 5025204 B2 JP5025204 B2 JP 5025204B2 JP 2006257391 A JP2006257391 A JP 2006257391A JP 2006257391 A JP2006257391 A JP 2006257391A JP 5025204 B2 JP5025204 B2 JP 5025204B2
Authority
JP
Japan
Prior art keywords
polishing composition
polishing
acid
magnetic disk
disk substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006257391A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007092064A (ja
JP2007092064A5 (enExample
Inventor
靖 松波
淳一 平野
リン ジィ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of JP2007092064A publication Critical patent/JP2007092064A/ja
Publication of JP2007092064A5 publication Critical patent/JP2007092064A5/ja
Application granted granted Critical
Publication of JP5025204B2 publication Critical patent/JP5025204B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
JP2006257391A 2005-09-29 2006-09-22 研磨用組成物及び磁気ディスク用基板の製造方法 Active JP5025204B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/238,256 2005-09-29
US11/238,256 US20070068902A1 (en) 2005-09-29 2005-09-29 Polishing composition and polishing method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012020207A Division JP5775470B2 (ja) 2005-09-29 2012-02-01 研磨用組成物

Publications (3)

Publication Number Publication Date
JP2007092064A JP2007092064A (ja) 2007-04-12
JP2007092064A5 JP2007092064A5 (enExample) 2012-03-15
JP5025204B2 true JP5025204B2 (ja) 2012-09-12

Family

ID=37434808

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2006257391A Active JP5025204B2 (ja) 2005-09-29 2006-09-22 研磨用組成物及び磁気ディスク用基板の製造方法
JP2012020207A Active JP5775470B2 (ja) 2005-09-29 2012-02-01 研磨用組成物
JP2013181661A Active JP5816663B2 (ja) 2005-09-29 2013-09-02 スクラッチ低減方法及びスクラッチ低減剤

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2012020207A Active JP5775470B2 (ja) 2005-09-29 2012-02-01 研磨用組成物
JP2013181661A Active JP5816663B2 (ja) 2005-09-29 2013-09-02 スクラッチ低減方法及びスクラッチ低減剤

Country Status (5)

Country Link
US (2) US20070068902A1 (enExample)
JP (3) JP5025204B2 (enExample)
CN (1) CN1939994A (enExample)
GB (1) GB2430680A (enExample)
MY (1) MY150651A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2322322B2 (en) * 2008-06-13 2022-10-05 Fujimi Incorporated Aluminum oxide particle and polishing composition containing the same
JP5473544B2 (ja) * 2008-11-06 2014-04-16 花王株式会社 磁気ディスク基板用研磨液組成物
US20110203186A1 (en) * 2008-11-06 2011-08-25 Yoshiaki Oshima Polishing liquid composition for magnetic disk substrate
CN101463292B (zh) * 2008-11-28 2011-11-02 江苏海迅实业集团股份有限公司 一种车船玻璃表面处理剂
TWI454561B (zh) * 2008-12-30 2014-10-01 Uwiz Technology Co Ltd A polishing composition for planarizing the metal layer
JP5473587B2 (ja) * 2009-12-24 2014-04-16 花王株式会社 磁気ディスク基板用研磨液組成物
JP5657247B2 (ja) * 2009-12-25 2015-01-21 花王株式会社 研磨液組成物
CN103160207A (zh) * 2011-12-16 2013-06-19 安集微电子（上海）有限公司 一种金属化学机械抛光浆料及其应用
JP6101444B2 (ja) * 2012-08-01 2017-03-22 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた磁気ディスク用基板の製造方法
JP6015259B2 (ja) * 2012-09-06 2016-10-26 旭硝子株式会社 情報記録媒体用ガラス基板の製造方法および磁気ディスクの製造方法
JP6110716B2 (ja) * 2013-04-11 2017-04-05 山口精研工業株式会社 Ｎｉ−Ｐメッキされたアルミ磁気ディスク基板仕上げ研磨用研磨剤組成物、Ｎｉ−Ｐメッキされたアルミ磁気ディスク基板の研磨方法、Ｎｉ−Ｐメッキされたアルミ磁気ディスク基板の製造方法、及びＮｉ−Ｐメッキされたアルミ磁気ディスク基板
JP2014101518A (ja) * 2014-01-06 2014-06-05 Fujimi Inc 研磨用組成物、研磨方法、及び研磨パッドの弾力性低下抑制方法
JP6415967B2 (ja) * 2014-12-22 2018-10-31 花王株式会社 研磨液組成物
US20190077991A1 (en) * 2015-10-09 2019-03-14 Fujimi Incorporated Polishing composition and polishing method using same, and method for producing polishing-completed object to be polished using same
CN106916536B (zh) * 2015-12-25 2021-04-20 安集微电子（上海）有限公司 一种碱性化学机械抛光液
JP6775453B2 (ja) * 2017-03-23 2020-10-28 山口精研工業株式会社 磁気ディスク基板用研磨剤組成物
JP7246231B2 (ja) * 2019-03-29 2023-03-27 株式会社フジミインコーポレーテッド 研磨用組成物および磁気ディスク基板製造方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2725192B2 (ja) * 1988-12-09 1998-03-09 株式会社フジミインコーポレーテッド 研磨剤組成物
US5428721A (en) * 1990-02-07 1995-06-27 Kabushiki Kaisha Toshiba Data processing apparatus for editing image by using image conversion
US5391258A (en) * 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
US5575885A (en) * 1993-12-14 1996-11-19 Kabushiki Kaisha Toshiba Copper-based metal polishing solution and method for manufacturing semiconductor device
JP3397501B2 (ja) * 1994-07-12 2003-04-14 株式会社東芝 研磨剤および研磨方法
US5858813A (en) * 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
US5954997A (en) * 1996-12-09 1999-09-21 Cabot Corporation Chemical mechanical polishing slurry useful for copper substrates
US6126853A (en) * 1996-12-09 2000-10-03 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
JP4053165B2 (ja) * 1998-12-01 2008-02-27 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
KR100447551B1 (ko) * 1999-01-18 2004-09-08 가부시끼가이샤 도시바 복합 입자 및 그의 제조 방법, 수계 분산체, 화학 기계연마용 수계 분산체 조성물 및 반도체 장치의 제조 방법
CN100335580C (zh) * 1999-08-13 2007-09-05 卡伯特微电子公司 含有阻化化合物的抛光系统及其使用方法
US7041599B1 (en) * 1999-12-21 2006-05-09 Applied Materials Inc. High through-put Cu CMP with significantly reduced erosion and dishing
US6569215B2 (en) * 2000-04-17 2003-05-27 Showa Denko Kabushiki Kaisha Composition for polishing magnetic disk substrate
JP2002075927A (ja) * 2000-08-24 2002-03-15 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP2002164307A (ja) * 2000-11-24 2002-06-07 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP2002198331A (ja) * 2000-12-26 2002-07-12 Jsr Corp 研磨方法
JP2002231666A (ja) * 2001-01-31 2002-08-16 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP2002270546A (ja) * 2001-03-07 2002-09-20 Hitachi Chem Co Ltd 導体用研磨液及びこれを用いた研磨方法
US7160432B2 (en) * 2001-03-14 2007-01-09 Applied Materials, Inc. Method and composition for polishing a substrate
JP4231632B2 (ja) * 2001-04-27 2009-03-04 花王株式会社 研磨液組成物
SG144688A1 (en) * 2001-07-23 2008-08-28 Fujimi Inc Polishing composition and polishing method employing it
US20040253809A1 (en) * 2001-08-18 2004-12-16 Yao Xiang Yu Forming a semiconductor structure using a combination of planarizing methods and electropolishing
WO2003036705A1 (en) * 2001-10-26 2003-05-01 Asahi Glass Company, Limited Polishing compound, method for production thereof and polishing method
JP2003297779A (ja) * 2002-03-29 2003-10-17 Sumitomo Bakelite Co Ltd 研磨用組成物並びに研磨方法
JP4083502B2 (ja) * 2002-08-19 2008-04-30 株式会社フジミインコーポレーテッド 研磨方法及びそれに用いられる研磨用組成物
JP2004153086A (ja) * 2002-10-31 2004-05-27 Showa Denko Kk 金属研磨組成物、金属膜の研磨方法および基板の製造方法
JP4202157B2 (ja) * 2003-02-28 2008-12-24 株式会社フジミインコーポレーテッド 研磨用組成物
US6918820B2 (en) * 2003-04-11 2005-07-19 Eastman Kodak Company Polishing compositions comprising polymeric cores having inorganic surface particles and method of use
JP4618987B2 (ja) * 2003-05-26 2011-01-26 日立化成工業株式会社 研磨液及び研磨方法
JP2005064285A (ja) * 2003-08-14 2005-03-10 Hitachi Chem Co Ltd Ｃｍｐ用研磨液及び研磨方法
JP2005136256A (ja) * 2003-10-31 2005-05-26 Sumitomo Bakelite Co Ltd 研磨用組成物
US20050097825A1 (en) * 2003-11-06 2005-05-12 Jinru Bian Compositions and methods for a barrier removal
TWI288046B (en) * 2003-11-14 2007-10-11 Showa Denko Kk Polishing composition and polishing method
JP2005268664A (ja) * 2004-03-19 2005-09-29 Fujimi Inc 研磨用組成物
US20060000808A1 (en) * 2004-07-01 2006-01-05 Fuji Photo Film Co., Ltd. Polishing solution of metal and chemical mechanical polishing method

Also Published As

Publication number Publication date
JP2007092064A (ja) 2007-04-12
JP5775470B2 (ja) 2015-09-09
JP5816663B2 (ja) 2015-11-18
JP2014029759A (ja) 2014-02-13
MY150651A (en) 2014-02-14
GB0619096D0 (en) 2006-11-08
US20080003928A1 (en) 2008-01-03
GB2430680A (en) 2007-04-04
US20070068902A1 (en) 2007-03-29
JP2012131026A (ja) 2012-07-12
CN1939994A (zh) 2007-04-04

Similar Documents

Publication Publication Date Title
JP5775470B2 (ja) 研磨用組成物
US8241516B2 (en) Substrate for magnetic disk
JP2007092064A5 (enExample)
JP6412714B2 (ja) 研磨用組成物
US7780751B2 (en) Polishing composition for hard disk substrate
JP2004263074A (ja) 研磨用組成物
JP4202172B2 (ja) 研磨用組成物
US20060048455A1 (en) Polishing composition and polishing method using the same
JP6415569B2 (ja) チタン合金材料研磨用組成物
JP3857474B2 (ja) 化学機械研磨用水系分散体
JP4255976B2 (ja) 磁気ディスク基板用研磨液組成物
WO2001079377A1 (en) Composition for use in polishing magnetic disk substrate and method for preparing the same
CN113913115B (zh) 一种硅通孔阻挡层碱性抛光液
JP4074126B2 (ja) 研磨用組成物
JP6362395B2 (ja) 研磨用組成物および磁気ディスク基板製造方法
JP5259975B2 (ja) 研磨用組成物及び研磨方法
JP4095798B2 (ja) 研磨用組成物
JP2005008875A (ja) 研磨用組成物および研磨方法
JP6101444B2 (ja) 研磨用組成物及びそれを用いた磁気ディスク用基板の製造方法
JP2008101132A (ja) メモリーハードディスク基板用研磨液組成物
JP7732963B2 (ja) 研磨液組成物
JP2012176493A (ja) 研磨方法及び基板の製造方法
JP2014101518A (ja) 研磨用組成物、研磨方法、及び研磨パッドの弾力性低下抑制方法
GB2435263A (en) Substrate for a magnetic disk and polishing method therefor
JP2020164701A (ja) 研磨用組成物および磁気ディスク基板製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090916

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120201

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20120201

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20120222

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120306

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120427

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120522

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120619

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150629

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5025204

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250