JP5259975B2 - 研磨用組成物及び研磨方法 - Google Patents
研磨用組成物及び研磨方法 Download PDFInfo
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- JP5259975B2 JP5259975B2 JP2007105830A JP2007105830A JP5259975B2 JP 5259975 B2 JP5259975 B2 JP 5259975B2 JP 2007105830 A JP2007105830 A JP 2007105830A JP 2007105830 A JP2007105830 A JP 2007105830A JP 5259975 B2 JP5259975 B2 JP 5259975B2
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- 238000005498 polishing Methods 0.000 title claims description 217
- 239000000203 mixture Substances 0.000 title claims description 114
- 238000000034 method Methods 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 claims description 62
- 230000006866 deterioration Effects 0.000 claims description 33
- 239000002253 acid Substances 0.000 claims description 24
- 239000003112 inhibitor Substances 0.000 claims description 23
- -1 alkali metal salts Chemical class 0.000 claims description 22
- 239000006061 abrasive grain Substances 0.000 claims description 20
- 229910019142 PO4 Inorganic materials 0.000 claims description 16
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 16
- 239000010452 phosphate Substances 0.000 claims description 15
- 150000003863 ammonium salts Chemical class 0.000 claims description 11
- 229910052783 alkali metal Inorganic materials 0.000 claims description 10
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 claims description 7
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 claims description 7
- WDJHALXBUFZDSR-UHFFFAOYSA-N acetoacetic acid Chemical compound CC(=O)CC(O)=O WDJHALXBUFZDSR-UHFFFAOYSA-N 0.000 claims description 7
- 235000013922 glutamic acid Nutrition 0.000 claims description 7
- 239000004220 glutamic acid Substances 0.000 claims description 7
- 229960003330 pentetic acid Drugs 0.000 claims description 7
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 4
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 claims description 3
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 claims description 3
- 150000002978 peroxides Chemical class 0.000 claims description 3
- 229910018104 Ni-P Inorganic materials 0.000 description 50
- 229910018536 Ni—P Inorganic materials 0.000 description 50
- 239000007800 oxidant agent Substances 0.000 description 21
- 235000021317 phosphate Nutrition 0.000 description 15
- 230000003746 surface roughness Effects 0.000 description 14
- 230000002829 reductive effect Effects 0.000 description 12
- 230000007423 decrease Effects 0.000 description 9
- 239000011164 primary particle Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 229910001868 water Inorganic materials 0.000 description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000008119 colloidal silica Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229920005862 polyol Polymers 0.000 description 5
- 150000003077 polyols Chemical class 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000002989 phenols Chemical group 0.000 description 3
- 235000011007 phosphoric acid Nutrition 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- JVXHQHGWBAHSSF-UHFFFAOYSA-L 2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate;hydron;iron(2+) Chemical compound [H+].[H+].[Fe+2].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O JVXHQHGWBAHSSF-UHFFFAOYSA-L 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-N Metaphosphoric acid Chemical compound OP(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FENRSEGZMITUEF-ATTCVCFYSA-E [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].OP(=O)([O-])O[C@@H]1[C@@H](OP(=O)([O-])[O-])[C@H](OP(=O)(O)[O-])[C@H](OP(=O)([O-])[O-])[C@H](OP(=O)(O)[O-])[C@H]1OP(=O)([O-])[O-] Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].OP(=O)([O-])O[C@@H]1[C@@H](OP(=O)([O-])[O-])[C@H](OP(=O)(O)[O-])[C@H](OP(=O)([O-])[O-])[C@H](OP(=O)(O)[O-])[C@H]1OP(=O)([O-])[O-] FENRSEGZMITUEF-ATTCVCFYSA-E 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- 229910000388 diammonium phosphate Inorganic materials 0.000 description 1
- 235000019838 diammonium phosphate Nutrition 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 230000000855 fungicidal effect Effects 0.000 description 1
- 239000000417 fungicide Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910003002 lithium salt Inorganic materials 0.000 description 1
- 159000000002 lithium salts Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
Description
本実施形態の研磨用組成物と併せて使用される研磨パッドは、不織布タイプのものよりはスエードタイプのものであることが好ましい。スエードタイプの研磨パッドは特に限定されるものでなく、例えば特開平11−335979号公報に記載のものや特開2001−62704号公報に記載のものを使用することもできる。スエードタイプの研磨パッドを使用した場合には、不織布タイプの研磨パッドを使用した場合に比べて、研磨後のNi−Pディスク基板の表面で測定される微小うねりのレベルがもともと小さく、かつ同じく研磨後のNi−Pディスク基板の表面で測定されるスクラッチの数も少なくできる。なお、スエードタイプの研磨パッドでは、ポリエステル系ポリウレタンなどの高分子材料の発泡成形によるナップ層がベース層の上に設けられており、ベース層側の表面で研磨機の定盤に固定され、ナップ層側の表面で研磨対象物を研磨する。ポリエステル系ポリウレタンとは、トリレンジイソシアネート、ジフェニルメタンジイソシアネート、ヘキサメチレンジイソシアネートなどのポリイソシアネート成分との反応に供されるポリオール成分の少なくとも一部がポリエステルポリオールであるポリウレタンである。ポリオール成分の一部がポリエステルポリオールである場合、それ以外のポリオール成分は、例えばポリエーテルポリオール、ポリカーボネートポリオールである。
前記パッド劣化抑制剤は、研磨パッド、特にスエードタイプの研磨パッドの劣化を抑制する働きをする。研磨パッドの劣化が起こる要因として、研磨用組成物中の酸化剤が研磨パッドの研磨面に対して何らかの化学的作用をすることにより研磨面の弾力性が低下することがある。研磨面の弾力性が低くなると、研磨中の機械的な力によって研磨面のナップ層が表層から容易に擦り切れることになる。パッド劣化抑制剤は、この酸化剤の化学的作用を阻害することにより研磨パッドの劣化を抑制するものと考えられる。
表1,2の“パッド表面粗度の変化率”欄には、各例の研磨用組成物を用いてNi−Pディスク基板を連続研磨したときの研磨パッドの劣化、すなわち研磨パッドの表面粗度の変化率に関する評価の結果を示す。具体的には、50時間研磨使用した研磨パッドのナップ層表面で測定される表面粗さRaの値を、10時間研磨使用した研磨パッドのナップ層表面で測定される表面粗さRaの値で除することにより表面粗度の変化率を求めた。そして、表面粗度の変化率が120%未満の場合には○(良)、120%以上130%未満の場合には△(やや不良)、130%以上の場合には×(不良)と評価した。なお、表面粗さRaの測定には東京精密株式会社製の“ハンディサーフE-35A”を使用し、測定条件は測定長:12.5mm、カットオフ:2.5mmとした。また、この評価時の研磨条件は、研磨時間を除いては表3に示すのと同じである。
Claims (6)
- ジエチレントリアミン五酢酸、ヒドロキシエチルエチレンジアミン三酢酸、トリエチレンテトラミン六酢酸及びグルタミン酸二酢酸並びにそれらのアルカリ金属塩及びアンモニウム塩から選ばれる研磨パッドの劣化を抑制するパッド劣化抑制剤と、
過酸化物と
を含有することを特徴とするニッケルリンメッキディスク基板研磨用組成物。 - 前記パッド劣化抑制剤は、ジエチレントリアミン五酢酸若しくはグルタミン酸二酢酸又はそれらのアルカリ金属塩若しくはアンモニウム塩であることを特徴とする請求項1に記載の研磨用組成物。
- フェノール化合物をさらに含有することを特徴とする請求項1又は2に記載の研磨用組成物。
- リン酸塩をさらに含有することを特徴とする請求項1〜3のいずれか一項に記載の研磨用組成物。
- 砥粒をさらに含有することを特徴とする請求項1〜4のいずれか一項に記載の研磨用組成物。
- 請求項1〜5のいずれか一項に記載の研磨用組成物をスエードタイプの研磨パッドと併せて使用して研磨対象物を研磨することを特徴とする研磨方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007105830A JP5259975B2 (ja) | 2007-04-13 | 2007-04-13 | 研磨用組成物及び研磨方法 |
MYPI20094266 MY152929A (en) | 2007-04-13 | 2008-04-10 | Polishing composition and polishing method |
PCT/JP2008/057099 WO2008133023A1 (ja) | 2007-04-13 | 2008-04-10 | 研磨用組成物及び研磨方法 |
MYPI2013000694A MY160635A (en) | 2007-04-13 | 2013-02-28 | Polishing composition and polishing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2007105830A JP5259975B2 (ja) | 2007-04-13 | 2007-04-13 | 研磨用組成物及び研磨方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012141031A Division JP2012176493A (ja) | 2012-06-22 | 2012-06-22 | 研磨方法及び基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008260105A JP2008260105A (ja) | 2008-10-30 |
JP5259975B2 true JP5259975B2 (ja) | 2013-08-07 |
Family
ID=39925482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007105830A Active JP5259975B2 (ja) | 2007-04-13 | 2007-04-13 | 研磨用組成物及び研磨方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5259975B2 (ja) |
MY (2) | MY152929A (ja) |
WO (1) | WO2008133023A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5484782B2 (ja) * | 2009-04-30 | 2014-05-07 | 花王株式会社 | 研磨材スラリーの製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0781132B2 (ja) * | 1990-08-29 | 1995-08-30 | 株式会社フジミインコーポレーテッド | 研磨剤組成物 |
JPH1121545A (ja) * | 1997-06-30 | 1999-01-26 | Fujimi Inkooporeetetsudo:Kk | 研磨用組成物 |
JP2005243673A (ja) * | 2004-02-24 | 2005-09-08 | Toshiro Doi | 化学機械研磨方法及び研磨体 |
JP2006049912A (ja) * | 2004-08-03 | 2006-02-16 | Samsung Electronics Co Ltd | Cmpスラリー、前記cmpスラリーを使用する化学機械的研磨方法、及び前記cmpスラリーを使用する金属配線の形成方法 |
JP2007067089A (ja) * | 2005-08-30 | 2007-03-15 | Fujifilm Holdings Corp | 研磨液及びそれを用いる半導体デバイスの製造方法 |
-
2007
- 2007-04-13 JP JP2007105830A patent/JP5259975B2/ja active Active
-
2008
- 2008-04-10 WO PCT/JP2008/057099 patent/WO2008133023A1/ja active Application Filing
- 2008-04-10 MY MYPI20094266 patent/MY152929A/en unknown
-
2013
- 2013-02-28 MY MYPI2013000694A patent/MY160635A/en unknown
Also Published As
Publication number | Publication date |
---|---|
MY160635A (en) | 2017-03-15 |
MY152929A (en) | 2014-12-15 |
WO2008133023A1 (ja) | 2008-11-06 |
JP2008260105A (ja) | 2008-10-30 |
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