MY152929A - Polishing composition and polishing method - Google Patents

Polishing composition and polishing method

Info

Publication number
MY152929A
MY152929A MYPI20094266A MY152929A MY 152929 A MY152929 A MY 152929A MY PI20094266 A MYPI20094266 A MY PI20094266A MY 152929 A MY152929 A MY 152929A
Authority
MY
Malaysia
Prior art keywords
polishing
composition
polishing composition
polishing method
Prior art date
Application number
Inventor
Hirano Junichi
Isomura Kouji
Yokomichi Noritaka
Arai Masahiro
Sato Sayaka
Fujita Yuta
Original Assignee
Fujimi Inc
Lion Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc, Lion Corp filed Critical Fujimi Inc
Publication of MY152929A publication Critical patent/MY152929A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
MYPI20094266 2007-04-13 2008-04-10 Polishing composition and polishing method MY152929A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007105830A JP5259975B2 (en) 2007-04-13 2007-04-13 Polishing composition and polishing method

Publications (1)

Publication Number Publication Date
MY152929A true MY152929A (en) 2014-12-15

Family

ID=39925482

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI20094266 MY152929A (en) 2007-04-13 2008-04-10 Polishing composition and polishing method
MYPI2013000694A MY160635A (en) 2007-04-13 2013-02-28 Polishing composition and polishing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI2013000694A MY160635A (en) 2007-04-13 2013-02-28 Polishing composition and polishing method

Country Status (3)

Country Link
JP (1) JP5259975B2 (en)
MY (2) MY152929A (en)
WO (1) WO2008133023A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5484782B2 (en) * 2009-04-30 2014-05-07 花王株式会社 Manufacturing method of abrasive slurry

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781132B2 (en) * 1990-08-29 1995-08-30 株式会社フジミインコーポレーテッド Abrasive composition
JPH1121545A (en) * 1997-06-30 1999-01-26 Fujimi Inkooporeetetsudo:Kk Polishing composition
JP2005243673A (en) * 2004-02-24 2005-09-08 Toshiro Doi Chemical mechanical polishing method and polishing body
JP2006049912A (en) * 2004-08-03 2006-02-16 Samsung Electronics Co Ltd Cmp slurry, chemical mechanical polishing method using the cmp slurry, and method of forming metal wiring using the cmp slurry
JP2007067089A (en) * 2005-08-30 2007-03-15 Fujifilm Holdings Corp Polishing solution and semiconductor device manufacturing method using the solution

Also Published As

Publication number Publication date
WO2008133023A1 (en) 2008-11-06
JP2008260105A (en) 2008-10-30
JP5259975B2 (en) 2013-08-07
MY160635A (en) 2017-03-15

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