JP2007083311A - レーザエネルギ微小印刻装置および方法 - Google Patents
レーザエネルギ微小印刻装置および方法 Download PDFInfo
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- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
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- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
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- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
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- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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- B44B3/00—Artist's machines or apparatus equipped with tools or work holders moving or able to be controlled substantially two- dimensionally for carving, engraving, or guilloching shallow ornamenting or markings
- B44B3/009—Artist's machines or apparatus equipped with tools or work holders moving or able to be controlled substantially two- dimensionally for carving, engraving, or guilloching shallow ornamenting or markings using a computer control means
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- B44B7/00—Machines, apparatus or hand tools for branding, e.g. using radiant energy such as laser beams
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Abstract
【解決手段】被加工物のためのレーザエネルギ微小印刻システムは、レーザエネルギ源と、取付けられた被加工物に対して光学的アクセスを可能にする被加工物取付け装置と、レーザエネルギ源からのレーザエネルギを被加工物上に集束する光学装置と、集束されたレーザエネルギを被加工物の所望の部分上に指向させる相対的位置決め装置であって制御入力端子を有する相対的位置決め装置、および光学装置の焦点面と被加工物の表面との間の関係を自動的に決定するための電子的撮像装置であって、複数の角度から被加工物を観測可能である電子的撮像装置を備え、被加工物取付け装置と光学装置は操作中の外部振動による整列のずれに抵抗するために剛性フレームによって固定された関係を維持する。
【選択図】図1
Description
従って、本発明の1つの目的は、パルスレーザエネルギ源;光学アパーチャを有する、工作物取付けシステム;前記光学アパーチャを通して工作物上にレーザエネルギ源からのレーザエネルギを集束するための光学システム;制御入力端をもち、工作物の望ましい部分上に前記集束されたレーザエネルギを誘導するための手段;複数の優位点から工作物を見るための撮像システム;マーク形成命令を受理するための入力端;前記命令に従って1つのマークを生成するべく前記撮像システムから受理された前記マーク形成命令及び情報に基づいて前記誘導用手段を制御するためのプロセッサ;及び複数の工作物上のマークの画像に関して電子的に情報を記憶するための記憶システムを含む、レーザエネルギマイクロ印刻システムを提供することにある。
支持点に緩衝器141を有する振動絶縁のフレーム140またはシャーシにおいて(図21参照):
(1)レーザダイオードポンピング式レーザ1及びプログラミング可能な電源14、及びそれに伴うビーム拡大器5。
(2)案内8及び集束用光学部品10、小型CCDカメラ28,32及び照明システム。
(3)XYZ動作ステージ50(Zエレベータステージを伴う)であって、エンコーダ145(図14)、限界及び直流ブラシレス電動機を含むもの。
(4)ダイヤモンドホルダー144(図14)及び付属物。
(5)安全性鎖錠装置143(図21)を伴う外被体142(図21)であって、キャビネットを開いた状態での作動を防止し、及び迷走又は散光レーザエネルギが安全性についての危険性を生じさせることを防止するもの。
(6)制御用の計算機のシステム52であって下記を有するもの:
(a)PC(ペンティアム(登録商標)100Mhz )、PCI母線、1024×768VGAモニタ。
(b)フレームグラバー56(Matroz、ビデオグラフィックカード)。
(c)3軸動作制御用のカード60。
(d)ケーブル及び電源。
(e)システム作動用のソフトウェア(ウインドウズ(登録商標))。
(f)アプリケーションソフトウェア。
図1に示されるように、約525nmの波長をもつビーム2を発光するNd:YLF第2高調波レーザ1(QD321)が具備されている。濾波されたレーザビーム4を生成するべくあらゆる残留基礎レーザ出力エネルギを減衰させるために1047nmのフィルタ3が具備されている。このとき、濾波されたビームは、エネルギ密度を低減させるべく、10倍ビーム拡大器5の中で拡大される。拡大されたビーム6の径路内には、ダイオードポンプからのエネルギを除去するため780nmのフィルタ7が具備されている。ダイクロイックミラー8は、10倍の顕微鏡対物レンズ10に向かって、拡大され濾波されたビーム9を反射する。顕微鏡対物レンズ10はビームを、例えばカットダイヤモンド13のガードル12である工作物の上へ集束させる。
システムは、静止のレーザビーム、例えば移動しないレーザビーム発生装置を包含する。XYZ位置決めシステム50は、工作物11を移動させ、約1.0μmの解像度及び再現性で印刻を生成する。焦点でのビーム寸法は約1μmより大きく、従って位置決めシステム50の精度はマーク形成の位置ぎめにおける制限の要因にはならない。
印刻の長さは、文字及び間隔の寸法によって異なる。以下に示すのは、適切な寸法を表わす表である。
高さ(μm) 幅(μm) 間隔(μm)
大文字 80 60 30
中文字 60 45 25
小文字 40 30 20
極小文字 20 15 10
印刻の合計長=文字数×(幅+間隔)+ロゴの長さ
一そろいの文字が各システムに設けられることが可能であり、これは例えば、26文字と10数字、(TM)(トレードマーク),(SM)(シンボルマーク),登録商標及びロゴといったビジネス文字を含むASCII字体セットである。これらの字体の組は、例えばBorlandから入手可能である。日本語及び/又はヘブライ語及びロゴのような付加的な字体も当然利用でき、例えば取外し可能な磁気媒体、スマートカードを用い又はデジタル遠隔通信により、システムに追加することができる。字体には、特性又は編集可能な文字が包含されていてもよく、かくして、文字識別コードによって表わされるラスタービットマップを完全に自由に規定することが可能になる。従って、マーク形成として、ライン又はビットマップにすることのできるあらゆる記号数字を包含させることが可能である。
● 手動のもの。キーボード148から入力される英数字記号、及びロゴのライブラリから選択されるロゴ。
● 半自動のもの。バーコード149又はキーボード148からの英数字記号の一部分及び一連番号計数器により自動的に選択された記号の一部。
● 全自動のもの。バーコード又は類似のシステムからの1つの識別情報を入力した後、完全な印刻が生成される。
システム制御装置は同様に過剰/過小出力保護も提供する。レーザ出力が設定限界を上回ると、システムは作動を停止し、警告を発し、それによりダイヤモンド又は工作物に損傷を生じさせないことを保証する。
システムには、以下の通り、ビデオスクリーン上で全印刻プロセスを効果的に見るため、照明及び濾波システムを伴う2つの高解像度小型CCDカメラが含まれている。
種々のシステム構成要素を支援するウインドウズ95(登録商標)又はウインドウズNT(登録商標)、マッキントッシュ(登録商標)、UNIX(登録商標)の派生物、X−ターミナル又はその他のオペレーティングシステムを使用することができるが、計算機の制御装置は、好適にはウインドウズの環境内において動作する。光学的フィードバックシステム及び印刻機能のプレビューは、グラフィック・ユーザー・インターフェースを使用する事が好ましい。
装着は、図7〜図11に示されているように取外し可能なホルダー118によって、フレーム140との関係において固定した位置に保持される固定ベースを包含している。ホルダー118は、ダイヤモンドの方向性を変えることなく固定ベースから容易に取外し又は取出しすることができる。異なる寸法の石に対して種々のホルダーが利用可能である状態で、機械上で処理すべきダイヤモンドの寸法に基づいて1つのホルダー118が選択される。ダイヤモンドはホルダー内に容易に位置決めでき又そこからとり出すことができ、さらにカメラに面するようガードルの正しい部分をもってくるように外部的に調整することができる。
工作物がマークを有する場合には、例えば図16に示される流れ図に従って、マークが真正なものであるか否かを決定することが希望される可能性がある。工作物は、その上に存在するマークを読みとるよう拡大して観察される181。認証プロセスは少なくとも2つの選択肢を提供する。第1に、マークを暗号化し、それにしたがい、キー183、例えば公開キーを用いて処理が行なわれる。石の実際の特徴が暗号化されメッセージを形成する場合は、復号化されたメッセージが工作物184の実際の特徴と比較される。したがって、真正性を決定することが可能である。代替として、マークが工作物を識別するコードを含み、データベースから工作物に関する情報の検索が許容されるようにすることが可能である。このようにしてデータベースは特徴の情報を記憶している。
図16に示され、さらに詳細が図20で拡大されている、ダイヤモンド200は、幾つかの識別及び安全保障用の特徴を有する。例えば、ダイヤモンド200は、重さ0.78カラット、等級VS2で2つの識別されたきず207を有する、色Fの石である。ダイヤモンド200は、ガードル201上に印刻された1組のマークを有する。このマークは、文字として形成された「LKI」ロゴ、商標登録の記号203、アラビア数字での通し番号204,1次元バーコード205,2次元コード206、可視の寸法の基準209の一組及び規定される場所をもつ単一の切削のスポット208,210を包含する。たいていの目的のためには、ロゴは一連のマークを識別し、一方、通し番号はダイヤモンド200を識別するために用いられる。追加の情報をコード化するために、可視的バーコード205は、例えば、2進情報がコード化されダイヤモンド200から検索されることが可能である。2次元コードは一般に読取り用の機械を必要とし、高密度データコード化を可能にする。可視的寸法基準209は距離を測定するために焦点板を使用できるようにし、ダイヤモンド200を独特に規定するのに用いることのできるダイヤモンド200の付加的な特徴を提供する。単一のアブ切削のスポット208,210はさほど可視的でなく、従って探索のためのキーを必要とする可能性がある。換言すれば、これらのスポットの認証には、ダイヤモンド200の検査による確認を伴う。それらの場所の伝送が必要となる可能性がある。例えば、マーク210は、片方又は両方のきず207に対して規定された物理的関係を有し、そのため複製はきわめて困難になっている。
2 ビーム
3 フィルタ
4 濾波されたレーザビーム
5 ビーム拡大器
6 拡大されたビーム
7 フィルタ
8 ダイクロイックミラー
9 濾波されたビーム
10 顕微鏡対物レンズ
11 工作物
12 ガードル
13 ダイヤモンド
20 発光ダイオード
21 コリメート用レンズ
22 コリメートされた照明ビーム
23 ビーム分割器
24 反射鏡
25 反射されコリメートされた照明ビーム
27 反射された照明ビーム
28 頂部CCDカメラ
29 映像
30 発光ダイオード
31 照明
32 側部CCDカメラ
33 ダブレットレンズ
34 窓
35 映像
Claims (5)
- レーザエネルギ源;
取付けられた被加工物に対して光学的アクセスを可能にする、被加工物取付け装置;
前記レーザエネルギ源からのレーザエネルギを前記被加工物上に集束する光学装置;
前記集束されたレーザエネルギを前記被加工物の所望の部分上に指向させるための相対的位置決め装置であって、制御入力端子を有する相対的位置決め装置;および
前記光学装置の焦点面と前記被加工物の表面との間の関係を自動的に決定するための電子的撮像装置であって、複数の角度から前記被加工物を観測可能である、電子的撮像装置;
を備え、
前記被加工物取付け装置と前記光学装置は操作中の外部振動による整列のずれに抵抗するために剛性フレームによって固定された関係を維持するものである、被加工物のためのレーザエネルギ微小印刻システム。 - レーザエネルギ源;
取付けられた被加工物に対して光学的アクセスを可能にする、被加工物取付け装置;
前記レーザエネルギ源からのレーザエネルギを前記被加工物上に集束する光学装置;
前記光学装置の焦点面と前記被加工物の表面との間の関係を自動的に決定するための電子的撮像装置であって、複数の角度から前記被加工物を観測可能である、電子的撮像装置;および
制御入力端子を有し、前記レーザの焦点面を前記被加工物の前記表面に整列させかつ前記集束されたレーザエネルギを前記被加工物の表面の所望部分上に指向させるための相対的位置決め装置;および
前記レーザエネルギ源、前記光学装置および前記取付け装置を固定された関係において支持する剛性フレーム;
を備える、被加工物のためのレーザエネルギ微小印刻システム。 - レーザエネルギ源;
取付けられた宝石に対して光学的アクセスを可能にする、宝石取付け装置;
前記レーザエネルギ源からのレーザエネルギを前記宝石上に集束しその上に切削パターンを形成する光学装置;
制御入力端子を有し、前記集束されたレーザエネルギを前記宝石の所望の部分上に指向させるためのレーザエネルギ指向手段;
前記光学装置の焦点面と前記宝石の表面との間の関係を自動的に決定するための電子的撮像装置であって、複数の角度から前記宝石を観測可能である、電子的撮像装置;
マーク形成指令を受信するための入力端子;
前記マーク形成指令および前記撮像装置に基づいて前記指向手段を制御し、前記指令および予め決められたプログラムに基づいて選択的にマークを生成するためのプロセッサ;および
前記レーザエネルギ源、前記光学装置および前記取付け装置の差動的な移動に抵抗し、振動による整合ずれに対する免除を増加させるために、前記レーザエネルギ源、前記光学装置および前記取付け装置を固定された関係において支持する剛性フレーム;
を備える、レーザエネルギ宝石微小印刻システム。 - 宝石への光学的アクセスを許してシステム上に宝石を取付け;
レーザエネルギ源からのレーザエネルギを光学装置によって取付けられた宝石上に集束させ;
少なくとも電子的撮像装置の出力に基づいて前記集束されたレーザエネルギが宝石上にマークを形成するために前記宝石上の所望の位置に来るように、前記光学装置の焦点を前記宝石取付けシステムに対して相対的に位置決めし直し;さらに
前記レーザエネルギ源、前記光学装置および前記取付けられた宝石の相違する動きに対して抵抗しかつ振動による整列のずれに対する免除を増加させるために、前記レーザエネルギ源、光学装置および取付けられた宝石を剛性フレーム内に一定の関係で固定的に支持する;各ステップを備え、
前記電子的撮像装置は、前記光学装置の焦点面と前記宝石の表面との間の関係を自動的に決定するために複数の角度から前記宝石を観測可能である、レーザエネルギを用いた宝石被加工物の微小印刻方法。 - (a)集束されたエネルギビーム源を提供し;
(b)対象物に対して取付け台を提供し;
(c)微小印刻の所望の精細さを超える振幅を有する環境的振動が微小印刻の精細さを実質的に劣化させないように、共通モードの振動を抑制しかつ差動モードの信号を抑制するための十分な剛性を有する共通のフレーム内に、集束されたエネルギビーム源と取付け台を結合し;さらに
(d)少なくとも電子的撮像装置の出力に基づいて微小印刻パターンを形成するために、集束エネルギビーム源の焦点に対して対象物を順次位置決めし直しかつエネルギビームを活性化する;各ステップを備え、
前記電子的撮像装置は、前記光学装置の焦点面と前記宝石の表面との間の関係を自動的に決定するために複数の角度から前記宝石を観測可能である、微小印刻の所望の精細さを超える振幅を有する振動を受ける環境内で実施される、対象物上にメッセージを精細に微小印刻するための方法。
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JP2001133341A Expired - Lifetime JP4160274B2 (ja) | 1996-01-05 | 2001-04-27 | レーザエネルギ微小印刻装置および方法 |
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