GB122470A - Improvements in Apparatus for Cutting or Dividing Diamonds. - Google Patents

Improvements in Apparatus for Cutting or Dividing Diamonds.

Info

Publication number
GB122470A
GB122470A GB132218A GB132218A GB122470A GB 122470 A GB122470 A GB 122470A GB 132218 A GB132218 A GB 132218A GB 132218 A GB132218 A GB 132218A GB 122470 A GB122470 A GB 122470A
Authority
GB
United Kingdom
Prior art keywords
adjustable
saw
diamond
angularly
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB132218A
Inventor
Jules Groesser
Edouard Joseph Ley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB132218A priority Critical patent/GB122470A/en
Publication of GB122470A publication Critical patent/GB122470A/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • B28D5/025Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage with the stock carried by a pivoted arm

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Sawing (AREA)

Abstract

122,470. Groesser, J., and Ley, E. J. Jan. 23, 1918. Sawing and like cutting; work-holders.-A machine for cutting or dividing diamonds by means of a revolving dish comprises a vertically movable carrying frame located above the saw and supporting a vertical carrier rod, the diamond being held between the arms of a forked member which is so mounted on the carrier rod that the diamond is adjustable either along, or transversely to, the plane of the saw or angularly. In the machine shown, the saw 4 is axially adjustable in bearings 2 which may be adjusted transversely by a screw 5. The diamond is held between clamps 24 carried by relatively-adjustable arms of a fork member 20 which is laterally and angularly adjustable in a hinged, angularly-adjustable clamp 19. This clamp is pivotally connected by a screw 18 to a carrier rod 14 which may rotate about its axis for adjustment, and is connected by a cross-bar 13 to slide-rods 11 coupled by a cross-head 12. A lever 25 connects the cross-head 12 to a pivotally-adjustable weight 26 which exerts a downward pressure to feed the diamond to the saw. Guides 10, 15 are provided for the rods 11, 14. The diamond is arranged with the grain parallel to the direction of its advance on to the saw.
GB132218A 1918-01-23 1918-01-23 Improvements in Apparatus for Cutting or Dividing Diamonds. Expired GB122470A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB132218A GB122470A (en) 1918-01-23 1918-01-23 Improvements in Apparatus for Cutting or Dividing Diamonds.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB132218A GB122470A (en) 1918-01-23 1918-01-23 Improvements in Apparatus for Cutting or Dividing Diamonds.

Publications (1)

Publication Number Publication Date
GB122470A true GB122470A (en) 1919-01-23

Family

ID=32669807

Family Applications (1)

Application Number Title Priority Date Filing Date
GB132218A Expired GB122470A (en) 1918-01-23 1918-01-23 Improvements in Apparatus for Cutting or Dividing Diamonds.

Country Status (1)

Country Link
GB (1) GB122470A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990005624A1 (en) * 1988-11-16 1990-05-31 Daya Ranjit Senanayake Diamond sawing process
US5932119A (en) * 1996-01-05 1999-08-03 Lazare Kaplan International, Inc. Laser marking system

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990005624A1 (en) * 1988-11-16 1990-05-31 Daya Ranjit Senanayake Diamond sawing process
AU630124B2 (en) * 1988-11-16 1992-10-22 Daya Ranjit Senanayake Diamond sawing process
US5190024A (en) * 1988-11-16 1993-03-02 Senanayake Daya R Diamond sawing process
US5932119A (en) * 1996-01-05 1999-08-03 Lazare Kaplan International, Inc. Laser marking system
US6211484B1 (en) 1996-01-05 2001-04-03 Lazare Kaplan International, Inc. Laser making system and certificate for a gemstone
US6476351B1 (en) 1996-01-05 2002-11-05 Lazare Kaplan International, Inc. Laser marking system
EP2216126A2 (en) 1996-01-05 2010-08-11 Lazare Kaplan International Inc. Laser marking system for gemstones and method of authenticating marking

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