JP2007019276A - 強誘電体素子の製造方法 - Google Patents
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Abstract
【解決手段】STOで形成されたハードマスク10をマスクとして、上部電極9c、強誘電体膜9b、下部電極9aを一括でドライエッチングし、該ドライチング後に残存するハードマスク10をウエットエッチングにより除去する際に、ドライエッチング時に強誘電体膜9bの側壁に付着した再堆積物12を除去し、且つ、強誘電体膜9bの側壁に形成されたダメージ層を除去する、半導体素子の製造方法。
【選択図】図3
Description
図1(a)に示すように、通常のSi半導体プロセスを用いて、半導体基板1にLOCOS等からなる素子分離領域2、活性領域3a及び3bを形成する。そして、半導体基板1上にゲート絶縁膜材料、及び、ゲート電極材料を積層し、これらをパターニングすることによって、ゲート絶縁膜4a、及び、ゲート電極4bを形成し、さらにサイドウォール4cを形成する。なお、ゲート電極4bは、例えば、Pドープされた多結晶シリコン(P−Si)、又はポリサイド構造(WSix/P−Si)で構成されている。その後、活性領域3a及び3bに不純物を拡散し、ソースドレイン領域3c及び3dをそれぞれ形成し、トランジスタ4を完成させる。そして、半導体基板1上にSiO2等の酸化膜で形成された層間絶縁膜5をCVD法によって形成してトランジスタ4を覆い、層間絶縁膜5をCMP法等で平坦化する。なお、層間絶縁膜5の膜厚は約500nmである。
図2(c)に示すように、酸化膜11をリソグラフィ及びドライエッチングによってパターニングする。なお、該エッチング条件は、CF4/CO/Ar=流量比0.07/0.25/1sccm、ガス圧力0.067Pa、RFパワー1500W、基板温度40℃である。
図3(c)に示すように、ハードマスク10をエッチングマスクとして、上部電極9c、強誘電体膜9b、下部電極9aを一括してドライエッチングする。該ドライエッチング条件は、Cl2/Ar=流量比10/10sccm、ガス圧力0.667Pa、RFパワー550W、基板温度80℃である。
図4(b)に示すように、積層構造9上に、第1水素バリア膜13をCVD法又はスパッタ法で形成する。第1水素バリア膜13は、TiAl合金、TiAlOx、Al2O3等で形成されている。そして、第1水素バリア膜13をフォトリソエッチングにより、所望の形状に加工し、SiO2で形成される膜厚850nmの第2層間絶縁膜14をCVD法で形成する。なお、第1水素バリア13は、後述するコンタクトプラグの形成に於いて還元剤を使用する際に、強誘電体キャパシタに水素が侵入することを防止するために形成される。
〔作用効果〕
本実施形態によれば、上部電極9c、強誘電体膜9b、下部電極9aで構成される強誘電体キャパシタの積層構造膜9のエッチング後に残存するハードマスク10を除去する際に、該積層構造膜9の側壁に付着した再堆積物12を同時に除去することが出来るので、該積層構造膜9のエッチング時にオーバーエッチングを実行して再堆積物12を除去する場合に比して、積層構造膜9の有効面積を減少させることなく、再堆積物12の除去を行うことが可能となる。
2 素子分離領域
3a 活性領域
3b 活性領域
3c ソースドレイン領域
3d ソースドレイン領域
4 トランジスタ
4a ゲート絶縁膜
4b ゲート電極
4c サイドウォール
5 第1層間絶縁膜
6a 開口部
6b 開口部
6c コンタクトプラグ
6d コンタクトプラグ
7 酸素拡散防止層
7a 酸化膜
7b 窒化膜
7c 酸化膜
8a 開口部
8b コンタクトプラグ
9 積層構造膜
9a 下部電極
9b 強誘電体膜
9c 上部電極
10 ハードマスク膜
11 酸化膜
12 再堆積物
13 第1水素バリア膜
14 第2層間絶縁膜
15 開口部
16 第1金属配線層
17 第2水素バリア層
18 第3層間絶縁膜
19a 開口部
19b 開口部
19c コンタクトプラグ
19d コンタクトプラグ
20 第2金属配線層
21 保護膜
Claims (12)
- 半導体基板上に回路素子を形成するステップと、
前記半導体基板上の回路素子を覆う絶縁膜を形成するステップと、
前記絶縁膜上に第1電極を形成するステップと、
前記第1電極上に強誘電体膜を形成するステップと、
前記強誘電体膜上に第2電極を形成するステップと、
前記第2電極上にハードマスクを形成するステップと、
前記ハードマスクをマスクとして、前記第1電極、前記強誘電体膜、前記第2電極をエッチングするステップと、
前記第1電極、前記強誘電体膜、前記第2電極のエッチング後に残存する前記ハードマスクを除去する第1除去ステップと、前記エッチング時に前記強誘電体膜の側壁に付着する再堆積物を除去する第2除去ステップと、を含む複数ステップを同時に実行する除去ステップと、
を含むことを特徴とする半導体装置の製造方法。 - 前記除去ステップに於いて、前記第1除去ステップ及び前記第2除去ステップに加えて、前記エッチング時に前記強誘電体膜の側壁に形成されたダメージ層を除去する第3除去ステップが同時に実行される、請求項1に記載の半導体装置の製造方法。
- 前記ハードマスクはSTOであることを特徴とする、請求項1乃至2の何れか一つに記載の半導体装置の製造方法。
- 前記第1除去ステップは、ウエットエッチングであることを特徴とする、請求項3に記載の半導体装置の製造方法。
- 前記ウエットエッチングに使用される溶液は、硝酸、フッ酸を含む混合液であることを特徴とする、請求項4に記載の半導体装置の製造方法。
- 前記第1電極、前記強誘電体膜、前記第2電極をエッチングする前に、
前記ハードマスク上に酸化膜を形成し、前記酸化膜をエッチングマスクとして、前記ハードマスクをエッチングするステップをさらに含む、請求項3に記載の半導体装置の製造方法。 - 前記ハードマスクをエッチングするステップは、ウエットエッチングを用いて実行されることを特徴とする、請求項6に記載の半導体装置の製造方法。
- 前記第1電極は、Pt、Ir、Ru、IrOx、RuOx、RuSrOxの何れかで構成される単層膜であることを特徴とする、請求項1乃至7の何れかに記載の半導体装置の製造方法。
- 前記第1電極は、Pt、Ir、Ru、IrOx、RuOx、RuSrOxの2種類以上を組み合わせた多層膜であることを特徴とする、請求項1乃至7の何れかに記載の半導体装置の製造方法。
- 前記第2電極は、Pt、Ir、Ru、IrOx、RuOx、RuSrOxの何れかで構成される単層膜であることを特徴とする、請求項1乃至9の何れかに記載の半導体装置の製造方法。
- 前記第2電極は、Pt、Ir、Ru、IrOx、RuOx、RuSrOxの2種類以上を組み合わせた多層膜であることを特徴とする、請求項1乃至9の何れかに記載の半導体装置の製造方法。
- 前記強誘電体膜は、SBT、PZT、PZLT、SBTN、BLTの何れかであることを特徴とする、請求項1乃至11の何れか一つに記載の半導体装置の製造方法。
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JP2005199335A JP4621081B2 (ja) | 2005-07-07 | 2005-07-07 | 半導体装置の製造方法 |
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US8741684B2 (en) * | 2011-05-09 | 2014-06-03 | Imec | Co-integration of photonic devices on a silicon photonics platform |
US9782077B2 (en) | 2011-08-17 | 2017-10-10 | Masimo Corporation | Modulated physiological sensor |
US20140357962A1 (en) | 2013-05-28 | 2014-12-04 | The Procter & Gamble Company | Objective non-invasive method for quantifying degree of itch using psychophysiological measures |
US10690853B2 (en) * | 2018-06-25 | 2020-06-23 | International Business Machines Corporation | Optoelectronics integration using semiconductor on insulator substrate |
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WO1997035341A1 (fr) * | 1996-03-15 | 1997-09-25 | Hitachi, Ltd. | Dispositif de stockage a semi-conducteur et sa production |
JPH11103029A (ja) * | 1997-09-29 | 1999-04-13 | Nec Corp | 容量素子、それを用いた半導体記憶装置およびその製造方法 |
JP2001223342A (ja) * | 1999-12-22 | 2001-08-17 | Texas Instr Inc <Ti> | 半導体デバイスの強誘電性コンデンサ下に位置する導電性プラグを平坦化する方法 |
WO2006066261A2 (en) * | 2004-12-17 | 2006-06-22 | Texas Instruments Incorporated | Ferroelectric capacitor stack etch cleaning |
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US6121123A (en) * | 1997-09-05 | 2000-09-19 | Advanced Micro Devices, Inc. | Gate pattern formation using a BARC as a hardmask |
US6635497B2 (en) * | 2001-12-21 | 2003-10-21 | Texas Instruments Incorporated | Methods of preventing reduction of IrOx during PZT formation by metalorganic chemical vapor deposition or other processing |
US7001821B2 (en) * | 2003-11-10 | 2006-02-21 | Texas Instruments Incorporated | Method of forming and using a hardmask for forming ferroelectric capacitors in a semiconductor device |
JP4318607B2 (ja) * | 2004-07-28 | 2009-08-26 | Okiセミコンダクタ株式会社 | 強誘電体キャパシタの製造方法 |
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WO1997035341A1 (fr) * | 1996-03-15 | 1997-09-25 | Hitachi, Ltd. | Dispositif de stockage a semi-conducteur et sa production |
JPH11103029A (ja) * | 1997-09-29 | 1999-04-13 | Nec Corp | 容量素子、それを用いた半導体記憶装置およびその製造方法 |
JP2001223342A (ja) * | 1999-12-22 | 2001-08-17 | Texas Instr Inc <Ti> | 半導体デバイスの強誘電性コンデンサ下に位置する導電性プラグを平坦化する方法 |
WO2006066261A2 (en) * | 2004-12-17 | 2006-06-22 | Texas Instruments Incorporated | Ferroelectric capacitor stack etch cleaning |
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US20070010066A1 (en) | 2007-01-11 |
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