JP2007013127A5 - - Google Patents
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- Publication number
- JP2007013127A5 JP2007013127A5 JP2006150476A JP2006150476A JP2007013127A5 JP 2007013127 A5 JP2007013127 A5 JP 2007013127A5 JP 2006150476 A JP2006150476 A JP 2006150476A JP 2006150476 A JP2006150476 A JP 2006150476A JP 2007013127 A5 JP2007013127 A5 JP 2007013127A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating film
- conductive film
- circuit
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010408 film Substances 0.000 claims 69
- 239000010409 thin film Substances 0.000 claims 19
- 239000004065 semiconductor Substances 0.000 claims 15
- 238000004519 manufacturing process Methods 0.000 claims 8
- 238000000034 method Methods 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 229910001930 tungsten oxide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006150476A JP5210501B2 (ja) | 2005-06-01 | 2006-05-30 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005161413 | 2005-06-01 | ||
| JP2005161413 | 2005-06-01 | ||
| JP2006150476A JP5210501B2 (ja) | 2005-06-01 | 2006-05-30 | 半導体装置の作製方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012254358A Division JP5634487B2 (ja) | 2005-06-01 | 2012-11-20 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007013127A JP2007013127A (ja) | 2007-01-18 |
| JP2007013127A5 true JP2007013127A5 (enExample) | 2009-07-16 |
| JP5210501B2 JP5210501B2 (ja) | 2013-06-12 |
Family
ID=37751155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006150476A Expired - Fee Related JP5210501B2 (ja) | 2005-06-01 | 2006-05-30 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5210501B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7968382B2 (en) | 2007-02-02 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| JP5964607B2 (ja) * | 2012-02-14 | 2016-08-03 | 株式会社カネカ | 剥離層付き支持体、基板構造、および電子デバイスの製造方法 |
| TWI685026B (zh) | 2013-08-06 | 2020-02-11 | 日商半導體能源研究所股份有限公司 | 剝離方法 |
| JP6513929B2 (ja) * | 2013-11-06 | 2019-05-15 | 株式会社半導体エネルギー研究所 | 剥離方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03232232A (ja) * | 1990-02-08 | 1991-10-16 | Fujitsu Ltd | 半導体装置の製造方法 |
| JP3770631B2 (ja) * | 1994-10-24 | 2006-04-26 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| JP2001318624A (ja) * | 2000-02-29 | 2001-11-16 | Semiconductor Energy Lab Co Ltd | 表示装置およびその作製方法 |
| JP2001345452A (ja) * | 2000-06-02 | 2001-12-14 | Nec Kagoshima Ltd | 薄膜トランジスタ及びその製造方法 |
| JP4393859B2 (ja) * | 2002-12-27 | 2010-01-06 | 株式会社半導体エネルギー研究所 | 記録媒体の作製方法 |
| JP2004349543A (ja) * | 2003-05-23 | 2004-12-09 | Seiko Epson Corp | 積層体の剥離方法、薄膜装置の製造法、薄膜装置、電子機器 |
| JP2005056985A (ja) * | 2003-08-01 | 2005-03-03 | Seiko Epson Corp | 半導体装置の製造方法、半導体装置および電子機器 |
| JP4574295B2 (ja) * | 2003-09-19 | 2010-11-04 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
-
2006
- 2006-05-30 JP JP2006150476A patent/JP5210501B2/ja not_active Expired - Fee Related
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