JP2006121060A5 - - Google Patents
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- Publication number
- JP2006121060A5 JP2006121060A5 JP2005275070A JP2005275070A JP2006121060A5 JP 2006121060 A5 JP2006121060 A5 JP 2006121060A5 JP 2005275070 A JP2005275070 A JP 2005275070A JP 2005275070 A JP2005275070 A JP 2005275070A JP 2006121060 A5 JP2006121060 A5 JP 2006121060A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- thin film
- conductive layer
- film transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 19
- 239000010409 thin film Substances 0.000 claims 17
- 239000004065 semiconductor Substances 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- -1 halogen fluoride Chemical class 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005275070A JP5072208B2 (ja) | 2004-09-24 | 2005-09-22 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004278548 | 2004-09-24 | ||
| JP2004278548 | 2004-09-24 | ||
| JP2005275070A JP5072208B2 (ja) | 2004-09-24 | 2005-09-22 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006121060A JP2006121060A (ja) | 2006-05-11 |
| JP2006121060A5 true JP2006121060A5 (enExample) | 2008-11-06 |
| JP5072208B2 JP5072208B2 (ja) | 2012-11-14 |
Family
ID=36538601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005275070A Expired - Fee Related JP5072208B2 (ja) | 2004-09-24 | 2005-09-22 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5072208B2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101385039B (zh) * | 2006-03-15 | 2012-03-21 | 株式会社半导体能源研究所 | 半导体器件 |
| JP5052079B2 (ja) * | 2006-09-08 | 2012-10-17 | 株式会社半導体エネルギー研究所 | センサ装置及びそれを有する容器類 |
| JP5210613B2 (ja) | 2006-12-27 | 2013-06-12 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP5179858B2 (ja) | 2007-01-06 | 2013-04-10 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2008217776A (ja) * | 2007-02-09 | 2008-09-18 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US8816484B2 (en) * | 2007-02-09 | 2014-08-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| EP1970951A3 (en) * | 2007-03-13 | 2009-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| TWI476927B (zh) * | 2007-05-18 | 2015-03-11 | Semiconductor Energy Lab | 半導體裝置的製造方法 |
| EP2001047A1 (en) * | 2007-06-07 | 2008-12-10 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device |
| JP5072709B2 (ja) * | 2008-05-20 | 2012-11-14 | 京セラドキュメントソリューションズ株式会社 | 画像形成装置及び消耗品ユニット |
| JP5586920B2 (ja) * | 2008-11-20 | 2014-09-10 | 株式会社半導体エネルギー研究所 | フレキシブル半導体装置の作製方法 |
| JP6580863B2 (ja) | 2014-05-22 | 2019-09-25 | 株式会社半導体エネルギー研究所 | 半導体装置、健康管理システム |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4748859B2 (ja) * | 2000-01-17 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
| JP2002353235A (ja) * | 2001-05-23 | 2002-12-06 | Matsushita Electric Ind Co Ltd | アクティブマトリクス基板とそれを用いた表示装置およびその製造方法 |
| JP4244120B2 (ja) * | 2001-06-20 | 2009-03-25 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
| JP3972825B2 (ja) * | 2003-01-28 | 2007-09-05 | セイコーエプソン株式会社 | アクティブマトリクス型表示装置の製造方法 |
-
2005
- 2005-09-22 JP JP2005275070A patent/JP5072208B2/ja not_active Expired - Fee Related
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