JP2006528430A - 有機半導体の積層 - Google Patents

有機半導体の積層 Download PDF

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Publication number
JP2006528430A
JP2006528430A JP2006521198A JP2006521198A JP2006528430A JP 2006528430 A JP2006528430 A JP 2006528430A JP 2006521198 A JP2006521198 A JP 2006521198A JP 2006521198 A JP2006521198 A JP 2006521198A JP 2006528430 A JP2006528430 A JP 2006528430A
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JP
Japan
Prior art keywords
semiconductor
substrate
donor
transistor
deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006521198A
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English (en)
Japanese (ja)
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JP2006528430A5 (enExample
Inventor
マラジヨビチ，イリナ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2006528430A publication Critical patent/JP2006528430A/ja
Publication of JP2006528430A5 publication Critical patent/JP2006528430A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/649—Aromatic compounds comprising a hetero atom
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Bipolar Transistors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP2006521198A 2003-07-22 2004-07-22 有機半導体の積層 Pending JP2006528430A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US48933003P 2003-07-22 2003-07-22
US50168703P 2003-09-10 2003-09-10
PCT/US2004/023375 WO2005011016A2 (en) 2003-07-22 2004-07-22 Lamination of organic semiconductors

Publications (2)

Publication Number Publication Date
JP2006528430A true JP2006528430A (ja) 2006-12-14
JP2006528430A5 JP2006528430A5 (enExample) 2007-08-02

Family

ID=34107798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006521198A Pending JP2006528430A (ja) 2003-07-22 2004-07-22 有機半導体の積層

Country Status (5)

Country Link
US (2) US7105462B2 (enExample)
EP (1) EP1647063A2 (enExample)
JP (1) JP2006528430A (enExample)
KR (1) KR20060063903A (enExample)
WO (1) WO2005011016A2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067390A (ja) * 2005-08-05 2007-03-15 Sony Corp 半導体装置の製造方法および半導体装置の製造装置
JP2007067320A (ja) * 2005-09-02 2007-03-15 Dainippon Printing Co Ltd 有機トランジスタ及びその作製方法並びに有機トランジスタシート
JP2008103680A (ja) * 2006-09-22 2008-05-01 Konica Minolta Holdings Inc ドナーシートの製造方法、ドナーシート、及び有機薄膜トランジスタの製造方法
JP2008263045A (ja) * 2007-04-12 2008-10-30 Sony Corp パターン形成方法および電子素子の製造方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0515175D0 (en) * 2005-07-25 2005-08-31 Plastic Logic Ltd Flexible resistive touch screen
JP4892894B2 (ja) * 2005-08-31 2012-03-07 株式会社島津製作所 光または放射線検出ユニットの製造方法、およびその製造方法で製造された光または放射線検出ユニット
JP4831406B2 (ja) * 2006-01-10 2011-12-07 ソニー株式会社 半導体装置の製造方法
US8138075B1 (en) 2006-02-06 2012-03-20 Eberlein Dietmar C Systems and methods for the manufacture of flat panel devices
GB0611032D0 (en) * 2006-06-05 2006-07-12 Plastic Logic Ltd Multi-touch active display keyboard
US7571920B2 (en) * 2006-09-21 2009-08-11 Felt Racing, Llc Bicycle front fork assembly
US7976045B2 (en) * 2006-09-21 2011-07-12 Felt Racing, Llc Bicycle front fork assembly
GB2453766A (en) 2007-10-18 2009-04-22 Novalia Ltd Method of fabricating an electronic device
AU2012216352B2 (en) 2012-08-22 2015-02-12 Woodside Energy Technologies Pty Ltd Modular LNG production facility
US9583426B2 (en) 2014-11-05 2017-02-28 Invensas Corporation Multi-layer substrates suitable for interconnection between circuit modules
US10283492B2 (en) 2015-06-23 2019-05-07 Invensas Corporation Laminated interposers and packages with embedded trace interconnects
US9852994B2 (en) 2015-12-14 2017-12-26 Invensas Corporation Embedded vialess bridges

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002070271A2 (en) * 2001-03-01 2002-09-12 E. I. Du Pont De Nemours And Company Thermal imaging processes and products of electroactive organic material
JP2002260854A (ja) * 2001-03-02 2002-09-13 Fuji Photo Film Co Ltd 転写材料及び有機薄膜素子の製造方法
JP2003187972A (ja) * 2001-12-20 2003-07-04 Dainippon Printing Co Ltd 有機ｅｌ素子の製造方法および有機ｅｌ転写体と被転写体
JP2003298067A (ja) * 2001-12-25 2003-10-17 Sharp Corp トランジスタおよびそれを用いた表示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6197663B1 (en) 1999-12-07 2001-03-06 Lucent Technologies Inc. Process for fabricating integrated circuit devices having thin film transistors
US6335263B1 (en) * 2000-03-22 2002-01-01 The Regents Of The University Of California Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials
ATE540437T1 (de) 2001-03-02 2012-01-15 Fujifilm Corp Herstellungsverfahren einer organischen dünnschicht-vorrichtung
US6485884B2 (en) 2001-04-27 2002-11-26 3M Innovative Properties Company Method for patterning oriented materials for organic electronic displays and devices
JP3812935B2 (ja) 2001-10-22 2006-08-23 シャープ株式会社 液晶表示装置
US6852996B2 (en) * 2002-09-25 2005-02-08 Stmicroelectronics, Inc. Organic semiconductor sensor device
US6918982B2 (en) * 2002-12-09 2005-07-19 International Business Machines Corporation System and method of transfer printing an organic semiconductor
US7141893B2 (en) * 2005-03-30 2006-11-28 Motorola, Inc. Highly available power distribution system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002070271A2 (en) * 2001-03-01 2002-09-12 E. I. Du Pont De Nemours And Company Thermal imaging processes and products of electroactive organic material
JP2002260854A (ja) * 2001-03-02 2002-09-13 Fuji Photo Film Co Ltd 転写材料及び有機薄膜素子の製造方法
JP2003187972A (ja) * 2001-12-20 2003-07-04 Dainippon Printing Co Ltd 有機ｅｌ素子の製造方法および有機ｅｌ転写体と被転写体
JP2003298067A (ja) * 2001-12-25 2003-10-17 Sharp Corp トランジスタおよびそれを用いた表示装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067390A (ja) * 2005-08-05 2007-03-15 Sony Corp 半導体装置の製造方法および半導体装置の製造装置
JP2007067320A (ja) * 2005-09-02 2007-03-15 Dainippon Printing Co Ltd 有機トランジスタ及びその作製方法並びに有機トランジスタシート
JP2008103680A (ja) * 2006-09-22 2008-05-01 Konica Minolta Holdings Inc ドナーシートの製造方法、ドナーシート、及び有機薄膜トランジスタの製造方法
JP2008263045A (ja) * 2007-04-12 2008-10-30 Sony Corp パターン形成方法および電子素子の製造方法

Also Published As

Publication number Publication date
WO2005011016A3 (en) 2005-03-03
US20070004229A1 (en) 2007-01-04
US20050035374A1 (en) 2005-02-17
WO2005011016A2 (en) 2005-02-03
KR20060063903A (ko) 2006-06-12
US7105462B2 (en) 2006-09-12
EP1647063A2 (en) 2006-04-19

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