JP2006528430A5 - - Google Patents

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Publication number
JP2006528430A5
JP2006528430A5 JP2006521198A JP2006521198A JP2006528430A5 JP 2006528430 A5 JP2006528430 A5 JP 2006528430A5 JP 2006521198 A JP2006521198 A JP 2006521198A JP 2006521198 A JP2006521198 A JP 2006521198A JP 2006528430 A5 JP2006528430 A5 JP 2006528430A5
Authority
JP
Japan
Prior art keywords
organic semiconductor
substrate
donor substrate
receiver
donor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006521198A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006528430A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2004/023375 external-priority patent/WO2005011016A2/en
Publication of JP2006528430A publication Critical patent/JP2006528430A/ja
Publication of JP2006528430A5 publication Critical patent/JP2006528430A5/ja
Pending legal-status Critical Current

Links

JP2006521198A 2003-07-22 2004-07-22 有機半導体の積層 Pending JP2006528430A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US48933003P 2003-07-22 2003-07-22
US50168703P 2003-09-10 2003-09-10
PCT/US2004/023375 WO2005011016A2 (en) 2003-07-22 2004-07-22 Lamination of organic semiconductors

Publications (2)

Publication Number Publication Date
JP2006528430A JP2006528430A (ja) 2006-12-14
JP2006528430A5 true JP2006528430A5 (enExample) 2007-08-02

Family

ID=34107798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006521198A Pending JP2006528430A (ja) 2003-07-22 2004-07-22 有機半導体の積層

Country Status (5)

Country Link
US (2) US7105462B2 (enExample)
EP (1) EP1647063A2 (enExample)
JP (1) JP2006528430A (enExample)
KR (1) KR20060063903A (enExample)
WO (1) WO2005011016A2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0515175D0 (en) * 2005-07-25 2005-08-31 Plastic Logic Ltd Flexible resistive touch screen
JP2007067390A (ja) * 2005-08-05 2007-03-15 Sony Corp 半導体装置の製造方法および半導体装置の製造装置
JP4892894B2 (ja) * 2005-08-31 2012-03-07 株式会社島津製作所 光または放射線検出ユニットの製造方法、およびその製造方法で製造された光または放射線検出ユニット
JP4857669B2 (ja) * 2005-09-02 2012-01-18 大日本印刷株式会社 有機トランジスタ及びその作製方法並びに有機トランジスタシート
JP4831406B2 (ja) 2006-01-10 2011-12-07 ソニー株式会社 半導体装置の製造方法
US8138075B1 (en) 2006-02-06 2012-03-20 Eberlein Dietmar C Systems and methods for the manufacture of flat panel devices
GB0611032D0 (en) * 2006-06-05 2006-07-12 Plastic Logic Ltd Multi-touch active display keyboard
US7571920B2 (en) * 2006-09-21 2009-08-11 Felt Racing, Llc Bicycle front fork assembly
US7976045B2 (en) * 2006-09-21 2011-07-12 Felt Racing, Llc Bicycle front fork assembly
JP2008103680A (ja) * 2006-09-22 2008-05-01 Konica Minolta Holdings Inc ドナーシートの製造方法、ドナーシート、及び有機薄膜トランジスタの製造方法
JP5181515B2 (ja) * 2007-04-12 2013-04-10 ソニー株式会社 パターン形成方法および電子素子の製造方法
GB2453766A (en) 2007-10-18 2009-04-22 Novalia Ltd Method of fabricating an electronic device
AU2012216352B2 (en) 2012-08-22 2015-02-12 Woodside Energy Technologies Pty Ltd Modular LNG production facility
US9583426B2 (en) 2014-11-05 2017-02-28 Invensas Corporation Multi-layer substrates suitable for interconnection between circuit modules
US10283492B2 (en) 2015-06-23 2019-05-07 Invensas Corporation Laminated interposers and packages with embedded trace interconnects
US9852994B2 (en) 2015-12-14 2017-12-26 Invensas Corporation Embedded vialess bridges

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6197663B1 (en) 1999-12-07 2001-03-06 Lucent Technologies Inc. Process for fabricating integrated circuit devices having thin film transistors
US6335263B1 (en) * 2000-03-22 2002-01-01 The Regents Of The University Of California Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials
US6852355B2 (en) * 2001-03-01 2005-02-08 E. I. Du Pont De Nemours And Company Thermal imaging processes and products of electroactive organic material
JP2002260854A (ja) * 2001-03-02 2002-09-13 Fuji Photo Film Co Ltd 転写材料及び有機薄膜素子の製造方法
US6767807B2 (en) 2001-03-02 2004-07-27 Fuji Photo Film Co., Ltd. Method for producing organic thin film device and transfer material used therein
US6485884B2 (en) 2001-04-27 2002-11-26 3M Innovative Properties Company Method for patterning oriented materials for organic electronic displays and devices
JP3812935B2 (ja) 2001-10-22 2006-08-23 シャープ株式会社 液晶表示装置
JP2003187972A (ja) * 2001-12-20 2003-07-04 Dainippon Printing Co Ltd 有機ｅｌ素子の製造方法および有機ｅｌ転写体と被転写体
JP4360801B2 (ja) * 2001-12-25 2009-11-11 シャープ株式会社 トランジスタおよびそれを用いた表示装置
US6852996B2 (en) * 2002-09-25 2005-02-08 Stmicroelectronics, Inc. Organic semiconductor sensor device
US6918982B2 (en) * 2002-12-09 2005-07-19 International Business Machines Corporation System and method of transfer printing an organic semiconductor
US7141893B2 (en) * 2005-03-30 2006-11-28 Motorola, Inc. Highly available power distribution system

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