JP2006525878A5 - - Google Patents
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- Publication number
- JP2006525878A5 JP2006525878A5 JP2006519155A JP2006519155A JP2006525878A5 JP 2006525878 A5 JP2006525878 A5 JP 2006525878A5 JP 2006519155 A JP2006519155 A JP 2006519155A JP 2006519155 A JP2006519155 A JP 2006519155A JP 2006525878 A5 JP2006525878 A5 JP 2006525878A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- polishing
- measurement
- fluid
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003138479 | 2003-05-16 | ||
| JP2003138496 | 2003-05-16 | ||
| JP2003138782 | 2003-05-16 | ||
| PCT/JP2004/006768 WO2004101223A1 (en) | 2003-05-16 | 2004-05-13 | Substrate polishing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006525878A JP2006525878A (ja) | 2006-11-16 |
| JP2006525878A5 true JP2006525878A5 (enExample) | 2007-06-28 |
Family
ID=33458361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006519155A Pending JP2006525878A (ja) | 2003-05-16 | 2004-05-13 | 基板研磨装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US20040242121A1 (enExample) |
| EP (1) | EP1641597A4 (enExample) |
| JP (1) | JP2006525878A (enExample) |
| KR (1) | KR20060009327A (enExample) |
| CN (1) | CN1791490B (enExample) |
| TW (1) | TWI338605B (enExample) |
| WO (1) | WO2004101223A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102815099B1 (ko) | 2018-12-26 | 2025-06-04 | 가부시키가이샤 에바라 세이사꾸쇼 | 광학식 막 두께 측정 시스템의 세정 방법 |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7112960B2 (en) | 2003-07-31 | 2006-09-26 | Applied Materials, Inc. | Eddy current system for in-situ profile measurement |
| KR101197826B1 (ko) * | 2004-01-28 | 2012-11-05 | 가부시키가이샤 니콘 | 연마 패드 표면 형상 측정 장치, 연마 패드 표면 형상 측정장치의 사용 방법, 연마 패드의 원추 꼭지각의 측정 방법,연마 패드의 홈 깊이 측정 방법, cmp 연마 장치 및반도체 디바이스의 제조 방법 |
| KR101078007B1 (ko) * | 2004-06-21 | 2011-10-28 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치 및 폴리싱방법 |
| KR100568258B1 (ko) * | 2004-07-01 | 2006-04-07 | 삼성전자주식회사 | 화학적 기계적 연마용 연마 패드 및 이를 이용하는 화학적기계적 연마 장치 |
| US7153191B2 (en) * | 2004-08-20 | 2006-12-26 | Micron Technology, Inc. | Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods |
| JP2006159317A (ja) * | 2004-12-03 | 2006-06-22 | Asahi Sunac Corp | 研磨パッドのドレッシング方法 |
| US7764377B2 (en) | 2005-08-22 | 2010-07-27 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
| KR101398567B1 (ko) * | 2005-08-22 | 2014-05-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
| JP4675803B2 (ja) * | 2006-03-10 | 2011-04-27 | 東京エレクトロン株式会社 | 平坦化装置 |
| US7494929B2 (en) * | 2006-04-27 | 2009-02-24 | Applied Materials, Inc. | Automatic gain control |
| JP4745920B2 (ja) * | 2006-08-28 | 2011-08-10 | 三菱重工業株式会社 | 放電電極、薄膜製造装置、及び太陽電池の製造方法 |
| DE102006047207B3 (de) * | 2006-10-05 | 2008-07-03 | Fachhochschule Koblenz | Optischer Drehverteiler für Lichtwellenleiter |
| US7998358B2 (en) | 2006-10-31 | 2011-08-16 | Applied Materials, Inc. | Peak-based endpointing for chemical mechanical polishing |
| US8352061B2 (en) | 2008-11-14 | 2013-01-08 | Applied Materials, Inc. | Semi-quantitative thickness determination |
| JP5474093B2 (ja) * | 2009-01-16 | 2014-04-16 | アプライド マテリアルズ インコーポレイテッド | 窓支持部を具備する研磨パッドおよび研磨システム |
| US8157614B2 (en) | 2009-04-30 | 2012-04-17 | Applied Materials, Inc. | Method of making and apparatus having windowless polishing pad and protected fiber |
| US8882560B2 (en) | 2009-05-28 | 2014-11-11 | Anki, Inc. | Integration of a robotic system with one or more mobile computing devices |
| US9155961B2 (en) | 2009-05-28 | 2015-10-13 | Anki, Inc. | Mobile agents for manipulating, moving, and/or reorienting components |
| US10188958B2 (en) | 2009-05-28 | 2019-01-29 | Anki, Inc. | Automated detection of surface layout |
| EP2435149B1 (en) | 2009-05-28 | 2015-07-08 | Anki, Inc. | Distributed system of autonomously controlled toy vehicles |
| JP5968783B2 (ja) | 2009-11-03 | 2016-08-10 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | スペクトルの等高線図のピーク位置と時間の関係を使用する終点方法 |
| KR101165208B1 (ko) * | 2009-11-18 | 2012-07-16 | 주식회사 케이엔제이 | 평판디스플레이패널의 연마방법 |
| GB2482119B (en) | 2010-07-19 | 2013-01-23 | China Ind Ltd | Racing vehicle game |
| CN102221416B (zh) * | 2011-03-10 | 2012-10-10 | 清华大学 | 抛光液物理参数测量装置、测量方法和化学机械抛光设备 |
| CN102278967A (zh) * | 2011-03-10 | 2011-12-14 | 清华大学 | 抛光液厚度测量装置、测量方法和化学机械抛光设备 |
| US8380024B1 (en) * | 2011-08-17 | 2013-02-19 | Princetel Inc. | Integrated electro-optical fluid rotary joint |
| JP2013222856A (ja) * | 2012-04-17 | 2013-10-28 | Ebara Corp | 研磨装置および研磨方法 |
| US10279311B2 (en) * | 2012-08-21 | 2019-05-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for operating chemical mechanical polishing process |
| US9079287B2 (en) * | 2013-03-12 | 2015-07-14 | Macronix International Co., Ltd. | CMP polishing pad detector and system |
| JP6145342B2 (ja) * | 2013-07-12 | 2017-06-07 | 株式会社荏原製作所 | 膜厚測定装置、膜厚測定方法、および膜厚測定装置を備えた研磨装置 |
| US9966281B2 (en) * | 2013-11-15 | 2018-05-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and systems for chemical mechanical polish cleaning |
| TWI652735B (zh) | 2014-10-09 | 2019-03-01 | 美商應用材料股份有限公司 | 具有內部通道的化學機械研磨墊 |
| JP6313196B2 (ja) * | 2014-11-20 | 2018-04-18 | 株式会社荏原製作所 | 研磨面洗浄装置、研磨装置、および研磨面洗浄装置の製造方法 |
| US9996369B2 (en) | 2015-01-05 | 2018-06-12 | Anki, Inc. | Adaptive data analytics service |
| US9902415B2 (en) * | 2016-02-15 | 2018-02-27 | Lam Research Corporation | Universal service cart for semiconductor system maintenance |
| JP7312103B2 (ja) * | 2016-09-15 | 2023-07-20 | アプライド マテリアルズ インコーポレイテッド | 化学機械研磨スマートリング |
| KR102642988B1 (ko) * | 2016-11-09 | 2024-03-06 | 삼성디스플레이 주식회사 | 기판 연마 장치 및 방법 |
| CN116646279A (zh) | 2017-01-05 | 2023-08-25 | 株式会社斯库林集团 | 基板清洗装置及基板清洗方法 |
| JP6951229B2 (ja) | 2017-01-05 | 2021-10-20 | 株式会社Screenホールディングス | 基板洗浄装置および基板洗浄方法 |
| CN108630561B (zh) * | 2017-03-15 | 2021-10-15 | 北京北方华创微电子装备有限公司 | 基片表面的检测装置和检测方法、传片腔室 |
| RU173875U1 (ru) * | 2017-03-17 | 2017-09-15 | Акционерное общество "Московский вертолетный завод им. М.Л. Миля" | Эталонное устройство для оценки светотехнических характеристик |
| JP6948868B2 (ja) * | 2017-07-24 | 2021-10-13 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| JP6948878B2 (ja) * | 2017-08-22 | 2021-10-13 | ラピスセミコンダクタ株式会社 | 半導体製造装置及び半導体基板の研磨方法 |
| JP6974087B2 (ja) * | 2017-09-14 | 2021-12-01 | 株式会社ディスコ | 切削装置 |
| CN107745330B (zh) * | 2017-11-28 | 2024-07-05 | 合肥波林新材料股份有限公司 | 一种端面研磨装置 |
| CN111655428B (zh) * | 2017-12-28 | 2022-12-16 | 恩特格里斯公司 | Cmp抛光垫调节器 |
| CN110153872B (zh) * | 2018-02-14 | 2021-03-26 | 台湾积体电路制造股份有限公司 | 研磨系统、晶片夹持装置及晶片的研磨方法 |
| JP7022647B2 (ja) * | 2018-05-08 | 2022-02-18 | 株式会社荏原製作所 | 光透過性部材、研磨パッドおよび基板研磨装置 |
| US11878388B2 (en) * | 2018-06-15 | 2024-01-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same |
| JP2020001162A (ja) * | 2018-06-28 | 2020-01-09 | 株式会社荏原製作所 | 研磨パッド積層体、研磨パッド位置決め治具、および研磨パッドを研磨テーブルに貼り付ける方法 |
| US20200361052A1 (en) * | 2019-05-16 | 2020-11-19 | Micron Technology, Inc. | Planarization endpoint determination |
| JP7638617B2 (ja) * | 2019-06-26 | 2025-03-04 | 株式会社荏原製作所 | 光学式表面監視装置の洗浄方法 |
| JP7403998B2 (ja) * | 2019-08-29 | 2023-12-25 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| US11389923B2 (en) * | 2020-03-12 | 2022-07-19 | Bruker Nano, Inc. | Chemical-mechanical polishing system with a potentiostat and pulsed-force applied to a workpiece |
| JP2025021626A (ja) | 2023-08-01 | 2025-02-14 | 株式会社荏原製作所 | 研磨装置 |
| CN117140236B (zh) * | 2023-10-25 | 2024-01-26 | 苏州博宏源机械制造有限公司 | 一种晶圆厚度在线测量装置及方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6614529B1 (en) * | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| JPH10229061A (ja) * | 1997-02-13 | 1998-08-25 | Nikon Corp | 研磨量測定装置 |
| US6142855A (en) * | 1997-10-31 | 2000-11-07 | Canon Kabushiki Kaisha | Polishing apparatus and polishing method |
| US6271047B1 (en) * | 1998-05-21 | 2001-08-07 | Nikon Corporation | Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same |
| US6361646B1 (en) * | 1998-06-08 | 2002-03-26 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection for chemical mechanical polishing |
| US6146242A (en) * | 1999-06-11 | 2000-11-14 | Strasbaugh, Inc. | Optical view port for chemical mechanical planarization endpoint detection |
| US6454630B1 (en) * | 1999-09-14 | 2002-09-24 | Applied Materials, Inc. | Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same |
| US6671051B1 (en) * | 1999-09-15 | 2003-12-30 | Kla-Tencor | Apparatus and methods for detecting killer particles during chemical mechanical polishing |
| US6628397B1 (en) * | 1999-09-15 | 2003-09-30 | Kla-Tencor | Apparatus and methods for performing self-clearing optical measurements |
| JP3854056B2 (ja) * | 1999-12-13 | 2006-12-06 | 株式会社荏原製作所 | 基板膜厚測定方法、基板膜厚測定装置、基板処理方法及び基板処理装置 |
| US6707540B1 (en) * | 1999-12-23 | 2004-03-16 | Kla-Tencor Corporation | In-situ metalization monitoring using eddy current and optical measurements |
| US6878038B2 (en) * | 2000-07-10 | 2005-04-12 | Applied Materials Inc. | Combined eddy current sensing and optical monitoring for chemical mechanical polishing |
| US6609947B1 (en) * | 2000-08-30 | 2003-08-26 | Micron Technology, Inc. | Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates |
| JP2002198341A (ja) * | 2000-12-25 | 2002-07-12 | Toshiba Corp | 化学的機械的研磨処理システム及び化学的機械的研磨方法 |
| US6790768B2 (en) * | 2001-07-11 | 2004-09-14 | Applied Materials Inc. | Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects |
| JP2003057027A (ja) * | 2001-08-10 | 2003-02-26 | Ebara Corp | 測定装置 |
| US6599765B1 (en) * | 2001-12-12 | 2003-07-29 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
| US7175503B2 (en) * | 2002-02-04 | 2007-02-13 | Kla-Tencor Technologies Corp. | Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device |
| US7764377B2 (en) * | 2005-08-22 | 2010-07-27 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
-
2003
- 2003-07-14 US US10/617,794 patent/US20040242121A1/en not_active Abandoned
-
2004
- 2004-05-13 KR KR1020057021477A patent/KR20060009327A/ko not_active Ceased
- 2004-05-13 EP EP04732769A patent/EP1641597A4/en not_active Withdrawn
- 2004-05-13 TW TW093113413A patent/TWI338605B/zh not_active IP Right Cessation
- 2004-05-13 WO PCT/JP2004/006768 patent/WO2004101223A1/en not_active Ceased
- 2004-05-13 CN CN2004800134000A patent/CN1791490B/zh not_active Expired - Lifetime
- 2004-05-13 JP JP2006519155A patent/JP2006525878A/ja active Pending
-
2005
- 2005-11-16 US US11/274,112 patent/US7214122B2/en not_active Expired - Lifetime
-
2007
- 2007-03-28 US US11/727,727 patent/US7507144B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102815099B1 (ko) | 2018-12-26 | 2025-06-04 | 가부시키가이샤 에바라 세이사꾸쇼 | 광학식 막 두께 측정 시스템의 세정 방법 |
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