JP2006526292A5 - - Google Patents

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Publication number
JP2006526292A5
JP2006526292A5 JP2006519167A JP2006519167A JP2006526292A5 JP 2006526292 A5 JP2006526292 A5 JP 2006526292A5 JP 2006519167 A JP2006519167 A JP 2006519167A JP 2006519167 A JP2006519167 A JP 2006519167A JP 2006526292 A5 JP2006526292 A5 JP 2006526292A5
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JP
Japan
Prior art keywords
substrate
fluid
flow path
fluid chamber
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006519167A
Other languages
English (en)
Japanese (ja)
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JP2006526292A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2004/007152 external-priority patent/WO2004103636A2/en
Publication of JP2006526292A publication Critical patent/JP2006526292A/ja
Publication of JP2006526292A5 publication Critical patent/JP2006526292A5/ja
Pending legal-status Critical Current

Links

JP2006519167A 2003-05-21 2004-05-19 基板研磨装置 Pending JP2006526292A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003143526 2003-05-21
JP2003143527 2003-05-21
PCT/JP2004/007152 WO2004103636A2 (en) 2003-05-21 2004-05-19 Substrate polishing apparatus

Publications (2)

Publication Number Publication Date
JP2006526292A JP2006526292A (ja) 2006-11-16
JP2006526292A5 true JP2006526292A5 (enExample) 2007-02-08

Family

ID=33455528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006519167A Pending JP2006526292A (ja) 2003-05-21 2004-05-19 基板研磨装置

Country Status (8)

Country Link
US (2) US7101257B2 (enExample)
EP (1) EP1633528B1 (enExample)
JP (1) JP2006526292A (enExample)
KR (1) KR101052844B1 (enExample)
CN (1) CN1791491B (enExample)
DE (1) DE602004031295D1 (enExample)
TW (1) TWI271265B (enExample)
WO (1) WO2004103636A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7101257B2 (en) * 2003-05-21 2006-09-05 Ebara Corporation Substrate polishing apparatus
US7777920B2 (en) * 2006-02-28 2010-08-17 Toshiba Tec Kabushiki Kaisha Image copier and image copying method
JP2014154874A (ja) * 2013-02-07 2014-08-25 Toshiba Corp 膜厚モニタ装置、研磨装置および膜厚モニタ方法
JP2015126179A (ja) * 2013-12-27 2015-07-06 株式会社荏原製作所 研磨終点検出方法、及び研磨終点検出装置
JP6229737B2 (ja) * 2014-01-10 2017-11-15 株式会社Sumco ワークの厚さ測定装置、測定方法、及びワークの研磨装置
KR20170039019A (ko) 2015-09-30 2017-04-10 서울바이오시스 주식회사 침대용 공기 정화기 및 광촉매-공기조화 모듈
TW201822953A (zh) * 2016-09-16 2018-07-01 美商應用材料股份有限公司 基於溝槽深度的電磁感應監控進行的過拋光
US10562148B2 (en) * 2016-10-10 2020-02-18 Applied Materials, Inc. Real time profile control for chemical mechanical polishing
JP7141204B2 (ja) * 2017-10-19 2022-09-22 株式会社荏原製作所 研磨装置、及び研磨方法
JP7022647B2 (ja) * 2018-05-08 2022-02-18 株式会社荏原製作所 光透過性部材、研磨パッドおよび基板研磨装置
JP7403998B2 (ja) * 2019-08-29 2023-12-25 株式会社荏原製作所 研磨装置および研磨方法
CN112247819B (zh) * 2020-10-09 2022-08-19 无锡贝来钢管有限公司 大口径厚壁无缝钢管加工装置
CN115308140A (zh) * 2022-10-11 2022-11-08 杭州众硅电子科技有限公司 一种化学机械抛光的在线监测装置

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US6614529B1 (en) * 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5657123A (en) * 1994-09-16 1997-08-12 Mitsubishi Materials Corp. Film thickness measuring apparatus, film thickness measuring method and wafer polishing system measuring a film thickness in conjunction with a liquid tank
JPH08174411A (ja) * 1994-12-22 1996-07-09 Ebara Corp ポリッシング装置
US6537133B1 (en) * 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5838447A (en) * 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
US5762536A (en) * 1996-04-26 1998-06-09 Lam Research Corporation Sensors for a linear polisher
US5958148A (en) * 1996-07-26 1999-09-28 Speedfam-Ipec Corporation Method for cleaning workpiece surfaces and monitoring probes during workpiece processing
JP3454658B2 (ja) * 1997-02-03 2003-10-06 大日本スクリーン製造株式会社 研磨処理モニター装置
JPH10229061A (ja) 1997-02-13 1998-08-25 Nikon Corp 研磨量測定装置
US6106662A (en) * 1998-06-08 2000-08-22 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6361646B1 (en) * 1998-06-08 2002-03-26 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6334807B1 (en) * 1999-04-30 2002-01-01 International Business Machines Corporation Chemical mechanical polishing in-situ end point system
WO2001015861A1 (en) 1999-08-27 2001-03-08 Asahi Kasei Kabushiki Kaisha Polishing pad and polisher
US6671051B1 (en) 1999-09-15 2003-12-30 Kla-Tencor Apparatus and methods for detecting killer particles during chemical mechanical polishing
US6628397B1 (en) * 1999-09-15 2003-09-30 Kla-Tencor Apparatus and methods for performing self-clearing optical measurements
JP2001088021A (ja) * 1999-09-22 2001-04-03 Speedfam Co Ltd 研磨終点検出機構付き研磨装置
US6399501B2 (en) 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
JP3854056B2 (ja) * 1999-12-13 2006-12-06 株式会社荏原製作所 基板膜厚測定方法、基板膜厚測定装置、基板処理方法及び基板処理装置
US6707540B1 (en) * 1999-12-23 2004-03-16 Kla-Tencor Corporation In-situ metalization monitoring using eddy current and optical measurements
WO2001046684A1 (en) 1999-12-23 2001-06-28 Kla-Tencor Corporation In-situ metalization monitoring using eddy current measurements and optical measurements
US6433541B1 (en) * 1999-12-23 2002-08-13 Kla-Tencor Corporation In-situ metalization monitoring using eddy current measurements during the process for removing the film
US6491569B2 (en) * 2001-04-19 2002-12-10 Speedfam-Ipec Corporation Method and apparatus for using optical reflection data to obtain a continuous predictive signal during CMP
CN1414608A (zh) * 2001-10-26 2003-04-30 矽统科技股份有限公司 晶圆的化学机械研磨装置
US6599765B1 (en) * 2001-12-12 2003-07-29 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
JP3878016B2 (ja) * 2001-12-28 2007-02-07 株式会社荏原製作所 基板研磨装置
US7030018B2 (en) * 2002-02-04 2006-04-18 Kla-Tencor Technologies Corp. Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
US6733368B1 (en) * 2003-02-10 2004-05-11 Seh America, Inc. Method for lapping a wafer
US7101257B2 (en) * 2003-05-21 2006-09-05 Ebara Corporation Substrate polishing apparatus

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