JP2008194579A5 - - Google Patents

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Publication number
JP2008194579A5
JP2008194579A5 JP2007030235A JP2007030235A JP2008194579A5 JP 2008194579 A5 JP2008194579 A5 JP 2008194579A5 JP 2007030235 A JP2007030235 A JP 2007030235A JP 2007030235 A JP2007030235 A JP 2007030235A JP 2008194579 A5 JP2008194579 A5 JP 2008194579A5
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JP
Japan
Prior art keywords
temperature
adhesive
heat exchange
exchange medium
adjusting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007030235A
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English (en)
Japanese (ja)
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JP2008194579A (ja
JP5279109B2 (ja
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Publication date
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Priority to JP2007030235A priority Critical patent/JP5279109B2/ja
Priority claimed from JP2007030235A external-priority patent/JP5279109B2/ja
Publication of JP2008194579A publication Critical patent/JP2008194579A/ja
Publication of JP2008194579A5 publication Critical patent/JP2008194579A5/ja
Application granted granted Critical
Publication of JP5279109B2 publication Critical patent/JP5279109B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007030235A 2007-02-09 2007-02-09 部品実装機 Active JP5279109B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007030235A JP5279109B2 (ja) 2007-02-09 2007-02-09 部品実装機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007030235A JP5279109B2 (ja) 2007-02-09 2007-02-09 部品実装機

Publications (3)

Publication Number Publication Date
JP2008194579A JP2008194579A (ja) 2008-08-28
JP2008194579A5 true JP2008194579A5 (enExample) 2009-12-10
JP5279109B2 JP5279109B2 (ja) 2013-09-04

Family

ID=39754028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007030235A Active JP5279109B2 (ja) 2007-02-09 2007-02-09 部品実装機

Country Status (1)

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JP (1) JP5279109B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5416075B2 (ja) * 2010-01-25 2014-02-12 東京エレクトロン株式会社 処理装置、処理方法、プログラム及びコンピュータ記憶媒体
CN105413971A (zh) * 2016-01-04 2016-03-23 京东方科技集团股份有限公司 胶材涂布装置
JP7069105B2 (ja) * 2016-07-08 2022-05-17 マクドナルド デットワイラー アンド アソシエイツ インコーポレーテッド コーキング及びシーリング作業用の粘性流体の自動化された人工的ビジョンガイド付き分注のためのシステム及び方法
JP7120900B2 (ja) * 2018-12-12 2022-08-17 株式会社Fuji 温調ユニット
CN120885408B (zh) * 2025-10-10 2025-11-28 浙江迈伺特智能装备有限公司 一种便于切换点胶状态的点胶机用阀门

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58102415A (ja) * 1981-12-14 1983-06-18 昭和電線電纜株式会社 ワニスの温度制御方法
JPH03251685A (ja) * 1990-02-28 1991-11-11 Suzuki Motor Corp 熱交換装置
JPH0470160U (enExample) * 1990-10-31 1992-06-22
JPH07245499A (ja) * 1994-03-03 1995-09-19 Sanyo Electric Co Ltd 粘性流体塗布方法及びそれを使用した部品装着装置
JP2633816B2 (ja) * 1995-03-06 1997-07-23 シーケーディ株式会社 接着剤注出機
JPH0973977A (ja) * 1995-09-05 1997-03-18 Ckd Corp 接着剤注出機
JP3764238B2 (ja) * 1997-02-18 2006-04-05 松下電器産業株式会社 ボンドの塗布装置
JP3697819B2 (ja) * 1997-03-03 2005-09-21 松下電器産業株式会社 ボンドの塗布装置
JP2001125650A (ja) * 1999-08-17 2001-05-11 Fuji Photo Film Co Ltd タンク温度制御方法及び装置
JP2003225603A (ja) * 2002-02-05 2003-08-12 Hirata Corp 液体塗布装置
US7041172B2 (en) * 2003-02-20 2006-05-09 Asml Holding N.V. Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems

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