JP5279109B2 - 部品実装機 - Google Patents
部品実装機 Download PDFInfo
- Publication number
- JP5279109B2 JP5279109B2 JP2007030235A JP2007030235A JP5279109B2 JP 5279109 B2 JP5279109 B2 JP 5279109B2 JP 2007030235 A JP2007030235 A JP 2007030235A JP 2007030235 A JP2007030235 A JP 2007030235A JP 5279109 B2 JP5279109 B2 JP 5279109B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- adhesive
- heat exchange
- exchange medium
- adjusting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 294
- 230000001070 adhesive effect Effects 0.000 claims abstract description 289
- 238000012545 processing Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 abstract 5
- 238000000034 method Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 6
- 230000002265 prevention Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007030235A JP5279109B2 (ja) | 2007-02-09 | 2007-02-09 | 部品実装機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007030235A JP5279109B2 (ja) | 2007-02-09 | 2007-02-09 | 部品実装機 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008194579A JP2008194579A (ja) | 2008-08-28 |
| JP2008194579A5 JP2008194579A5 (enExample) | 2009-12-10 |
| JP5279109B2 true JP5279109B2 (ja) | 2013-09-04 |
Family
ID=39754028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007030235A Active JP5279109B2 (ja) | 2007-02-09 | 2007-02-09 | 部品実装機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5279109B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017118045A1 (zh) * | 2016-01-04 | 2017-07-13 | 京东方科技集团股份有限公司 | 胶材涂布装置 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5416075B2 (ja) * | 2010-01-25 | 2014-02-12 | 東京エレクトロン株式会社 | 処理装置、処理方法、プログラム及びコンピュータ記憶媒体 |
| CA3029111C (en) * | 2016-07-08 | 2025-05-06 | Macdonald, Dettwiler And Associates Inc. | SYSTEM AND METHOD FOR AUTOMATED, VISION-GUIDED DISTRIBUTION OF VISCOUS FLUIDS, INTENDED FOR CALFATILLING AND SEALING OPERATIONS |
| JP7120900B2 (ja) * | 2018-12-12 | 2022-08-17 | 株式会社Fuji | 温調ユニット |
| CN120885408B (zh) * | 2025-10-10 | 2025-11-28 | 浙江迈伺特智能装备有限公司 | 一种便于切换点胶状态的点胶机用阀门 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58102415A (ja) * | 1981-12-14 | 1983-06-18 | 昭和電線電纜株式会社 | ワニスの温度制御方法 |
| JPH03251685A (ja) * | 1990-02-28 | 1991-11-11 | Suzuki Motor Corp | 熱交換装置 |
| JPH0470160U (enExample) * | 1990-10-31 | 1992-06-22 | ||
| JPH07245499A (ja) * | 1994-03-03 | 1995-09-19 | Sanyo Electric Co Ltd | 粘性流体塗布方法及びそれを使用した部品装着装置 |
| JP2633816B2 (ja) * | 1995-03-06 | 1997-07-23 | シーケーディ株式会社 | 接着剤注出機 |
| JPH0973977A (ja) * | 1995-09-05 | 1997-03-18 | Ckd Corp | 接着剤注出機 |
| JP3764238B2 (ja) * | 1997-02-18 | 2006-04-05 | 松下電器産業株式会社 | ボンドの塗布装置 |
| JP3697819B2 (ja) * | 1997-03-03 | 2005-09-21 | 松下電器産業株式会社 | ボンドの塗布装置 |
| JP2001125650A (ja) * | 1999-08-17 | 2001-05-11 | Fuji Photo Film Co Ltd | タンク温度制御方法及び装置 |
| JP2003225603A (ja) * | 2002-02-05 | 2003-08-12 | Hirata Corp | 液体塗布装置 |
| US7041172B2 (en) * | 2003-02-20 | 2006-05-09 | Asml Holding N.V. | Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems |
-
2007
- 2007-02-09 JP JP2007030235A patent/JP5279109B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017118045A1 (zh) * | 2016-01-04 | 2017-07-13 | 京东方科技集团股份有限公司 | 胶材涂布装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008194579A (ja) | 2008-08-28 |
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