CN108713246A - 焊锡凸块的修正方法 - Google Patents

焊锡凸块的修正方法 Download PDF

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CN108713246A
CN108713246A CN201680081870.3A CN201680081870A CN108713246A CN 108713246 A CN108713246 A CN 108713246A CN 201680081870 A CN201680081870 A CN 201680081870A CN 108713246 A CN108713246 A CN 108713246A
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solder bump
workpiece
head
modification method
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中村秀树
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Senju Metal Industry Co Ltd
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    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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    • H01L2224/13099Material
    • H01L2224/131Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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Abstract

在硅晶片上形成的图案是微细的,所形成的焊锡凸块也是微细的,因此,当问题产生时不能进行修正,连工件的硅晶片都被废弃。作为修正方法,在形成于硅晶片上的焊锡凸块上,在将穿孔成与上述焊锡凸块相同图案的掩模覆盖到焊锡凸块上之后,从上述掩模上接触熔融焊锡,将熔融焊锡填充到上述掩模的穿孔部中。

Description

焊锡凸块的修正方法
技术领域
本发明涉及对在基板和半导体等电子部件的工件上形成的焊锡凸块的形成缺口和/或焊锡量不足的部分补充焊锡的修正方法。
背景技术
在向电子设备的印刷电路板的半导体等电子部件的安装或半导体等电子部件的装配中,使用焊锡或粘接剂。特别是由陶瓷等形成的电子部件,不能直接焊接。因此,在电子部件的工件的表面设置由电镀保护膜构成的焊盘,在该焊盘之上形成焊锡凸块(凸起)。之后,进行经由了凸块的焊接。
以往多用作焊锡凸块形成方法的是使用焊膏(solder paste)的方法。在印刷机或分配器(dispenser)中将焊膏涂敷到工件的电镀保护膜上之后,对焊膏进行回流(reflow)加热而使其熔化,形成凸块。该方法的成本便宜。可是,在印刷中存在能够印刷的极限,不能形成与微细的电路图案对应的凸块。
也存在利用了焊球(solder ball)的凸块形成方法。在电子部件的工件上装载微细的焊球,通过对其进行回流加热来形成凸块。该方法能够形成与微细的电路图案对应的凸块。可是,焊球自身的成本高,因此,作为整体而为高成本。
作为以低成本形成能够与微细电路图案对应的凸块的方法,注目了排出熔融焊锡来形成焊锡凸块的、所谓熔融焊锡法。作为实现熔融焊锡法的装置,例如,已知有下述专利文献1所记载的焊锡附着装置。该焊锡附着装置通过使收容熔融焊锡的容器的喷嘴开口部沿水平方向扫描来向多处高效率地供给熔融焊锡。此外,也已知有凸块形成装置,所述凸块形成装置具有在作业结束后冷却喷嘴头之后将喷嘴头从掩模举起的机构(例如,下述专利文献2)。
现有技术文献
专利文献
专利文献1:日本特开平2-015698号公报;
专利文献2:WO2013/058299A。
发明内容
发明要解决的课题
在形成向硅晶片等工件的焊锡凸块中,使用焊膏、焊球、熔融焊锡的方法全部将工件整体或工件的部分总括起来形成焊锡凸块是通常的。可是,当在总括形成的焊锡凸块的一部分存在缺损和/或焊锡量不足时,在由焊锡凸块形成的焊锡接合部产生问题。在硅晶片上形成的图案是微细的,所形成的焊锡凸块也是微细的,因此,当问题产生时不能进行修正,连工件的硅晶片都被废弃。本发明提供一种在形成于硅晶片上的焊锡凸块的一部分存在缺损和/或焊锡量不足的情况下修正焊锡凸块的方法。
用于解决课题的方案
本发明者们发现了:在凸块的一部分存在缺损和/或焊锡量不足的情况下,在焊锡凸块上覆盖与焊锡凸块的图案相同的掩模,当从其上接触熔融焊锡时,熔融焊锡被填充到存在缺损和/或焊锡量不足的部分中,能够修正焊锡凸块。
根据本发明的一个实施方式,提供进行在工件上形成的焊锡凸块的修正的修正方法。在该方法中,在形成于硅晶片上的焊锡凸块上,在将穿孔成与上述焊锡凸块相同图案的掩模覆盖到焊锡凸块上之后,从上述掩模上接触熔融焊锡,将熔融焊锡填充到上述掩模的穿孔部中,由此,对在硅晶片上形成的焊锡凸块进行修正。在凸块的一部分存在缺损和/或焊锡量不足的情况下,在该一部分中对焊锡凸块补充焊锡,由此,能够得到完整的焊锡凸块。
根据该实施方式,能够利用在修正的硅晶片上形成的掩模的厚度对填充的焊锡量进行控制。也能够使用该方法,以便使由使用焊球的焊锡凸块形成方法等难以进行高度的控制的焊锡凸块的形成方法制作的焊锡凸块的高度一致而修正凸块的高度。关于在本实施方式中使用的掩模,只要为在与焊锡凸块相同图案形成有穿孔部的厚度为固定的掩模,则使用什么都可以。也可以使用聚酰亚胺等耐热树脂膜,即使在硅晶片中直接使用抗蚀剂形成掩模,也能够在修正用途中使用。
通过使用本实施方式的焊锡凸块的修正方法,从而在凸块的一部分存在缺损和/或焊锡量不足的情况下,能够对具有该焊锡凸块的硅晶片进行修正。因此,能够再利用以往被废弃的硅晶片,能够进行大幅度的材料费和工序的减少。在本方法中,利用掩模决定焊锡凸块的高度,因此,也能够使用本方法,以便使由使用焊球的焊锡凸块形成方法等难以进行高度的控制的焊锡凸块的形成方法制作的焊锡凸块的高度一致而修正凸块的高度,能够使用本方法的工序替换以往使用预先形成(preform)等补充焊锡的工序。
附图说明
图1是示出在本发明的一个实施方式中使用的焊锡凸块(solder bump)的修正装置的一个例子的概略图。
图2是示出根据本发明的一个实施方式的修正装置的概略结构的示意图。
图3A是示出本发明的一个实施方式的焊锡凸块的修正方法的工序的概略图。
图3B是示出本发明的一个实施方式的焊锡凸块的修正方法的工序的概略图。
图3C是示出本发明的一个实施方式的焊锡凸块的修正方法的工序的概略图。
图3D是示出本发明的一个实施方式的焊锡凸块的修正方法的工序的概略图。
具体实施方式
对根据本发明的一个实施方式的修正装置的结构进行说明。图1是示出根据本发明的一个实施方式的修正装置的头(head)部1的图。图2是示出根据本发明的一个实施方式的修正装置的概略结构的示意图。头部1具备能够收容熔融焊锡等的槽(tank)2和在下端设置的修正头3。在用于熔融焊锡等需要温度控制的流体时,也能够在流体槽2的腹部卷绕加热器(heater)4等安装加热单元。在修正头3中,具有在头下端设置的修正喷嘴5和吸引口6,以能够比修正喷嘴5朝向行进方向先实施吸引工序的方式安装吸引口6。在对于修正喷嘴5和吸引口6也用于需要温度控制的流体时,能够在修正头3下端也安装加热器4。
作为修正头3的喷嘴开口的形状,能够采用圆形状、狭缝状和其他的公知的形状。特别是当作为喷嘴开口的形状而使用狭缝状时,能够向多个工件7(work)上的排出对象同时排出流体。此外,安装于修正头3的吸引口6的形状也能够采用圆形状、狭缝状和其他的公知的形状,但是,通过作为开口的形状而使用狭缝状,从而能够针对硅晶片或印刷电路板等工件7在多处同时除去掩模8内的空气。
接着,对整体的结构进行说明。虽然未图示,但是,修正装置能够以相对于应该修正的电子部件的工件7接近和背离的方式沿上下方向(Y)移动,并且也能够沿水平方向(X)移动。在工件7的上部根据需要放置有由聚酰亚胺(polyimide)或抗蚀剂(resist)形成的掩模8。修正头3在修正时下降到修正排出喷嘴5与工件7接触的位置。从修正排出喷嘴5与工件7接触的时间点起到脱离工件7的时间点对修正头3以朝向下方的方式施加压力。
在修正喷嘴5与工件7的接触状态被维持的状态下,液体修正头3沿水平移动。当修正头3沿水平移动时,首先从以能够朝向行进方向先实施吸引工序的方式安装的吸引口6吸引在工件7上设置的掩模8内的空气。在第多次的排出中,能够在此阶段中也吸引排出到掩模8内的流体。需要加热单元的流体通过被在修正头3下部设置的加热器4加热而能够吸引。之后,当液体修正头3进行水平移动时,从修正喷嘴5的开口排出流体,在工件7上的掩模8中涂敷流体。当流体的涂敷结束时,液体修正头3被举起以使从工件7离开。即使在不使用掩模8的情况下也能够进行相同的工序。
修正装置1具备用于将槽2内的流体保持为期望的温度的加热器4。加热器4能够被内置于槽2的壁部。加热器4被管理控制为被加热到适当的温度,以便保持最适于槽2内的熔融焊锡等流体9的修正条件的粘度。
流体排出装置1从槽2起通过延长管路10与能够流体连通的压力供给单元11连接,从吸引口6继续通过吸引管延长管路12与能够流体连通的减压供给单元13连接。压力供给单元11具有使例如0.06至0.1MPa(不限定于此)的压力的氮气产生的压力产生源14。压力产生源14经由闸阀(gate valve)15和3通阀(three way valve)16向槽2内供给压力。在槽2内保持的熔融焊锡受到来自压力产生源14的压力而从修正喷嘴5的开口射出。
减压供给单元13具有作为减压产生装置的微喷射器(micro-ejector)16。减压产生装置16经由例如调节器(regulator)17和节流阀18与使0.4MPa(不限定于此)的压力的氮气产生的压力产生源19连结,经由吸引管延长管路12向吸引口6供给负压。
修正装置具有压力传感器20和控制装置21。压力传感器20连结于在与槽2内流体连通的延长管路17设置的节流阀18,对槽2内的压力进行监视。将表示槽2内的压力的信号从压力传感器20向控制装置21送出。控制装置21配合作业工序的进展来操作压力产生源14、减压产生装置16、调节器17、压力产生源19和各阀,向槽2内供给压力。基于来自压力传感器20的信号来决定应该供给的适当的压力值。在将槽2内的熔融焊锡从修正喷嘴5的开口射出的情况下,以槽2内与压力传感器20流体连通的方式操作。通过利用控制装置21调整由例如压力产生源14产生的压力值,从而能够使向槽2内供给的正压的大小发生变化。或者,通过控制装置21调整设置于压力供给单元11的调整阀(未图示),从而使压力值发生变化也可。
接着,对修正装置的工作进行说明。首先,如图3A那样根据需要将掩模覆盖到工件7的修正处。在本实施例中,使用了在与修正处相同之处设置有穿孔部的片材状的聚酰亚胺片材。关于覆盖的掩模,进行修正处与穿孔部的位置对准来固定。
当准备结束时,如图3B那样,将修正装置的修正头1载置于工件上,进入修正工序。修正头1被固定于从工件7离开的固定位置,但是,在流体排出时,修正头1也沿上下方向、水平方向移动,修正头1下降到与工件7上的掩模8的排出部分接触的位置。修正装置的修正头1总是施加有压力,在修正头3下降时,修正排出喷嘴5与工件7接触。
修正头1先从设置有吸引喷嘴5的一方沿水平移动,在对工件7上的掩模8的开口部的空气进行减压之后,修正头3描工件7的掩模8之上而移动,以使以修正喷嘴5与槽2内的加热后的熔融焊锡接触。从压力产生源14供给的压力经由闸阀15向槽2内供给正的压力。在槽2内保持的熔融焊锡9受到来自压力产生源14的压力而在排出喷嘴5的开口与工件的焊锡凸块接触,因此,在焊锡凸块缺少的部分(和/或焊锡量不足的部分。参照图3B的虚线部分)中填充熔融焊锡(参照图3C),使焊锡凸块完成(参照图3D)。根据本实施方式,即使修正喷嘴5与焊锡凸块已经完成的部分接触,由于掩模对熔融焊锡量进行调整,所以熔融焊锡也不会附着于焊锡凸块到掩模的内容量以上。因此,直接维持修正前的焊锡凸块。修正头1在工件上移动1次,由此,焊锡凸块的修正完成。在将向槽2内供给的压力切换为从减压产生装置16产生的负的压力之后,使修正头1上升。在放冷后,从工件7上去掉掩模8。
附图标记的说明
1 头部
2 槽
3 修正头
4 加热器
5 修正喷嘴
6 吸引口
7 工件
8 掩模
9 熔融焊锡
10 延长管路
11 压力供给单元
12 吸引管延长管路
13 减压供给单元
14 压力产生源
15 闸阀
16 减压产生装置
17 延长管路
18 节流阀
19 压力产生源
20 压力传感器
21 控制装置
22 流体供给装置。

Claims (3)

1.一种在工件上形成的焊锡凸块的修正方法,进行在工件上形成的焊锡凸块的修正,所述修正方法的特征在于,
具有由能够收容焊锡的槽和修正头构成的修正头部,所述修正头部的宽度比工件的宽度小,在所述排出头的一端形成有用于对工件上的掩模中的空气进行吸引的吸引口和用于排出流体的排出喷嘴,并且,吸引口被设置在排出头的行进方向上,
在焊锡凸块修正准备时,所述排出头相对于所述工件接近移动直到与该工件接触,在焊锡凸块修正时,在所述修正头与所述工件接触的状态下向所述焊锡槽施加正的压力,在焊锡凸块修正后,在向所述焊锡槽施加负的压力的状态下使所述修正头上升。
2.根据权利要求1所述的在工件上形成的焊锡凸块的修正方法,其特征在于,使用了将在所述修正头中具有狭缝状的开口部来作为修正喷嘴和吸引口的形状作为特征的修正头。
3.一种焊锡凸块的修正方法,所述修正方法是在工件上形成的焊锡凸块的修正方法,其中,所述修正方法具备:
在具有:存在所述焊锡凸块缺损和/或焊锡量不足的、缺陷部分的工件上覆盖与所述焊锡凸块的图案相同的掩模的工序;以及
通过使对用于形成所述焊锡凸块的流体进行排出的修正头在所述掩模上扫描并从所述修正头排出所述流体、从而将所述流体排出到所述掩模之中的与所述缺陷部分对应的部分内的工序。
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