TW201727855A - 焊料凸塊之修正方法 - Google Patents

焊料凸塊之修正方法 Download PDF

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TW201727855A
TW201727855A TW105141594A TW105141594A TW201727855A TW 201727855 A TW201727855 A TW 201727855A TW 105141594 A TW105141594 A TW 105141594A TW 105141594 A TW105141594 A TW 105141594A TW 201727855 A TW201727855 A TW 201727855A
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solder
workpiece
correction
solder bump
head
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TWI698970B (zh
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中村秀樹
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千住金屬工業股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1131—Manufacturing methods by local deposition of the material of the bump connector in liquid form
    • H01L2224/11312—Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

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  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract

本發明係因形成在矽晶圓上的圖案微細，所形成的焊料凸塊也微細，故若產生缺失，就無法進行修正，必須將整個工件之矽晶圓丟棄。本發明之修正方法，係在形成於矽晶圓上的焊料凸塊上，將開孔成與前述焊料凸塊相同圖案的遮罩覆蓋於焊料凸塊上之後，從前述遮罩使熔融焊料接觸，而將熔融焊料填充於前述遮罩的開孔部。

Description

焊料凸塊之修正方法
本發明係關於對形成在基板及半導體等電子零件工件上的焊料凸塊之形成缺陷、及/或焊料量不足部分補充焊料的修正方法。
對電子裝置的印刷基板安裝半導體等電子零件或組裝半導體等電子零件時，可使用焊料或黏接劑。特別是以陶瓷等形成的電子零件，無法直接進行焊接。因此，在電子零件工件表面設置由電鍍膜形成的焊墊，再於該焊墊上形成焊料凸塊(凸瘤)。然後，介著凸塊進行焊接。
以往較多使用來作為焊料凸塊的形成方法者，為利用焊料糊的方法。該方法係以印刷機或分配器(dispenser)將焊料糊塗佈於工件的電鍍膜上之後，將焊料糊迴流(reflow)加熱使其熔融，形成凸塊。該方法的成本低廉。然而，在印刷時有印刷能力上的極限，無法形成和微細電路圖案對應的凸塊。
也有利用焊球的凸塊形成方法。在電子零件的工件上搭載微細的焊球，並藉由將焊球施行迴流加熱而形成凸塊。該方法可形成和微細電路圖案對應的凸塊。然 而，因焊球本身的成本高，所以會使整體的成本增高。
以低成本形成可和微細電路圖案對應的凸塊形成方法中，吐出熔融焊料而形成焊料凸塊之所謂熔融焊料法正受到矚目。就實現熔融焊料法的裝置而言，已知有例如下述專利文獻1所載的焊料附著裝置。該焊料附著裝置藉由將收容熔融焊料的容器之供料嘴開口部朝水平方向掃描，藉此，可有效率地對複數個部位吐出熔融焊料。此外，具有在作業結束後將供料嘴頭冷卻，然後將供料嘴頭從遮罩升起之機構的凸塊形成裝置也已為人知(例如，下述專利文獻2)
[先前技術文獻] [專利文獻]
[專利文獻1]日本特開平2-015698號公報
[專利文獻2]WO2013/058299A
在矽晶圓等工件上形成焊料凸塊一般係使用焊料糊、焊球、熔融焊料的所有方法為將工件整體或工件的一部分一併形成焊料凸塊。但，一併形成的焊料凸塊之一部分上若有缺損、及/或焊料量不足，會在該焊料凸塊所形成的焊料接合部產生缺失。形成在矽晶圓上的圖案很微細，所形成的焊料凸塊也很微細，故若產生缺失，即無法修正，必須整個矽晶圓工件丟棄。本發明係提供在形成於
矽晶圓上的焊料凸塊的一部分有缺損、及/或焊料量不足之情形下，將焊料凸塊加以修正的方法。
本案發明人等發現，在凸塊有局部缺損、及/或焊料量不足時，若在焊料凸塊上覆蓋和焊料凸塊的圖案相同的遮罩，並從其上方接觸熔融焊料時，可在具有缺損、及/或焊料量不足的部分填充熔融焊料，並修正焊料凸塊。
若依本發明之一實施形態，可提供一種形成於工件上的焊料凸塊之修正方法。該方法中，係在形成於矽晶圓上的焊料凸塊上，將開孔成和前述焊料凸塊相同圖案的遮罩覆蓋於焊料凸塊上之後，從前述遮罩上接觸熔融焊料，將熔融焊料充填於前述遮罩的開孔部，藉此將形成於矽晶圓上的焊料凸塊予以修正。在凸塊的局部有缺損、及/或焊料量不足時，藉由將焊料補充在該局部的焊料凸塊，可獲得完整的焊料凸塊。
若依本實施形態，可藉形成在要修正的矽晶圓上的遮罩厚度來控制所充填的焊料量。該方法也可用來使以焊球形成焊料凸塊的方法等難以控制高度的焊料凸塊形成方法所製作的焊料凸塊高度一致，而修正凸塊高度。本實施形態使用的遮罩，只要是在和焊料凸塊相同圖案上形成開孔部之厚度為一定的遮罩，可使用任何遮罩。亦可使用聚醯亞胺等耐熱樹脂薄膜，即使直接以阻劑在矽晶圓上形成遮罩，亦可使用於修正用途。
藉由使用本實施形態的焊料凸塊修正方法， 在凸塊局部有缺損及/或焊料量不足時，可對具有該焊料凸塊的矽晶圓進行修正。因此，以往被捨棄的矽晶圓可再利用，材料費及步驟可大幅減少。在本方法中，因可藉遮罩決定焊料凸塊的高度，故本方法也可使用來使以焊球形成焊料凸塊的方法等難以控制高度的焊料凸塊形成方法所製作的焊料凸塊高度一致，而修正凸塊高度。可將以往預成形等補充焊料的步驟置換為本方法的步驟。
1‧‧‧頭部(修正裝置、修正頭、液體吐出裝置)
2‧‧‧焊料槽
3‧‧‧修正頭
4‧‧‧加熱器
5‧‧‧修正供料嘴
6‧‧‧抽吸口
7‧‧‧工件
8‧‧‧遮罩
9‧‧‧熔融焊料
10‧‧‧延長管路
11‧‧‧壓力供給手段
12‧‧‧抽吸管延長管路
13‧‧‧減壓供給手段
14‧‧‧壓力發生源
15‧‧‧閘閥
16‧‧‧減壓發生裝置
17‧‧‧延長管路
18‧‧‧節流閥
19‧‧‧壓力發生源
20‧‧‧壓力感測器
21‧‧‧控制裝置
22‧‧‧流體供給裝置
第1圖為使用在本發明一實施形態的焊料凸塊修正裝置例的概略圖。
第2圖為本發明一實施形態的修正裝置之概略構成示意圖。
第3A圖為本發明一實施形態的焊料凸塊修正方法的步驟概略圖。
第3B圖為本發明一實施形態的焊料凸塊修正方法的步驟概略圖。
第3C圖為本發明一實施形態的焊料凸塊修正方法的步驟概略圖。
第3D圖為本發明一實施形態的焊料凸塊修正方法的步驟概略圖。
[發明的實施形態]
茲說明本發明一實施形態所涉及的修正裝置 的構成。第1圖為本發明一實施形態所涉及的修正裝置的頭部1的圖示。第2圖為本發明一實施形態的修正裝置的概略構成圖。頭部1具備可收容熔融焊料等的焊料槽2、及設置於下端的修正頭3。使用於熔融焊料等需要控制溫度的流體時，也可在焊料槽2的腹部安裝捲附加熱器4等加熱手段。修正頭3具有設於頭部下端的修正供料嘴5及抽吸口6。抽吸口6係安裝成可比修正供料嘴5朝行進方向先實施抽吸步驟。修正供料嘴5及抽吸口6使用於必需控制溫度的流體時，也可在修正頭3下端安裝加熱器4。
修正頭3的供料嘴開口形狀，可採用圓形、狹縫狀及其他公知形狀。特別是，若使用狹縫狀作為供料嘴開口形狀時，可同時對複數個工件7上的吐出對象吐出流體。此外，安裝在修正頭3的抽吸口6形狀雖然也可採用圓形、狹縫狀及其他公知的形狀，但透過使用狹縫狀作為開口形狀，可對矽晶圓或印刷基板等工件7在複數個部位同時除去遮罩8內的空氣。
接著，就整體的構成加以說明。圖中雖未顯示，但修正裝置可以相對於應修正的電子零件工件7為接近及離開的方式移動於上下方向(Y)，同時，也可移動於水平方向(X)。在工件7的上部，可依需要而放置以聚醯亞胺或阻劑所形成的遮罩8。修正頭3要進行修正時，係使修正供料嘴5下降至接觸工件7的位置。從修正供料嘴5接觸工件7的時間點到離開工件7為止的時間點，對修正頭3向下方施加壓力。
在修正供料嘴5和工件7維持接觸的狀態下，液體修正頭3可水平移動。修正頭3水平移動時，首先，從安裝成可朝行進方向先實施抽吸步驟的抽吸口6，將設置在工件7上的遮罩8內的空氣加以抽吸。在複數次的吐出動作中吐出至遮罩8內的流體也可在此階段進行抽吸。需要加熱手段的流體則可藉由設置在修正頭3下部的加熱器4施以加熱，而成為可抽吸。然後，液體修正頭3水平移動時，流體就會從修正供料嘴5的開口吐出，並塗佈於工件7上的遮罩8中。流體塗佈結束後，液體修正頭3被上提，離開工件7。即使不使用遮罩8時，也可進行相同的步驟。
修正裝置1具備用以使焊料槽2內的流體保持在所期望之溫度的加熱器4。加熱器4可設成內建在焊料槽2的壁部。加熱器4係被管理控制成加熱至適當溫度，以使焊料槽2內的熔融焊料等流體9保持在最適合修正條件的粘度。
流體吐出裝置1係從焊料槽2通過延長管路10，和可連通流體的壓力供給手段11銜接，且從抽吸口6繼續通過抽吸管延長管路12，和可連通流體的減壓供給手段13銜接。壓力供給手段11具有用以產生例如0.06至0.1MPa(不限定於此)壓力的氮氣之壓力發生源14。壓力發生源14經由閘閥15及3通閥16而向焊料槽2內供給壓力。保持於焊料槽2內的熔融焊料受到來自壓力發生源14的壓力，而從修正供料嘴5的開口射出。
減壓供給手段13具有作為減壓發生裝置的微噴氣器16。減壓發生裝置16係經由例如調節器17及節流閥18而和產生0.4MPa(並不限定於此)壓力之氮氣的壓力發生源19連結，並經由抽吸管延長管路12向抽吸口6供給負壓。
修正裝置1具有壓力感測器20及控制裝置21。壓力感測器20係連結於節流閥18以監視焊料槽2內的壓力，而節流閥18係設置於可和焊料槽2內連通流體的延長管路17。顯示焊料槽2內壓力的訊號係從壓力感測器20傳送至控制裝置21。控制裝置21則配合作業步驟的進程而操作壓力發生源14、減壓發生裝置16、調節器17、壓力發生源19及各閥門，將壓力供給至焊料槽2內。應供給的適當壓力值，係根據來自壓力感測器20的訊號來決定。要將焊料槽2內的熔融焊料從修正供料嘴5的開口射出時，以使焊料槽2內和壓力感測器20進行流體連通之方式操作。向焊料槽2內供給的正壓之大小，可藉由控制裝置21調整例如在壓力發生源14產生的壓力值而變化。或者，也可藉由控制裝置21將設在壓力供給手段11的調整閥(未圖示)進行調整來使壓力值變化。
接著，說明修正裝置的動作。首先，如第3A圖所示，依需要將遮罩覆蓋在工件7的修正部位。在本實施例中，係使用在和修正部位相同的位置設有開孔部的板片狀聚醯亞胺片。被覆蓋的遮罩施行開孔部和修正部位的對準，並使其固定。
準備作業結束時，如第3B圖所示，將修正裝置的修正頭1載置於工件上，以進入修正步驟。修正頭1雖係固定於離開工件7的固定位置，但流體吐出時，修正頭1會朝上下方向、水平方向移動。修正頭1係下降至接觸工件7上的遮罩8的吐出部分之位置為止。修正裝置的修正頭1係經常施加有壓力，修正頭3下降時，修正供料嘴5會接觸於工件7。
修正頭1係先從設置有修正供料嘴5的一側水平移動，在將工件7上的遮罩8的開口部空氣施以減壓後，修正頭3係仿描工件7的遮罩8上面而移動，俾以修正供料嘴5接觸焊料槽2內的已加熱熔融焊料。從壓力發生源14供給的壓力係經由閘閥15而向焊料槽2內供給正壓力。保持於焊料槽2內的熔融焊料9，因承受來自壓力發生源14的壓力而以修正供料嘴5的開口接觸工件的焊料凸塊，故可對焊料凸塊的缺陷部分(及/或焊料量不足的部分。參照第3B圖的虛線部分)充填熔融焊料(參照第3C圖)，使焊料凸塊獲得完整(參照第3D圖)。若依本實施形態，修正供料嘴5即使接觸焊料凸塊既已完成的部分，因遮罩會調整熔融焊料量，故熔融焊料不會附著於焊料凸塊至超過遮罩的內容量。因此，修正前的焊料凸塊能維持原樣。藉由修正頭1在工件上移動1次，可完成焊料凸塊之修正。在供給至焊料槽2內的壓力切換為產生自減壓發生裝置16的負壓力後，使修正頭1上升。放冷後，從工件7上取下遮罩8。
1‧‧‧頭部
2‧‧‧焊料槽
3‧‧‧修正頭
4‧‧‧加熱器
5‧‧‧修正供料嘴
6‧‧‧抽吸口
7‧‧‧工件
8‧‧‧遮罩
9‧‧‧熔融焊料
10‧‧‧延長管路
12‧‧‧抽吸管延長管路

Claims (3)

  1. 一種形成於工件上的焊料凸塊之修正方法，係形成於工件上的具有可收容焊料的焊料槽及由修正頭所構成的修正頭部，前述修正頭部的寬度小於工件之寬度，前述吐出頭的一端係形成有用以將工件上的遮罩中之空氣進行抽吸的抽吸口及用以吐出流體的吐出供料嘴，而且抽吸口係設置於吐出頭的行進方向，準備焊料凸塊修正時，前述吐出頭向前述工件接近移動至接觸前述工件為止；焊料凸塊修正時，在前述修正頭接觸前述工件的狀態下對前述焊料槽施加正壓力；焊料凸塊修正後，在對前述焊料槽施加負壓力的狀態下，使前述修正頭上升。
  2. 如申請專利範圍第1項所述之形成於工件上的焊料凸塊之修正方法，其中，前述修正頭具有修正供料嘴及作為抽吸口的形狀之狹縫狀開口部。
  3. 一種焊料凸塊之修正方法，係形成在工件上的焊料凸塊之修正方法，該修正方法具備：在具有缺陷部分的工件上，覆蓋與前述焊料凸塊之圖案相同的遮罩的步驟，該缺陷部分有前述焊料凸塊缺損、及/或焊料量不足；及藉由使用以形成前述焊料凸塊的流體吐出之修正頭一邊在前述遮罩上掃描，一邊從前述修正頭吐出前述流體，而將前述流體吐出至前述遮罩中之對應前述缺陷部分的部分內之步驟。
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