JPWO2017104746A1 - はんだバンプの修正方法 - Google Patents
はんだバンプの修正方法 Download PDFInfo
- Publication number
- JPWO2017104746A1 JPWO2017104746A1 JP2017556440A JP2017556440A JPWO2017104746A1 JP WO2017104746 A1 JPWO2017104746 A1 JP WO2017104746A1 JP 2017556440 A JP2017556440 A JP 2017556440A JP 2017556440 A JP2017556440 A JP 2017556440A JP WO2017104746 A1 JPWO2017104746 A1 JP WO2017104746A1
- Authority
- JP
- Japan
- Prior art keywords
- solder
- correction
- workpiece
- solder bump
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1131—Manufacturing methods by local deposition of the material of the bump connector in liquid form
- H01L2224/11312—Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
2 タンク
3 修正ヘッド
4 ヒータ
5 修正ノズル
6 吸引口
7 ワーク
8 マスク
9 溶融はんだ
10 延長管路
11 圧力供給手段
12 吸引管延長管路
13 減圧供給手段
14 圧力発生源
15 ゲート弁
16 減圧発生装置
17 延長管路
18 絞り弁
19 圧力発生源
20 圧力センサ
21 制御装置
22 流体供給装置
Claims (3)
- ワーク上に形成されたはんだバンプの修正を行う修正方法であって、はんだを収容可能なタンクと修正ヘッドからなる修正ヘッド部を有し、前記修正ヘッド部の幅はワークの幅より小さく、前記吐出ヘッドの一端には、ワーク上のマスク中の空気を吸引するための吸引口と流体を吐出するための吐出ノズルが形成されており、かつ吸引口は、吐出ヘッドの進行方向に設置されており、
はんだバンプ修正準備時には、前記吐出ヘッドが前記ワークに接触するまで該ワークに対して接近移動し、はんだバンプ修正時には、前記修正ヘッドが前記ワークに接触した状態で前記はんだタンクに正の圧力を加え、はんだバンプ修正後に前記はんだタンクに負の圧力を加えた状態で前記修正ヘッドを上昇させることを特徴とするワーク上に形成されたはんだバンプの修正方法。 - 前記修正ヘッドには修正ノズルおよび吸引口の形状としてスリット状の開口部を有することを特徴とする修正ヘッドを用いたことを特徴とする請求項1に記載のワーク上に形成されたはんだバンプの修正方法。
- ワーク上に形成されたはんだバンプの修正方法であって、
前記はんだバンプ欠損、および/または、はんだ量不足がある欠陥部分を有するワーク上に、前記はんだバンプのパターンと同じマスクを被せる工程と、
前記はんだバンプを形成するための流体を吐出する修正ヘッドを前記マスク上で走査させつつ前記修正ヘッドから前記流体を吐出することによって、前記マスクのうちの前記欠陥部分に対応する部分内に前記流体を吐出する工程と
を備えるはんだバンプの修正方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015244142 | 2015-12-15 | ||
JP2015244142 | 2015-12-15 | ||
PCT/JP2016/087372 WO2017104746A1 (ja) | 2015-12-15 | 2016-12-15 | はんだバンプの修正方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020068129A Division JP7017020B2 (ja) | 2015-12-15 | 2020-04-06 | はんだバンプの修正方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2017104746A1 true JPWO2017104746A1 (ja) | 2018-11-08 |
Family
ID=59056616
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017556440A Pending JPWO2017104746A1 (ja) | 2015-12-15 | 2016-12-15 | はんだバンプの修正方法 |
JP2020068129A Active JP7017020B2 (ja) | 2015-12-15 | 2020-04-06 | はんだバンプの修正方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020068129A Active JP7017020B2 (ja) | 2015-12-15 | 2020-04-06 | はんだバンプの修正方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10681822B2 (ja) |
EP (1) | EP3401951A4 (ja) |
JP (2) | JPWO2017104746A1 (ja) |
KR (1) | KR102689385B1 (ja) |
CN (1) | CN108713246B (ja) |
TW (1) | TWI698970B (ja) |
WO (1) | WO2017104746A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017104745A1 (ja) * | 2015-12-15 | 2017-06-22 | 千住金属工業株式会社 | 流体吐出装置および流体吐出方法 |
US10544040B2 (en) * | 2017-05-05 | 2020-01-28 | Dunan Microstaq, Inc. | Method and structure for preventing solder flow into a MEMS pressure port during MEMS die attachment |
US10937735B2 (en) * | 2018-09-20 | 2021-03-02 | International Business Machines Corporation | Hybrid under-bump metallization component |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4934309A (en) | 1988-04-15 | 1990-06-19 | International Business Machines Corporation | Solder deposition system |
US4898117A (en) | 1988-04-15 | 1990-02-06 | International Business Machines Corporation | Solder deposition system |
JP3731842B2 (ja) * | 1997-07-23 | 2006-01-05 | 松下電器産業株式会社 | 半田供給方法および半田供給装置 |
JP3430910B2 (ja) * | 1998-03-20 | 2003-07-28 | 松下電器産業株式会社 | 半田バンプ形成用のクリーム半田印刷装置および半田バンプ形成方法 |
JP2003011322A (ja) * | 2001-07-04 | 2003-01-15 | Hitachi Industries Co Ltd | 印刷機 |
JP2003182025A (ja) * | 2001-12-17 | 2003-07-03 | Sony Corp | スキージ構造体およびはんだ印刷機 |
JP4959352B2 (ja) * | 2007-01-23 | 2012-06-20 | キヤノンマシナリー株式会社 | 半田供給装置および半田供給方法 |
KR20090087191A (ko) * | 2008-02-12 | 2009-08-17 | 삼성전기주식회사 | 인쇄장치 및 인쇄방법 |
JP2012104630A (ja) * | 2010-11-10 | 2012-05-31 | Panasonic Corp | ペースト供給装置及びペースト供給方法 |
TWI552824B (zh) | 2011-10-18 | 2016-10-11 | 千住金屬工業股份有限公司 | 焊料凸塊形成方法及裝置 |
JP2013171862A (ja) * | 2012-02-17 | 2013-09-02 | Tokyo Electron Ltd | 金属ペースト充填方法及び金属ペースト充填装置及びビアプラグ作製方法 |
JP2014157863A (ja) * | 2013-02-14 | 2014-08-28 | Tokyo Electron Ltd | 金属ペースト充填方法及び金属ペースト充填装置 |
JP6355407B2 (ja) * | 2014-04-24 | 2018-07-11 | 三菱電機株式会社 | 溶融はんだ供給装置 |
-
2016
- 2016-12-15 WO PCT/JP2016/087372 patent/WO2017104746A1/ja active Application Filing
- 2016-12-15 JP JP2017556440A patent/JPWO2017104746A1/ja active Pending
- 2016-12-15 TW TW105141594A patent/TWI698970B/zh active
- 2016-12-15 EP EP16875723.5A patent/EP3401951A4/en active Pending
- 2016-12-15 US US16/062,853 patent/US10681822B2/en active Active
- 2016-12-15 CN CN201680081870.3A patent/CN108713246B/zh active Active
- 2016-12-15 KR KR1020187020101A patent/KR102689385B1/ko active IP Right Grant
-
2020
- 2020-04-06 JP JP2020068129A patent/JP7017020B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
EP3401951A1 (en) | 2018-11-14 |
JP7017020B2 (ja) | 2022-02-08 |
KR102689385B1 (ko) | 2024-07-30 |
US10681822B2 (en) | 2020-06-09 |
WO2017104746A1 (ja) | 2017-06-22 |
TW201727855A (zh) | 2017-08-01 |
KR20180095864A (ko) | 2018-08-28 |
EP3401951A4 (en) | 2019-10-30 |
CN108713246B (zh) | 2022-04-29 |
TWI698970B (zh) | 2020-07-11 |
JP2020115574A (ja) | 2020-07-30 |
US20190132960A1 (en) | 2019-05-02 |
CN108713246A (zh) | 2018-10-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6205678B2 (ja) | 流体吐出装置、流体吐出方法、及び流体塗布装置 | |
US8297486B2 (en) | Bump printing apparatus and method of controlling the same | |
US7845539B1 (en) | Bump printing apparatus | |
JP7017020B2 (ja) | はんだバンプの修正方法 | |
JP6567290B2 (ja) | 基板処理装置、基板処理システム、及び基板処理方法 | |
JP2008060438A (ja) | 電子部品実装装置および電子部品実装方法 | |
JP6687874B2 (ja) | 流体吐出装置および流体吐出方法 | |
JP2017109211A (ja) | 流体吐出方法および流体吐出装置 | |
JP5990775B2 (ja) | 電子部品実装システムおよび電子部品実装装置ならびに電子部品実装方法 | |
JP2013131630A (ja) | ハンダ印刷方法及びハンダ印刷装置 | |
JP4743059B2 (ja) | 電子部品実装システムおよび電子部品実装方法 | |
KR20110016657A (ko) | 기판 수용 지그 및 이를 포함하는 범프 인쇄장치 | |
JP2008072036A (ja) | 電子部品搭載装置および電子部品実装方法 | |
JP2009111263A (ja) | 電子部品のリワーク方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180628 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191016 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191016 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20191016 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20191101 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191106 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191218 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20200117 |