US10681822B2 - Method for correcting solder bump - Google Patents

Method for correcting solder bump Download PDF

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Publication number
US10681822B2
US10681822B2 US16/062,853 US201616062853A US10681822B2 US 10681822 B2 US10681822 B2 US 10681822B2 US 201616062853 A US201616062853 A US 201616062853A US 10681822 B2 US10681822 B2 US 10681822B2
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solder
mask
correction
fluid
solder bump
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US20190132960A1 (en
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Hideki Nakamura
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Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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Assigned to SENJU METAL INDUSTRY CO., LTD. reassignment SENJU METAL INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAKAMURA, HIDEKI
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1131—Manufacturing methods by local deposition of the material of the bump connector in liquid form
    • H01L2224/11312—Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Definitions

  • the present invention relates to a correction method where solder is additionally supplied to a portion having chipping and/or an insufficient amount of solder in solder bumps formed on a board or an electronic component workpiece such as a semiconductor.
  • solder or an adhesive agent is used to mount an electronic component, such as a semiconductor, on a printed circuit board of electronic equipment or to assemble an electronic component, such as a semiconductor. Particularly, soldering cannot be performed on an electronic component made of ceramic or the like without performing any treatment.
  • pads formed of a plating film are formed on a surface of an electronic component workpiece, and solder bumps (bulges) are formed on the pads. Thereafter, soldering is performed using the bumps.
  • solder paste is used as a method for forming solder bumps in many cases.
  • a solder paste is applied on a plating film of a workpiece by a printer or a dispenser and, thereafter, the solder paste is subjected to reflow heating so as to melt the solder paste to form bumps.
  • This method enables low cost.
  • on printing there is a lower limit on the separation at which printing can be performed and hence, bumps which correspond to a fine circuit pattern cannot be formed.
  • a so-called molten solder method As a method for forming bumps which can manage a fine circuit pattern at low cost, a so-called molten solder method has been attracting attention where molten solder is discharged so as to form solder bumps.
  • a solder deposition device disclosed in PTL 1 described below is known as a device for realizing the molten solder method.
  • a nozzle opening portion of a vessel which stores molten solder is caused to scan in the horizontal direction thus efficiently supplying molten solder to a plurality of portions.
  • a bump forming device is also known which includes a mechanism for lifting a nozzle head from a mask after the operation is finished and the nozzle head is cooled (for example, PTL 2 described below).
  • solder bumps on a workpiece such as a silicon wafer
  • the solder bumps are collectively formed on the entire workpiece or a portion of the workpiece in all methods which use a solder paste, solder balls, or molten solder.
  • a problem occurs in a solder bonding portion which is formed of the solder bumps.
  • a pattern formed on a silicon wafer is fine so that solder bumps formed on the silicon wafer are also fine. Accordingly, when a problem occurs, the problem cannot be corrected so that an entire silicon wafer forming a workpiece is discarded.
  • the present invention provides a method for correcting a solder bump when some of solder bumps formed on a silicon wafer have a defect and/or an insufficient amount of solder.
  • Inventors of the present invention have found the following. That is, when some of bumps have a defect and/or an insufficient amount of solder, a mask with the same pattern as the solder bumps is placed on the solder bumps so as to cover the solder bumps, and molten solder is caused to come into contact with the defective bumps through the mask. With such operations, a portion having a defect and/or an insufficient amount of solder is filled with the molten solder so that the solder bumps can be corrected.
  • a correction method for correcting a solder bump formed on a workpiece is provided.
  • a mask in which holes are formed with the same pattern as the solder bumps is placed so as to cover the solder bumps.
  • molten solder is caused to come into contact with the solder bumps through the mask so as to fill hole portions of the mask with the molten solder thus correcting the solder bumps formed on the silicon wafer.
  • some of the bumps have a defect and/or an insufficient amount of solder, by additionally supplying a solder to the above-mentioned some solder bumps, complete solder bumps can be acquired.
  • solder bumps which are manufactured by a method for forming a solder bump where a height control is difficult such as a method for forming a solder bump using a solder ball, to have a uniform height thus correcting heights of the bumps.
  • the mask used in this embodiment may be any mask in which hole portions are formed in the mask with the same pattern as the solder bumps and the mask has a constant thickness.
  • a heat-resistant resin film made of polyimide or the like may be used.
  • a mask which is directly formed on a silicon wafer using a resist may be also used for the purpose of correction.
  • a method for correcting a solder bump of this embodiment when some of bumps have a defect and/or an insufficient amount of solder, correction can be performed on a silicon wafer having the defective solder bumps. Accordingly, a silicon wafer which has been discarded conventionally can be used again thus realizing a large reduction in a material cost and a reduction in the number of steps.
  • the mask determines a height of solder bumps. Accordingly, this method can be also used for causing solder bumps which are manufactured by a method for forming a solder bump where a height control is difficult such as a method for forming a solder bump using a solder ball, to have a uniform height thus correcting heights of bumps. Accordingly, a conventional step where a preform or the like is additionally supplied to solder can be replaced with a step of this method.
  • FIG. 1 is a schematic view showing one example of a solder bump correction device used in one embodiment of the present invention.
  • FIG. 2 is a schematic view showing a schematic configuration of the correction device according to one embodiment of the present invention.
  • FIG. 3A is a schematic view showing a step of a method for correcting a solder bump according to one embodiment of the present invention.
  • FIG. 3B is a schematic view showing a step of the method for correcting a solder bump according to one embodiment of the present invention.
  • FIG. 3C is a schematic view showing a step of the method for correcting a solder bump according to one embodiment of the present invention.
  • FIG. 3D is a schematic view showing a step of the method for correcting a solder bump according to one embodiment of the present invention.
  • FIG. 1 is a view showing a head unit 1 of the correction device according to one embodiment of the present invention.
  • FIG. 2 is a schematic view showing a schematic configuration of the correction device according to one embodiment of the present invention.
  • the head unit 1 includes: a tank 2 which can store molten solder or the like; and a correction head 3 which is provided on a lower end of the head unit 1 .
  • a heating means may be mounted on the fluid tank 2 .
  • a heater 4 may be wound around a middle portion of the fluid tank 2 .
  • the correction head 3 has a correction nozzle 5 and a suction port 6 which are provided at a lower end of the head.
  • the suction port 6 is formed in the correction head 3 such that a suction step can be performed prior to a step performed by the correction nozzle 5 in the traveling direction.
  • a heater 4 may also be mounted on a lower end of the correction head 3 .
  • a circular shape, a slit shape or any other known shape may be adopted as the shape of a nozzle opening of the correction head 3 .
  • a slit shape as the shape of the nozzle opening
  • a fluid can be discharged to a plurality of discharge targets on a workpiece 7 simultaneously.
  • a circular shape, a slit shape or any other known shape may be adopted also as the shape of the suction port 6 formed in the correction head 3 .
  • air in a mask 8 can be simultaneously removed with respect to a plurality of portions on the workpiece 7 such as a silicon wafer or a printed circuit board.
  • the correction device is movable in the upward and downward direction (Y) such that the correction device approaches and separates from the electronic component workpiece 7 on which correction is required to be performed.
  • the correction device is movable also in the horizontal direction (X).
  • the mask 8 which is made of polyimide or a resist is placed on an upper portion of the workpiece 7 when necessary.
  • the correction head 3 descends to a position where the correction discharge nozzle 5 comes into contact with the workpiece 7 .
  • a downward pressure is applied to the correction head 3 from a point of time when the correction discharge nozzle 5 comes into contact with the workpiece 7 until a point of time when the correction discharge nozzle 5 moves away from the workpiece 7 .
  • the liquid correction head 3 moves horizontally while maintaining a contact state between the correction nozzle 5 and the workpiece 7 .
  • air in the mask 8 which is installed on the workpiece 7 , is sucked through the suction port 6 formed such that a suction step can be performed first in the traveling direction.
  • a fluid discharged into the mask 8 at an n-th discharge (excluding a first discharge) can be also sucked at this stage of operation.
  • the fluid is heated by the heater 4 installed at a lower portion of the correction head 3 thus allowing the fluid to be sucked.
  • the liquid correction head 3 moves horizontally, a fluid is discharged from the opening of the correction nozzle 5 so that the fluid is applied into the mask 8 on the workpiece 7 .
  • the liquid correction head 3 is raised so as to separate from the workpiece 7 .
  • the same step may be performed also in the case where the mask 8 is not used.
  • the correction device 1 includes the heater 4 for maintaining a fluid in the tank 2 at a desired temperature.
  • the heater 4 may be incorporated in a wall portion of the tank 2 .
  • the heater 4 is managed and controlled so as to be heated to an appropriate temperature for maintaining a viscosity of the fluid 9 in the tank 2 , such as molten solder, which is optimal for correction conditions.
  • the fluid discharge device 1 is connected to a pressure supply means 11 , which allows fluid communication, through an extension pipeline 10 from the tank 2 .
  • the fluid discharge device 1 is connected to a reduced pressure supply means 13 , which allows fluid communication, through a suction pipe extension pipeline 12 which continues from the suction port 6 .
  • the pressure supply means 11 includes a pressure generating source 14 which generates a nitrogen gas of a pressure of 0.06 to 0.1 MPa (not limited to such a value), for example.
  • the pressure generating source 14 supplies a pressure into the tank 2 through a gate valve 15 and a three-way valve 16 . Molten solder held in the tank 2 is injected from the opening of the correction nozzle 5 upon receiving a pressure from the pressure generating source 14 .
  • the reduced pressure supply means 13 includes a micro ejector 16 which is a reduced pressure generating device.
  • the reduced pressure generating device 16 is connected to a pressure generating source 19 , which generates a nitrogen gas of a pressure of 0.4 MPa (not limited to such a value), through a regulator 17 and a throttle valve 18 , for example.
  • the reduced pressure generating device 16 supplies a negative pressure to the suction port 6 through the suction pipe extension pipeline 12 .
  • the correction device includes a pressure sensor 20 and a controller 21 .
  • the pressure sensor 20 is connected to the throttle valve 18 disposed in the extension pipeline 17 , which allows fluid communication with the inside of the tank 2 , and the pressure sensor 20 monitors a pressure in the tank 2 .
  • a signal indicating a pressure in the tank 2 is transmitted to the controller 21 from the pressure sensor 20 .
  • the controller 21 operates the pressure generating source 14 , the reduced pressure generating device 16 , the regulator 17 , the pressure generating source 19 and the respective valves according to the progress of the operating steps so as to supply a pressure into the tank 2 .
  • An appropriate value of pressure required to be supplied is determined based on a signal from the pressure sensor 20 .
  • a magnitude of positive pressure to be supplied into the tank 2 can be varied by adjusting, by the controller 21 , a value of pressure generated by the pressure generating source 14 , for example.
  • a value of pressure may be varied by adjusting a regulating valve (not shown in the drawing) disposed on the pressure supply means 11 using the controller 21 .
  • a mask is placed so as to cover portions to be corrected of the workpiece 7 as needed.
  • a seat-like polyimide seat is used. Hole portions are formed in the seat at the same positions as the portions to be corrected. After positions of the portions to be corrected and positions of the hole portions are aligned, the mask, which is placed so as to cover the portions to be corrected, is fixed.
  • the correction head 1 of the correction device is mounted on the workpiece, and a correction step starts.
  • the correction head 1 is fixed at a predetermined position separated from the workpiece 7 .
  • the correction head 1 moves in the upward and downward direction as well as in the horizontal direction so that the correction head 1 descends to the position where the correction head 1 comes into contact with a discharge portion of the mask 8 on the workpiece 7 .
  • a pressure is always applied to the correction head 1 of the correction device so that the correction discharge nozzle 5 is in contact with the workpiece 7 when the correction head 3 descends.
  • the correction head 3 moves slidingly on the mask 8 on the workpiece 7 such that the correction head 1 moves horizontally so that the side where the suction nozzle 5 is provided is located forward and reduces a pressure of air in an opening portion of the mask 8 on the workpiece 7 and, thereafter, the mask 8 comes into contact with heated molten solder in the tank 2 through the correction nozzle 5 .
  • a pressure supplied from the pressure generating source 14 supplies a positive pressure into the tank 2 through the gate valve 15 .
  • the molten solder 9 held in the tank 2 comes into contact with a solder bump of the workpiece at an opening of the discharge nozzle 5 upon receiving a pressure from the pressure generating source 14 .
  • portions where a solder bump is lacked are filled with molten solder (see FIG. 3C ), thus completing solder bumps (see FIG. 3D ).
  • the mask adjusts an amount of molten solder and hence, there is no possibility of molten solder adhering to a solder bump by an amount greater than an amount of contents of the mask. Therefore, the solder bump before the correction is performed is maintained as it is. Causing the correction head 1 to move on the workpiece one time allows the correction of solder bumps to be completed. After switching a pressure to be supplied into the tank 2 to a negative pressure generated by a reduced pressure generating device 16 , the correction head 1 is elevated. After cooling is performed, the mask 8 is removed from the workpiece 7 .

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
US16/062,853 2015-12-15 2016-12-15 Method for correcting solder bump Active US10681822B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015244142 2015-12-15
JP2015-244142 2015-12-15
PCT/JP2016/087372 WO2017104746A1 (ja) 2015-12-15 2016-12-15 はんだバンプの修正方法

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US20190132960A1 US20190132960A1 (en) 2019-05-02
US10681822B2 true US10681822B2 (en) 2020-06-09

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US (1) US10681822B2 (ja)
EP (1) EP3401951A4 (ja)
JP (2) JPWO2017104746A1 (ja)
KR (1) KR20180095864A (ja)
CN (1) CN108713246B (ja)
TW (1) TWI698970B (ja)
WO (1) WO2017104746A1 (ja)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
US11259415B2 (en) * 2015-12-15 2022-02-22 Senju Metal Industry Co., Ltd. Method for discharging fluid

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Publication number Priority date Publication date Assignee Title
US10544040B2 (en) * 2017-05-05 2020-01-28 Dunan Microstaq, Inc. Method and structure for preventing solder flow into a MEMS pressure port during MEMS die attachment
US10937735B2 (en) 2018-09-20 2021-03-02 International Business Machines Corporation Hybrid under-bump metallization component

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JPH0215698A (ja) 1988-04-15 1990-01-19 Internatl Business Mach Corp <Ibm> はんだ付着装置
US4934309A (en) 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
JPH1140937A (ja) * 1997-07-23 1999-02-12 Matsushita Electric Ind Co Ltd 半田供給方法および半田供給装置
JPH11274706A (ja) 1998-03-20 1999-10-08 Matsushita Electric Ind Co Ltd 半田バンプ形成用のクリーム半田印刷装置および半田バンプ形成方法
JP2003182025A (ja) 2001-12-17 2003-07-03 Sony Corp スキージ構造体およびはんだ印刷機
WO2013058299A1 (ja) 2011-10-18 2013-04-25 千住金属工業株式会社 はんだバンプ形成方法および装置
JP2014157863A (ja) 2013-02-14 2014-08-28 Tokyo Electron Ltd 金属ペースト充填方法及び金属ペースト充填装置

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EP3401951A1 (en) 2018-11-14
EP3401951A4 (en) 2019-10-30
WO2017104746A1 (ja) 2017-06-22
TW201727855A (zh) 2017-08-01
TWI698970B (zh) 2020-07-11
CN108713246B (zh) 2022-04-29
CN108713246A (zh) 2018-10-26
US20190132960A1 (en) 2019-05-02
JP2020115574A (ja) 2020-07-30
JPWO2017104746A1 (ja) 2018-11-08
JP7017020B2 (ja) 2022-02-08

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