WO2013058299A1 - はんだバンプ形成方法および装置 - Google Patents
はんだバンプ形成方法および装置 Download PDFInfo
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- WO2013058299A1 WO2013058299A1 PCT/JP2012/076889 JP2012076889W WO2013058299A1 WO 2013058299 A1 WO2013058299 A1 WO 2013058299A1 JP 2012076889 W JP2012076889 W JP 2012076889W WO 2013058299 A1 WO2013058299 A1 WO 2013058299A1
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- WIPO (PCT)
- Prior art keywords
- component
- injection head
- solder
- molten solder
- heater unit
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/2015—Means for forcing the molten metal into the die
- B22D17/2023—Nozzles or shot sleeves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1131—Manufacturing methods by local deposition of the material of the bump connector in liquid form
- H01L2224/11312—Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1131—Manufacturing methods by local deposition of the material of the bump connector in liquid form
- H01L2224/1132—Screen printing, i.e. using a stencil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/118—Post-treatment of the bump connector
- H01L2224/11848—Thermal treatments, e.g. annealing, controlled cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Definitions
- the present invention relates to a method and apparatus for forming solder bumps on components such as substrates and electronic components.
- Boards and electronic parts made of ceramics cannot be soldered as they are. Therefore, a pad made of a plating film is provided on the surface of the substrate and the electronic component, and a solder bump is formed on the pad. Thereafter, soldering is performed via bumps.
- solder paste is often used as a solder bump forming method. After applying the solder paste onto the plating film of the electronic component with a printer or dispenser, the solder paste is melted by reflow heating to form bumps. Similarly, bumps can be formed on the substrate. This method is inexpensive. However, bumps corresponding to fine circuit patterns cannot be formed.
- solder balls There is also a bump formation method using solder balls.
- a fine solder ball is mounted on a pad of an electronic component or a substrate, and bumps are formed by reflow heating this. This method can form bumps corresponding to fine circuit patterns.
- the cost of the solder ball itself is high, the overall cost is high.
- IMS injection Molded Solder
- a required amount of molten solder is dropped onto a device in a non-oxidizing atmosphere from a nozzle opening of a container containing molten solder (Japanese Patent Laid-Open No. 54-82341).
- a slit is provided in a nozzle head made of a flexible material, and this is used as a nozzle.
- a controlled inert gas pressure to the molten solder inside the nozzle head, the molten solder is discharged from the nozzle to form a conductor pattern.
- a necessary amount of molten solder is supplied through an opening of a mask having a corresponding opening pattern (Japanese Patent Laid-Open No. 11-040937).
- JP 54-083341 A JP-A-2-015698 Japanese Patent Laid-Open No. 11-040937
- the amount of molten solder dripped is controlled by the amount of variation in the gap between the tapered tip end of the rod (stopper) passing through the nozzle opening and the nozzle opening.
- it is difficult to repeatedly reproduce a constant supply amount. It is also difficult to supply a fine amount of molten solder.
- the molten solder is supplied to the substrate by filling the opening of the mask with molten solder.
- no measures have been taken with respect to the treatment of excess molten solder. That is, when the nozzle head is lifted from the mask after work, there is a possibility that the molten solder already discharged from the slit nozzle is simultaneously lifted and scattered. Further, the molten solder inside the nozzle head may be newly leaked by being pulled by the molten solder that has already been discharged. Furthermore, a gap is formed between the mask and the substrate by the force when lifting the nozzle head from the mask, and there is a possibility that unsolidified molten solder flows there. Either can cause unwanted bridges.
- an object of the present invention is to provide a solder bump forming method and apparatus that can form a small amount of solder bumps and that does not cause the occurrence of bridging due to excess molten solder.
- a solder bump forming method A component on which solder bumps are to be formed on the upper surface, and a component having a mask having an opening at a position corresponding to the position on which the bumps are to be formed are carried onto a work stage; , Preheating the component with a first heater unit; A step of lowering an injection head that is capable of supplying molten solder contained therein from a lower nozzle to be brought into contact with the upper surface of the mask disposed on the component; Bringing the upper surface of the second heater unit into contact with the lower surface of the component and heating the component that has already been preheated to its working temperature; Heating the solder in the injection head to its working temperature by a third heater unit; While the injection head slides on the mask, the molten solder raised to the working temperature is discharged from the nozzle to flow into the opening of the mask and scrapes excess molten solder on the upper surface of the mask.
- the component, and the mask Forcibly cooling the injection head by heat transfer through the step of lowering the temperature of the molten solder inside the injection head to a temperature at which the molten solder does not sag from the nozzle; After the temperature of the molten solder inside the injection head has dropped to a temperature at which the molten solder does not sag from the nozzle, the injection head is raised and separated from the mask; Forcibly cooling the molten solder supplied onto the component by the second cooling unit to solidify the bumps; Unloading the component having the bump formed on the upper surface from the work stage; A method for forming a solder bump is provided.
- the work stage is cyclically movable between the first to fourth index positions;
- the step of carrying the component onto the work stage is performed at a first index position, Preheating the component is performed at a second index position;
- Contacting the top surface of the mask with the injection head heating the component to its working temperature, heating the solder in the injection head to its working temperature, and molten solder in the injection head Supplying onto the element, stopping the operation of the second heater unit and the third heater unit, cooling the injection head to lower the temperature of the molten solder inside the injection head, and
- the step of raising the injection head away from the mask is performed at the third index position,
- the step of cooling the molten solder on the component to solidify the bumps is performed at a fourth index position;
- the step of unloading the component having the bump formed on the upper surface from the work stage may be performed at the first index position.
- the mask may be a metal or resin sheet member or a resist film.
- the step of cooling the injection head to lower the temperature of the molten solder inside the injection head may include blowing an inert gas to the injection head.
- a solder bump forming device A work stage for placing a component disposed on the upper surface with a mask having an opening at a position corresponding to a position where the bump is to be formed as a component on which a solder bump is to be formed on the upper surface; A heater unit for heating the component in direct or indirect contact with the lower surface of the component; An injection head that can accommodate molten solder inside and has a nozzle at the bottom, and is ejected from the nozzle by horizontally moving the nozzle in contact with the upper surface of the mask on the component.
- An injection head that fills the opening of the mask with molten molten solder, thereby supplying a predetermined amount of molten solder onto the component;
- a first cooling unit that can selectively come into contact with the lower surface of the heater unit after the operation is stopped, and supplies the heater unit and molten solder when contacting the lower surface of the heater unit after the operation is stopped.
- a first cooling unit capable of forcibly cooling the injection head through the component and the mask, A solder bump forming apparatus is also provided.
- the heater unit includes a first heater unit for preheating the component by directly or indirectly contacting the lower surface of the component, and a lower surface of the component instead of the first heater unit.
- a second heater unit for direct or indirect contact to heat the component further to the working temperature.
- the solder bump forming apparatus is configured to replace the second heater unit and the first cooling unit directly or indirectly in contact with the lower surface of the component and supply the component supplied with molten solder.
- a second cooling unit capable of forced cooling can be further provided.
- the solder bump forming apparatus can further include a work stage transfer device.
- the work stages are first to fourth work stages supported by the work stage transfer device, and are spaced apart from each other at an angle of 90 degrees around the rotation axis of the work stage transfer device.
- First to fourth work stages may be included.
- the work stage transfer device intermittently suspends the first to fourth work stages so that each of the first to fourth work stages occupies one of the fixed first to fourth index positions in turn. Can be rotated.
- the solder bump forming apparatus can further include a supply stage for carrying the component in and out from the work stage positioned at the first index position.
- the first heater unit is disposed at the second index position, and the second heater unit, the injection head, and the first cooling unit are disposed at the third index position. Then, the second cooling unit may be arranged at the fourth index position.
- a mask having an opening at a position corresponding to a position where a bump is to be formed is disposed on the upper surface of a component such as a substrate and an electronic component.
- the injection head that is in contact with the mask on the component is forcibly cooled by the cooling unit, so that the molten solder drips from the injection head when the injection head is raised. Can be prevented. Further, during this forced cooling, the molten solder supplied onto the component is naturally forcedly cooled, so that the possibility that these solders form a bridge is extremely low.
- FIG. 3 is a top view of the work stage transfer device as in FIG. (A) is a top view of the work stage transfer device rotated by 1/4, and (b) is a side view of the work stage transfer device at that time as viewed from the second index position side together with the first heater unit.
- (A) is a top view of the work stage transfer device further rotated by 1 ⁇ 4, and (b) shows the work stage transfer device at that time together with the injection head, the second heater unit, and the first cooling unit.
- (A) is a top view of the work stage transfer device further rotated by 1 ⁇ 4, and (b) is a side view of the work stage transfer device at that time viewed from the third index position side together with the second cooling unit.
- FIG. 1 is a block diagram showing each step of a solder bump forming method according to the present invention.
- the component is typically a substrate, an electronic component, or the like on which solder bumps are to be formed.
- the component may include a support member (jig) such as a base or a frame for supporting the substrate and the electronic component.
- the support member can support a plurality of substrates and electronic components.
- the board and the electronic component may have a conductive pad at a place where a solder bump is to be formed.
- a mask having an opening at a position corresponding to a solder bump formation location is arranged.
- the mask may be a metal or resin sheet member or a resist film.
- step 2 the components are preheated. For example, when lead-free solder having a melting point of 220 ° C. is used, preheating is performed until the component reaches 190 ° C.
- step 3 the injection head that accommodates the solder descends, and the nozzle of the injection head contacts the surface of the mask.
- the solder in the injection head has already been heated to a standby temperature (for example, 190 ° C.).
- step 4 the component is heated to the working temperature.
- a lead-free solder having a melting point of 220 ° C. is used, it is heated to 230 ° C.
- step 5 the solder in the injection head is heated to a working temperature (for example, 230 ° C.).
- the heated molten solder in the injection head receives a predetermined pressure and has a viscosity that can be discharged from the nozzle.
- step 6 the injection head in a state where the nozzle is in contact with the mask on the component discharges the molten solder from the nozzle while sliding horizontally on the mask.
- the discharge of the molten solder from the nozzle may be performed by applying an inert gas such as pressurized nitrogen gas to the molten solder in the injection head.
- the molten solder discharged from the nozzle flows into an opening provided in the mask.
- surplus molten solder on the mask is scraped off by the horizontally moving injection head.
- step 7 the supply of the discharge pressure applied to the molten solder in the injection nozzle is stopped, and the supply of the molten solder is also stopped. Thereafter, the operation of the heater that has heated the substrate and the heater that has heated the injection nozzle is stopped.
- step 8 the injection head is forcibly cooled.
- This forced cooling is performed using a cooling unit through a heater for heating the component (already stopped), the component and the mask. Further, forcible cooling may be supported by blowing an inert gas such as nitrogen gas to the injection head.
- the forced cooling is performed until the molten solder inside the injection head falls to a temperature at which it does not sag from the nozzle. The temperature required to prevent dripping will vary depending on the opening degree and form of the nozzle. Since forced cooling of the injection nozzle is performed via the component, the solder for bump formation supplied on the component is also cooled.
- step 9 the forcedly cooled injection head is raised and separated from the mask. At this time, the temperature of the molten solder inside the injection head is sufficiently lowered, and the molten solder does not sag from the nozzle. Also, the solder on the component does not form an undesirable bridge.
- step 10 the molten solder supplied onto the component is forcibly cooled to promote solidification and form solder bumps.
- step 11 the component on which the bump is formed is unloaded from the work stage.
- solder bump forming method described above can be implemented in the solder bump forming apparatus according to the present invention in which the work element stage moves cyclically between the first to fourth index positions.
- the step 1 is performed at a first index position
- the step 2 is performed at a second index position
- the steps 3 to 9 are performed at a third index position
- Step 10 may be performed at the fourth index position
- step 11 may be performed at the first index position.
- FIG. 2A is a top view of the work stage transfer device 1 of the solder bump forming apparatus
- FIG. 2B is a side view of the same.
- the apparatus 1 includes four work stages 3 a to 3 d attached to a central support plate 2.
- the central support plate 2 is supported by a shaft 4 so as to be rotatable and vertically movable.
- Each of the work stages 3a to 3d moves cyclically counterclockwise as viewed in FIG. 2 so as to sequentially occupy the fixed first to fourth index positions 5a to 5d.
- a column member 7 disposed on the base 6 and accommodating the shaft 4 incorporates a mechanism for rotating the shaft and a mechanism for moving the shaft 4 up and down.
- Step 1 of the solder bump forming method is performed in a state where the work stage 3a is at the index position 5a.
- the substrate 8 on which solder bumps are to be formed is transferred from the supply stage 9 onto the work stage 3a with a mask (not shown) disposed on the upper surface.
- the substrate 8 may be an electronic component.
- substrate or the electronic component may be supported by support members, such as a stand and a flame
- the substrate or the electronic component is a “component” in the appended claims, alone or together with the support member.
- step 11 is performed prior to step 1 at the first index position 5a. That is, the substrate on which the solder bumps are already formed is transferred from the work stage 3a onto the supply stage 9 and transferred to the next process, and then step 1 is performed.
- FIG. 4A shows a state where the work stage 3a is positioned at the second index position 5b.
- FIG. 4B is a side view of the work stage transfer device 1 at this time as viewed from the second index position 5b side.
- Step 2 is performed at the second index position 5b.
- the solder bump forming apparatus includes a heater unit (first heater unit) 10 fixedly disposed at the second index position 5b.
- the work stage 3a When the work stage 3a is positioned at the second index position 5b, the work stage 3a is lowered together with the other work stages 3b to 3d attached to the central support plate 2 by the up and down movement of the work stage transfer device 1.
- the lower surface of the stage 3 a is in contact with the upper surface of the fixed heater unit 10.
- the heater unit 10 is always maintained at a temperature of, for example, 190 degrees C.
- the substrate 8 is preheated to 190 ° C. by the heater unit 10, for example.
- the contact with the substrate 8 and heat transfer may be performed through the support member. Further, the contact with the substrate 8 and heat transfer may be performed via a part of members constituting the work stage.
- step 2 is being performed at the second index position 5b, at the first index 5a, step 11 is performed on the substrate on which solder bumps have already been formed, and step 1 is performed on a new substrate. Has been done.
- the respective steps are executed at other index positions (third index position 5c and fourth index position 5d) (described later).
- FIG. 5A shows a state in which the work stage 3a is positioned at the third index position 5c.
- FIG. 5B is a side view of the work stage transfer device 1 at this time as viewed from the second index position 5b side. At the third index position 5c, steps 3 to 9 are executed.
- the solder bump forming apparatus includes an injection head 11, a fixed heater unit (second heater unit) 12, and a cooling unit (second cooling unit) 13 provided at the third index position 5c.
- the injection head 11 is disposed above the work stage transfer device 1, can move up and down, and can slide in the horizontal direction.
- the injection head 11 incorporates a heater unit 14 (third heater unit), and can accommodate the molten solder 15 therein. When pressure is applied to the molten solder 15 in the injection head 11, the molten solder 15 can be discharged from the nozzle 16 below the injection head 11.
- the heater unit 12 is fixedly disposed below the work stage transfer device 1.
- the cooling unit 13 is disposed below the heater unit 12 and can move up and down.
- the work stage 3a When the work stage 3a is positioned at the third index 5c, the work stage 3a is lowered together with the other work stages by the vertical movement of the work stage transfer device 1, and the lower surface of the substrate 8 comes into contact with the upper surface of the fixed heater unit 12. .
- the injection head 11 is lowered and comes into contact with a mask disposed on the substrate 8 (step 3).
- the substrate 8 that has already been preheated is further heated by the fixed heater unit 12 (step 4).
- the fixed heater unit 12 may always maintain a temperature of 230 degrees C.
- the substrate 8 is heated to its working temperature, for example, 230 degrees C. by the fixed heater unit 12.
- the solder 15 in the injection head 11 is also heated to its working temperature, for example, 230 ° C. by the internal heater unit 14 (step 5).
- the molten solder in the injection head 11 may be heated to a temperature of about 190 ° C. in advance.
- both the substrate 8 and the molten solder 15 are heated to a set heating temperature (for example, 230 ° C.), the injection head 11 starts to slide in the horizontal direction on the mask disposed on the substrate 8, and at the same time, the injection The pressure of an inert gas (for example, nitrogen gas) is applied to the molten solder 15 inside the head 11.
- the molten solder 15 to which pressure is applied is discharged from the nozzle 16.
- the nozzle may be a slit nozzle formed in a flexible elastic material such as silicon rubber.
- the injection head 11 causes the discharged molten solder to flow into an opening provided in the mask while sliding horizontally on the mask. At the same time, the sliding injection head 11 performs an operation of scraping excess molten solder discharged onto the upper surface of the mask. By these operations, molten solder is filled into the opening of the mask (step 6). Since the opening of the mask is provided at a position corresponding to “the place where the solder bump is to be formed on the substrate 8”, the molten solder filled in the opening of the mask is “supplied on the substrate 8. , A predetermined amount of molten solder for forming solder bumps.
- step 8 the cooling unit 13 is raised, and the upper surface of the cooling unit 13 is brought into contact with the lower surface of the fixed heater unit 12 whose operation has already been stopped (step 8).
- the main purpose of this step 8 is to forcibly cool the injection head 11 and eventually the molten solder 15 in the injection head 11, and even if the injection head 11 is lifted and separated from the mask, the molten solder does not drop from the nozzle 16.
- the temperature is lowered to such a temperature.
- the slit nozzle as described above is employed, the molten solder in the injection head 11 is not likely to sag when the temperature reaches 190 ° C. or less.
- the cooling unit 13 may keep a predetermined standby temperature in advance.
- the forced cooling of the injection head 11 in step 8 is performed via the fixed heater unit 12 whose operation has been stopped.
- Another method is also conceivable in which the heater unit 12 is shifted laterally so that the cooling unit 13 directly contacts the substrate 8.
- the work time at other index positions in particular, the work time required for step 1 and step 11 (substrate loading and unloading) at the first index position 5a exceeds the total work time at the third index position 5c.
- the injection head 11 is cooled in step 8 through the substrate 8 and the mask, the molten solder supplied to the substrate 8 is also cooled at the same time. Therefore, after the temperature of the molten solder 15 inside the injection head 11 has dropped to a temperature at which the molten solder 15 does not sag from the nozzle 16, the injection head 11 is raised and separated from the mask (step 9). There is no concern that the solder on the substrate 8 forms an undesirable bridge in the molten state.
- the cooling unit 13 is lowered. After the cooling unit 13 is lowered and separated from the fixed heater unit 12, the fixed heater unit 12 is actuated again to reach a standby temperature. The heater unit 14 of the injection head 11 also operates again, and raises the solder in the injection head 11 to the standby temperature. The injection head 11 can move to the home position and stand by.
- the work stage transfer device 1 raises the work stages 3a to 3d on the condition that the work at the other index positions 5a, 5b, and 5d has been completed, and further 1 / Rotate 4 times.
- FIG. 6A shows a state where the work stage 3a is positioned at the fourth index position 5d.
- FIG. 6B is a side view of the work stage transfer device 1 at this time as viewed from the third index position 5c side.
- the solder bump forming apparatus includes a cooling unit (second cooling unit) 17 fixedly arranged at the fourth index position 5d.
- the cooling unit 17 is located below the work stage 3a positioned at the fourth index position 5d.
- the molten solder supplied onto the substrate 8 at step 6 at the third index position 5c is completely cooled and solidified by the cooling unit 17 to form solder bumps on the substrate 8 (step 10). For example, when the substrate 8 reaches 50 ° C., it can be considered that the substrate 8 is completely cooled.
- step 10 the work stage transfer device 1 raises the work stages 3a to 3d on the condition that the work at the other index positions 5a, 5b, and 5c is finished, and further 1 ⁇ 4. Rotate. In this way, the work stage 3a returns to the first index position 5a again.
- the substrate 8 on which solder bumps have already been formed is carried out from the work stage 3a onto the supply stage 9 (step 11). After the substrate 8 is transferred from the supply stage 9 to the next process, step 1 is executed as described above.
- the operation cycle of the work stage transfer apparatus 1 that cyclically rotates the work stages 3a to 3d by a quarter is determined by the longest work time performed at any index position. At the index position where the work has already been completed, when the work at any of the other index positions has not been completed, the standby state is taken.
- an embodiment of the solder bump forming device disclosed in the present specification and drawings includes an injection head 11, heater units 10, 12, 14, and cooling units 13, 17.
- 1 Work stage transfer device 2 Central support plate, 3a-3d work stage, 4 axis, 5a-5d index position, 6 base, 7 pillar member, 8 substrate, 9 supply stage, 10 1st heater unit, 11 injection head , 12 second heater unit, 13 first cooling unit, 14 third heater unit, 15 molten solder, 16 nozzles, 17 second cooling unit.
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- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
はんだバンプ形成方法であって、
上面にはんだバンプを形成されるべき構成要素であって、バンプを形成すべき位置に対応する位置に開口を有するマスクをその上面に配置された構成要素を、作業ステージ上へと搬入するステップと、
第1のヒータユニットにより前記構成要素を予備加熱するステップと、
インジェクションヘッドにして、内部に収容する溶融はんだを下部のノズルから供給可能となされたインジェクションヘッドを降下させ、前記構成要素上に配置された前記マスクの上面に接触させるステップと、
第2のヒータユニットの上面と、前記構成要素の下面とを接触させ、既に予備加熱されている前記構成要素をその作業温度まで加熱するステップと、
第3のヒータユニットにより、前記インジェクションヘッド内のはんだをその作業温度まで加熱するステップと、
前記インジェクションヘッドが、前記マスク上をスライドしながら、作業温度にまで高められた溶融はんだを前記ノズルから吐出して前記マスクの前記開口内に流動させるとともに、前記マスクの上面の余剰溶融はんだを掻き取ることにより、前記マスクの前記開口内に溶融はんだを充填し、それによって前記構成要素上に所定量の溶融はんだを供給するステップと、
前記インジェクションヘッドによる溶融はんだの供給が終了した後、前記第2のヒータユニットおよび第3のヒータユニットの作動を停止させるステップと、
第1の冷却用ユニットの上面と、既に作動を停止された前記第2のヒータユニットの下面とを接触させ、前記第1の冷却用ユニットから前記第2のヒータユニット、前記構成要素および前記マスクを介した伝熱により前記インジェクションヘッドを強制冷却し、該インジェクションヘッド内部の溶融はんだの温度を、溶融はんだが前記ノズルから垂れ落ちない温度にまで降下させるステップと、
前記インジェクションヘッド内部の溶融はんだの温度が、溶融はんだが前記ノズルから垂れ落ちない温度にまで降下した後、前記インジェクションヘッドを上昇させて前記マスクから離すステップと、
第2の冷却用ユニットにより、前記構成要素上に供給された溶融はんだを強制冷却してバンプを固化させるステップと、
上面にバンプを形成された前記構成要素を前記作業ステージ上から搬出するステップと、
を備える、はんだバンプ形成方法が提供される。
前記作業ステージが第1ないし第4のインデックス位置間をサイクリッックに移動可能であり、
前記構成要素を前記作業ステージ上へと搬入するステップは第1のインデックス位置で行われ、
前記構成要素を予備加熱するステップは第2のインデックス位置で行われ、
前記インジェクションヘッドを前記マスクの上面に接触させるステップ、前記構成要素をその作業温度まで加熱するステップ、前記インジェクションヘッド内のはんだをその作業温度まで加熱するステップ、前記インジェクションヘッド内の溶融はんだを前記構成要素上に供給するステップ、前記第2のヒータユニットおよび第3のヒータユニットの作動を停止させるステップ、前記インジェクションヘッドを冷却して該インジェクションヘッド内部の溶融はんだの温度を降下させるステップ、および、前記インジェクションヘッドを上昇させて前記マスクから離すステップは第3のインデックス位置で行われ、
前記構成要素上の溶融はんだを冷却してバンプを固化させるステップは第4のインデックス位置で行われ、
上面にバンプを形成された前記構成要素を前記作業ステージ上から搬出するステップは第1のインデックス位置で行われる、ようにすることができる。
前記マスクは金属製または樹脂製のシート部材としてもよいし、レジストフィルムとしてもよい。
前記インジェクションヘッドを冷却して該インジェクションヘッド内部の溶融はんだの温度を降下させるステップが、不活性ガスを前記インジェクションヘッドに吹き付けることを含むようにしてもよい。
はんだバンプ形成装置であって、
上面にはんだバンプを形成されるべき構成要素にして、バンプを形成すべき位置に対応する位置に開口を有するマスクをその上面に配置された構成要素を乗せるための作業ステージと、
前記構成要素の下面に直接または間接的に接触して前記構成要素を加熱するためのヒータユニットと、
内部に溶融はんだを収容可能であり、且つ、下部にノズルを有するインジェクションヘッドであって、前記構成要素上の前記マスクの上面に前記ノズルを接触させたまま水平移動することにより、前記ノズルから吐出した溶融はんだを前記マスクの前記開口内に充填させ、それによって前記構成要素上に所定量の溶融はんだを供給するインジェクションヘッドと、
作動停止後の前記ヒータユニットの下面に選択的に接触可能な第1の冷却用ユニットであって、作動停止後の前記ヒータユニットの下面に接触したときに、該ヒータユニットと、溶融はんだを供給された前記構成要素と、前記マスクとを介して前記インジェクションヘッドを強制冷却可能な第1の冷却用ユニットと、
を備える、はんだバンプ形成装置も提供される。
Claims (9)
- はんだバンプ形成方法であって、
上面にはんだバンプを形成されるべき構成要素であって、バンプを形成すべき位置に対応する位置に開口を有するマスクをその上面に配置された構成要素を、作業ステージ上へと搬入するステップと、
第1のヒータユニットにより前記構成要素を予備加熱するステップと、
インジェクションヘッドにして、内部に収容する溶融はんだを下部のノズルから供給可能となされたインジェクションヘッドを降下させ、前記構成要素上に配置された前記マスクの上面に接触させるステップと、
第2のヒータユニットの上面と、前記構成要素の下面とを接触させ、既に予備加熱されている前記構成要素をその作業温度まで加熱するステップと、
第3のヒータユニットにより、前記インジェクションヘッド内のはんだをその作業温度まで加熱するステップと、
前記インジェクションヘッドが、前記マスク上をスライドしながら、作業温度にまで高められた溶融はんだを前記ノズルから吐出して前記マスクの前記開口内に流動させるとともに、前記マスクの上面の余剰溶融はんだを掻き取ることにより、前記マスクの前記開口内に溶融はんだを充填し、それによって前記構成要素上に所定量の溶融はんだを供給するステップと、
前記インジェクションヘッドによる溶融はんだの供給が終了した後、前記第2のヒータユニットおよび第3のヒータユニットの作動を停止させるステップと、
第1の冷却用ユニットの上面と、既に作動を停止された前記第2のヒータユニットの下面とを接触させ、前記第1の冷却用ユニットから前記第2のヒータユニット、前記構成要素および前記マスクを介した伝熱により前記インジェクションヘッドを強制冷却し、該インジェクションヘッド内部の溶融はんだの温度を、溶融はんだが前記ノズルから垂れ落ちない温度にまで降下させるステップと、
前記インジェクションヘッド内部の溶融はんだの温度が、溶融はんだが前記ノズルから垂れ落ちない温度にまで降下した後、前記インジェクションヘッドを上昇させて前記マスクから離すステップと、
第2の冷却用ユニットにより、前記構成要素上に供給された溶融はんだを強制冷却してバンプを固化させるステップと、
上面にバンプを形成された前記構成要素を前記作業ステージ上から搬出するステップと、
を備える、はんだバンプ形成方法。 - 請求項1に記載のはんだバンプ形成方法において、
前記作業ステージが第1ないし第4のインデックス位置間をサイクリッックに移動可能であり、
前記構成要素を前記作業ステージ上へと搬入するステップは第1のインデックス位置で行われ、
前記構成要素を予備加熱するステップは第2のインデックス位置で行われ、
前記インジェクションヘッドを前記マスクの上面に接触させるステップ、前記構成要素をその作業温度まで加熱するステップ、前記インジェクションヘッド内のはんだをその作業温度まで加熱するステップ、前記インジェクションヘッド内の溶融はんだを前記構成要素上に供給するステップ、前記第2のヒータユニットおよび第3のヒータユニットの作動を停止させるステップ、前記インジェクションヘッドを冷却して該インジェクションヘッド内部の溶融はんだの温度を降下させるステップ、および、前記インジェクションヘッドを上昇させて前記マスクから離すステップは第3のインデックス位置で行われ、
前記構成要素上の溶融はんだを冷却してバンプを固化させるステップは第4のインデックス位置で行われ、
上面にバンプを形成された前記構成要素を前記作業ステージ上から搬出するステップは第1のインデックス位置で行われる、
はんだバンプ形成方法。 - 請求項2に記載のはんだバンプ形成方法において、
前記マスクが金属製または樹脂製のシート部材である、
はんだバンプ形成方法。 - 請求項2に記載のはんだバンプ形成方法において、
前記マスクがレジストフィルムである、
はんだバンプ形成方法。 - 請求項2に記載のはんだバンプ形成方法において、
前記インジェクションヘッドを冷却して該インジェクションヘッド内部の溶融はんだの温度を降下させるステップが、不活性ガスを前記インジェクションヘッドに吹き付けることを含む、
はんだバンプ形成方法。 - はんだバンプ形成装置であって、
上面にはんだバンプを形成されるべき構成要素にして、バンプを形成すべき位置に対応する位置に開口を有するマスクをその上面に配置された構成要素を乗せるための作業ステージと、
前記構成要素の下面に直接または間接的に接触して前記構成要素を加熱するためのヒータユニットと、
内部に溶融はんだを収容可能であり、且つ、下部にノズルを有するインジェクションヘッドであって、前記構成要素上の前記マスクの上面に前記ノズルを接触させたまま水平移動することにより、前記ノズルから吐出した溶融はんだを前記マスクの前記開口内に充填させ、それによって前記構成要素上に所定量の溶融はんだを供給するインジェクションヘッドと、
作動停止後の前記ヒータユニットの下面に選択的に接触可能な第1の冷却用ユニットであって、作動停止後の前記ヒータユニットの下面に接触したときに、該ヒータユニットと、溶融はんだを供給された前記構成要素と、前記マスクとを介して前記インジェクションヘッドを強制冷却可能な第1の冷却用ユニットと、
を備える、はんだバンプ形成装置。 - 前記ヒータユニットが、前記構成要素の下面に直接または間接的に接触して前記構成要素を予備加熱するための第1のヒータユニットと、該第1のヒータユニットに替わって前記構成要素の下面に直接または間接的に接触して前記構成要素をさらに作業温度にまで加熱するための第2のヒータユニットとを含んでおり、
前記第1の冷却用ユニットは、作動停止後の前記第2のヒータユニットの下面に接触したときに、該第2のヒータユニットと、溶融はんだを供給された前記構成要素と、前記マスクとを介して前記インジェクションヘッドを強制冷却するようになされており、
前記第2のヒータユニットおよび前記第1の冷却用ユニットに替わって前記構成要素の下面に直接または間接的に接触して、溶融はんだを供給された前記構成要素をさらに強制冷却可能な第2の冷却用ユニットをさらに備える、
請求項6に記載のはんだバンプ形成装置。 - さらに作業ステージ移送装置を備え、
前記作業ステージが、前記作業ステージ移送装置に支持された第1ないし第4の作業ステージにして、前記作業ステージ移送装置の回転軸の回りに互いに90度の角度をもって離間配置された第1ないし第4の作業ステージを含み、
前記作業ステージ移送装置は、前記第1ないし第4の作業ステージのそれぞれが、固定された第1ないし第4のインデックス位置を順次交代して占めるように前記第1ないし第4の作業ステージを間欠的に回転させるようになされている、
請求項7に記載のはんだバンプ形成装置。 - 前記第1のインデックス位置に位置づけられた前記作業ステージとの間で前記構成要素を搬入および搬出するための供給ステージをさらに備え、
前記第1のヒータユニットが前記第2のインデックス位置に配置されており、
前記第2のヒータユニットと、前記インジェクションヘッドと、前記第1の冷却用ユニットとが、前記第3のインデックス位置に配置されており、
前記第2の冷却用ユニットが前記第4のインデックス位置に配置されている、
請求項8に記載のはんだバンプ形成装置。
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Cited By (11)
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US10632492B2 (en) | 2015-01-13 | 2020-04-28 | Senju Metal Industry Co., Ltd. | Fluid discharge device, fluid discharge method, and fluid application device |
EP4234103A2 (en) | 2015-01-13 | 2023-08-30 | Senju Metal Industry Co., Ltd. | Fluid discharge device, fluid discharge method and fluid application device |
JP5975165B1 (ja) * | 2015-11-05 | 2016-08-23 | 千住金属工業株式会社 | 蓋開閉機構及びはんだ付け装置 |
WO2017104745A1 (ja) * | 2015-12-15 | 2017-06-22 | 千住金属工業株式会社 | 流体吐出装置および流体吐出方法 |
KR20180095864A (ko) | 2015-12-15 | 2018-08-28 | 센주긴조쿠고교 가부시키가이샤 | 땜납 범프의 수정 방법 |
KR20180098581A (ko) | 2015-12-15 | 2018-09-04 | 센주긴조쿠고교 가부시키가이샤 | 유체 토출 장치 및 유체 토출 방법 |
US10681822B2 (en) | 2015-12-15 | 2020-06-09 | Senju Metal Industry Co., Ltd. | Method for correcting solder bump |
JP2020115574A (ja) * | 2015-12-15 | 2020-07-30 | 千住金属工業株式会社 | はんだバンプの修正方法 |
US10932372B2 (en) | 2015-12-15 | 2021-02-23 | Senju Metal Industry Co., Ltd. | Fluid discharge device |
JP7017020B2 (ja) | 2015-12-15 | 2022-02-08 | 千住金属工業株式会社 | はんだバンプの修正方法 |
US11259415B2 (en) | 2015-12-15 | 2022-02-22 | Senju Metal Industry Co., Ltd. | Method for discharging fluid |
Also Published As
Publication number | Publication date |
---|---|
CN104137242A (zh) | 2014-11-05 |
JPWO2013058299A1 (ja) | 2015-04-02 |
KR101582210B1 (ko) | 2016-01-04 |
US20150007958A1 (en) | 2015-01-08 |
TW201325803A (zh) | 2013-07-01 |
EP2770528A8 (en) | 2015-02-18 |
EP2770528B1 (en) | 2016-12-07 |
KR20140101732A (ko) | 2014-08-20 |
US9511438B2 (en) | 2016-12-06 |
TWI552824B (zh) | 2016-10-11 |
EP2770528A1 (en) | 2014-08-27 |
CN104137242B (zh) | 2017-08-25 |
JP5656097B2 (ja) | 2015-01-21 |
EP2770528A4 (en) | 2015-05-20 |
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