WO2008065979A1 - Procédé et dispositif pour placer un matériau liquide - Google Patents

Procédé et dispositif pour placer un matériau liquide Download PDF

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Publication number
WO2008065979A1
WO2008065979A1 PCT/JP2007/072721 JP2007072721W WO2008065979A1 WO 2008065979 A1 WO2008065979 A1 WO 2008065979A1 JP 2007072721 W JP2007072721 W JP 2007072721W WO 2008065979 A1 WO2008065979 A1 WO 2008065979A1
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WO
WIPO (PCT)
Prior art keywords
liquid material
workpiece
imaging
substrate
edge
Prior art date
Application number
PCT/JP2007/072721
Other languages
English (en)
Japanese (ja)
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering, Inc. filed Critical Musashi Engineering, Inc.
Priority to CN2007800435463A priority Critical patent/CN101563764B/zh
Priority to KR1020097011528A priority patent/KR101457459B1/ko
Publication of WO2008065979A1 publication Critical patent/WO2008065979A1/fr
Priority to HK09112282.3A priority patent/HK1132375A1/xx

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]

Definitions

  • the present invention relates to a method of filling a gap between a substrate and a work held on the substrate with a liquid material discharged from a discharge portion using a capillary phenomenon, and in particular, a liquid in an underfill process of semiconductor packaging.
  • the present invention relates to a method and an apparatus capable of filling materials without excess or deficiency.
  • discharge refers to a discharge method in which the liquid material comes into contact with the work before being separated from the discharge portion, and a discharge method in which the liquid material is brought into contact with the work after being separated from the discharge portion. Is included.
  • a semiconductor package is configured by connecting a semiconductor chip on a substrate via solder bumps.
  • the gap between the substrate and the semiconductor chip is filled with an underfill material to mitigate the effects of thermal stress and external stress.
  • the process of filling the gap between the substrate and the semiconductor chip with the underfill material is called an underfill process.
  • an underfill material is supplied from a discharge portion located near the end of the semiconductor chip, and the resin is separated from the semiconductor chip and the substrate by using a capillary phenomenon. After filling the gap, heat the resin in an oven to cure the resin.
  • the underfill material is often supplied by the method shown in Figs. 2 (a) to (c).
  • Fig. 2 (a) supplies the underfill material with the discharge part stationary against the semiconductor chip.
  • Fig. 2 (b) is a method of supplying an underfill material while moving the discharge part along one side of the semiconductor chip, and
  • Fig. 2 (c) is a method for supplying the discharge part to two sides of the semiconductor chip. This is a method of supplying an underfill material while moving along.
  • the underfill material flows in one direction through the gap between the semiconductor chip and the substrate, so the air in the gap between the semiconductor chip and the substrate is the underfinole material. As a result, the air can be filled without leaving bubbles.
  • the amount of the underfill material supplied from the discharge unit is an amount that reaches the entire gap between the semiconductor chip and the substrate calculated in advance. By supplying this amount of underfill material, most semiconductor chips have good results in which the underfill material has reached the entire gap between the semiconductor chip and the substrate.
  • Fig. 4 (a) shows the underfill material spread over the entire gap between the semiconductor chip and the substrate. In this way, it is preferable that the underfill material slightly protrudes from the edge (periphery) of the semiconductor chip! /.
  • FIG. 4 (b) shows the state where the underfill material does not reach the entire periphery of the semiconductor chip.
  • Patent Document 1 the substrate on which the semiconductor chip is placed is tilted, the underfill material is poured from the upper side into the gap between the semiconductor chip and the substrate, and the underfill material is obtained by the monitoring camera installed on the lower side. A method of confirming that the underfill material has been completed by confirming that it has reached the bottom is disclosed.
  • Patent Document 2 describes a valve-type dispenser in which a resin ball is formed on the tip of a nozzle, the resin ball is transferred onto a substrate and applied, and the resin adhering to the tip of the nozzle.
  • the present invention is applied to a resin coating apparatus having an image recognition unit having an imaging unit for imaging, and a control unit for controlling the discharge amount of the resin based on the captured image data. Abandoned in advance, the remaining resin area (area before discharge S1) and the area of the resin ball formed on the nozzle tip (area after discharge S2) were measured with a CCD camera. Underflow is used to measure the amount of resin discharged from the difference between the area S2 after discharge and the area S1 before discharge. A method of filling the filler material is disclosed.
  • Patent Document 1 JP 2000-82715 A
  • Patent Document 2 JP-A-2004-273541
  • Patent Document 1 it is preferable to hold the substrate obliquely during pouring, to level after confirming the arrival, and to return the underfill material flowing out from the opposite side of the semiconductor chip by capillary action. Performing filling is disclosed.
  • the mechanism for tilting the substrate in this way causes a large force on the production equipment.
  • a process of changing the substrate diagonally and horizontally is required for each semiconductor chip filling, which requires extra time and productivity.
  • an object of the present invention is to provide a liquid material filling method and apparatus capable of supplying an appropriate amount of liquid material without complicated control with a high degree of freedom in apparatus configuration.
  • the method of supplying the liquid material while confirming whether the liquid material is sufficiently filled in the gap between the substrate and the workpiece has the above-described problems. Therefore, the present inventor employs a method of supplying a desired amount of liquid material and filling the gap between the workpiece and the substrate, confirming the state of filling, and refilling later only when the filling is defective. did.
  • a method for filling a gap between a substrate and a work held on the substrate with a liquid material discharged from the discharge portion using a capillary phenomenon A supply process of supplying a liquid material from an imaging process, an imaging process of capturing an image of an edge of a work in an area where the liquid material supplied in the supply process is expected to ooze out by capillary action, and an imaging process
  • a replenishing step of supplying the liquid material to the edge portion of the work from the discharge portion A second invention is characterized in that, in the first invention, the replenishing step supplies a liquid material having a positional force overlapping with a position of the discharge portion when the liquid material is supplied in the supplying step.
  • replenishment is performed from the edge on the side where the liquid material is supplied in the supply step, and bubbles can be prevented from being caught. It is assumed that the same effect can be obtained even when supplying from a stationary discharge part in the supply process and supplying the discharge part slightly shifted in the replenishment process.
  • the replenishment step supplies the liquid material by moving the discharge portion to the edge of the workpiece where the liquid material does not exist in the determination step. It is a sign.
  • a fourth invention is characterized in that, in any one of the first to third inventions, when the work is a polygon, an edge of a corner of the work is imaged in the imaging step.
  • the corner of the work constitutes a side farthest from a side to which the position of the discharge unit belongs in the supplying step, and forms a side to which the position of the discharge unit belongs No One or more corners.
  • the determination step includes a process of recognizing the amount of the liquid material protruding from the edge of the workpiece based on the captured image, and the replenishment step. Is characterized by supplying a replenishment amount of the liquid material calculated based on the amount of the liquid material that has been recognized in the determination step.
  • the determination step recognizes the width of the liquid material protruding from the edge of the first line based on the captured image, and the replenishment amount of the liquid material protruding from the width Is calculated.
  • the determination step recognizes the area of the liquid material protruding from the edge of the cake based on the captured image, and determines the replenishment amount of the liquid material protruding from the area. It is characterized by calculating.
  • the imaging step performs imaging at a plurality of points on the edge of the workpiece
  • the determining step includes determining a plurality of points on the edge of the workpiece based on the captured image. The presence or absence of the liquid material in the liquid is detected, and the replenishment amount of the liquid material is calculated based on the number of points where the liquid material does not exist.
  • the imaging step performs imaging at a plurality of points on the edge of the workpiece, and the determination step determines the edge of the workpiece based on the captured image. Check the force at which the liquid material is present at the edges at multiple points in the section, and if the liquid material is present at all points, determine that it is good. O! /, When there is no liquid material, it is judged as defective.
  • the substrate has an alignment mark
  • the alignment mark of the substrate is imaged by an imaging means, and the substrate and / or Or alignment to correct displacement of workpiece holding position on substrate It has the process.
  • the same imaging means is used in the alignment step and the imaging step.
  • the imaging means in any one of the first to thirteenth aspects, in the case where a plurality of cakes are held on the substrate, the imaging means has a driving means independent of the ejection section, and the substrate Before the supply process for all the above workpieces is completed, the imaging process is started for the workpiece for which the supply process on the substrate has been completed.
  • the edge of the workpiece is irradiated and imaged by an illuminating unit comprising a plurality of irradiation units connected to the imaging unit. It is characterized by that.
  • a liquid material supply unit that supplies a liquid material
  • a discharge unit that has a discharge port for discharging the liquid material
  • a drive mechanism that can move the discharge unit, an imaging unit, and the operation of these units.
  • a program for executing the liquid material filling method according to any one of the first to fourteenth aspects is provided in a discharge device including a control unit that discharges a desired amount of liquid material. It is an apparatus characterized by having.
  • a seventeenth aspect of the invention is characterized in that, in the sixteenth aspect of the invention, a lighting unit having a plurality of irradiation unit forces connected to the imaging unit is provided.
  • a specific configuration for ejecting a desired amount of liquid material is exemplified.
  • the pressure value of pressurized air and the pressure time are controlled.
  • the tube type control the amount of movement and the number of times of crushing the member that crushes the tube in order to transfer the liquid in the tube.
  • the amount of rotation of the screw is controlled, and in the case of a valve type, the amount of applied pressure of the liquid material and the opening and closing time and opening time of the bubble part are controlled.
  • FIG. 1 is a side view and a plan view for explaining an underfill process.
  • FIG. 2 is a drawing for explaining a nozzle path in an underfill process.
  • FIG. 4 is a plan view for explaining a state ⁇ in which the underfill material is properly filled and a state (b) in which refilling is necessary.
  • FIG. 5 is a side view showing an outline of the discharge device according to the first embodiment.
  • FIG. 6 is an explanatory diagram of irradiation means.
  • FIG. 7 is a plan view for explaining each point of the substrate and the semiconductor chip with alignment marks.
  • FIG. 8 is an explanatory diagram of a replenishment process according to the first embodiment.
  • FIG. 9 is an explanatory diagram of a determination process according to Example 2.
  • FIG. 10 is an explanatory diagram of each process according to Example 3.
  • FIG. 11 is a side view showing an outline of a discharge device according to a fourth embodiment.
  • the best mode for carrying out the present invention relates to a method and an apparatus capable of filling a liquid material without excess or deficiency.
  • One or more patterns are created for the workpiece placed on the substrate 1, and the liquid material is ejected according to the patterns.
  • a coating pattern that is a line along two sides of 2 is created.
  • the workpiece is not limited to a rectangular shape, and may be a circle or a polygon.
  • the substrate 1 has alignment marks 60 as shown in FIG.
  • the alignment mark 60 on the substrate 1 is captured by the imaging means.
  • An alignment process for imaging and correcting a shift of the holding position of the work on the substrate 1, a supply process for supplying a liquid material to the edge of the work from the discharge section 6, and a work that does not overlap the position of the discharge section 6 in the supply process Depending on the imaging process of capturing an image of the edge of the substrate by the imaging means, and whether or not the liquid material is present on the edge of the workpiece based on the captured image, the liquid is applied over the entire gap between the substrate 1 and the workpiece.
  • a liquid material filling method comprising: a determination step for determining a force filled with the material; and a replenishment step for supplying the liquid material to the edge of the workpiece when the determination is poor.
  • a discharge device having a program for performing the method.
  • the amount of the liquid material to be supplied in the supplying step is a desired amount, and is determined by calculation or test in advance. Therefore, the excessive supply due to the time lag does not occur unlike the conventional method in which the supply is stopped after detecting that the liquid material has reached the opposite side of the workpiece. Also, since a predetermined amount of liquid material is supplied, the filled liquid material will not be excessively supplied! /. Since it is necessary to return the liquid material flowing out from the opposite side of the work, it is not necessary to provide a mechanism for tilting the substrate.
  • the supply speed of the liquid material it is not necessary to limit the supply speed of the liquid material in order to prevent excessive supply, and therefore the supply speed can be increased.
  • image data necessary for determining whether or not a liquid material is present at the edge of the workpiece is acquired by the imaging means.
  • the position of the discharge unit 6 when the liquid material is supplied in the supply process is overlapped! /, And the position is! /, 1! /, And multiple locations are imaged.
  • the image data obtained by the imaging means can be used to determine whether or not the liquid material protrudes more than necessary from the workpiece, or the liquid material protruding from the workpiece adheres to the surface of the workpiece! It can be used to determine /, na! /.
  • the time from the end of the supply process to the start of the imaging process. For example, when it takes time until the supplied liquid material reaches the gap between the workpiece and the substrate, the time for starting the imaging process can be adjusted as appropriate. That is, by performing imaging / determination after the flow of the liquid material has settled down, it is possible to prevent the phenomenon that the liquid material overflows despite the supply from the discharge unit!
  • the present inventor has found that, in a polygonal work such as a substantially rectangular shape, the liquid material is difficult to reach because the angle at the position farthest from the position of the discharge part or the discharge pattern in the supply process Based on the knowledge that the liquid material reaches the corner, it is considered that the liquid material reaches the entire gap between the workpiece and the substrate 1 with high probability if the liquid material reaches the corner. And, from the result of earnest examination, it was invented to judge whether the filling of the liquid material was performed efficiently in a small number of judgment points by making judgments at the corners.
  • the workpiece when the workpiece is a substantially triangle, when the liquid material is discharged along one side, a determination is made for one corner that is farthest from the one side.
  • the workpiece is substantially square, when the liquid material is discharged along one side, the two corners that are farthest from the one side (that is, the position opposite to the one side). If the liquid material is ejected along the two adjacent sides, the corner that is farthest from the two sides (that is, the current corner) is determined. If you make a decision at the corner where the two sides meet and the corner at the opposite position)!
  • FIG. 5 shows a schematic side view of the ejection device according to the present embodiment.
  • the horizontal direction of the paper is the X direction
  • the direction perpendicular to the paper is the Y direction
  • the vertical direction of the paper is the Z direction.
  • the syringe 7 having a substantially cylindrical shape stores the underfill material 5 therein.
  • a discharge portion (nozzle) 6 having a smaller diameter than the syringe 7 communicates with the lower end portion of the syringe 7, and an air tube 13 communicates with the opposite end portion of the syringe 7.
  • the air tube 13 is connected to the dispenser 14, and pressurized air is supplied to the syringe 7 through the air tube 13.
  • the dispenser 14 can supply pressurized air at a set pressure for a set time.
  • the syringe 7 is fixed to the Z table 9 by a syringe holder 8.
  • the Z table 9 is installed so as to be movable in the Z-axis direction by the Z-direction moving mechanism 19.
  • the Z-direction moving mechanism 19 is fixed to the head base 15.
  • the Z-direction moving mechanism 19 includes a driving means having a motor (not shown), a ball screw rotated by the motor, and a guide shaft. By driving the motor, the Z-axis moving mechanism 19 can move the Z-axis table in the Z direction. it can.
  • a cylindrical camera 40 is installed by a camera holder 41 in addition to the Z-direction moving mechanism 19.
  • the camera 40 is connected to the image recognition unit 31, and the image data captured by the camera 40 is transferred to the image recognition unit 31.
  • the camera 40 is provided with an irradiating means 20 so as to surround its tip.
  • the irradiation means 20 has a plurality of irradiation sections 21 that emit light.
  • the irradiating sections 21 are provided in triplicate with an equal interval in the circumferential direction with the camera 40 as the center. In this way, by irradiating light with uniform brightness around the camera 40, the contrast becomes clear and image recognition can be performed satisfactorily.
  • each irradiating unit 21 One end of an optical fiber is connected to each irradiating unit 21, and these are bundled to form an optical fiber cable, and are connected to a light source provided on the side opposite to the irradiating means 20. Light from the light source travels through the optical fiber cable and is irradiated from the irradiation unit 21.
  • the irradiation means 20 can also be constituted by a known irradiation means such as an LED.
  • a transport rail 17 is provided below the head base 15, and transports the substrate 1 to be underfilled.
  • the head base 15 is configured to be movable in the XY direction with respect to the substrate 1 placed on the transport rail 17 by a known XY direction moving mechanism 18 (not shown).
  • a square semiconductor chip 2 as viewed from above is placed via solder bumps 4.
  • the substrate 1 has two alignment marks ⁇ , / 3 near the corners. The alignment mark is used to correct the displacement of the substrate 1 during the filling operation.
  • an alignment mark may be provided on the workpiece to correct the shift of the workpiece holding position on the substrate 1.
  • a semiconductor chip 2 is placed in the previous step on the substrate 1 on which the underfill material 5 is filled.
  • the semiconductor chip 2 is arranged at the same position with respect to the alignment marks ⁇ and ⁇ . Also, since it is placed via the solder bump 4, There is a gap between the semiconductor chip 2.
  • the substrate 1 is moved on the transport rail 17 by a transport belt (not shown) provided on the transport rail 17 and stopped at a work position on the transport rail 17. After stopping, the holding means 3 (not shown) holds the substrate 1 so that the position does not shift.
  • the position in the XY direction of the substrate 1 held by the holding means 3 is shifted for each substrate 1 and is not exactly the same position. This misalignment affects the quality of underfill material 5 filling. This is because the positional relationship between the semiconductor chip 2 and the discharge unit 6 is different. Therefore, an alignment process for calibrating the deviation for each substrate 1 is necessary.
  • the camera 40 is moved above the alignment mark ⁇ to image the alignment mark ⁇ .
  • the position of the alignment mark ⁇ on the image and the coordinate value ⁇ of the heel direction moving mechanism 18 are recorded.
  • the alignment mark ⁇ is imaged.
  • the position of the alignment mark ⁇ on the image and the coordinate value / 3 of the heel direction moving mechanism 18 are stored.
  • the camera 40 is moved by moving the head base 15 together with the ⁇ ⁇ ⁇ ⁇ direction moving mechanism 18.
  • the semiconductor chip 2 is installed at the same position with respect to the alignment marks ⁇ and ⁇ . Therefore, the position of the discharge unit 6 when filling the underfill material 5 is obtained from the coordinate values ⁇ , / 3 and the positional information of the alignment marks ⁇ , / 3 on the image, and the ⁇ direction moving machine at this position is obtained. Calculate the coordinates of structure 18 and store them.
  • the discharge unit 6 since the discharge unit 6 moves on the substrate 1 from ⁇ ⁇ B ⁇ C and fills the underfill material 5, it moves in the X and Y directions corresponding to the path of A ⁇ B ⁇ C. It is necessary to obtain the coordinate value of mechanism 18. By going through the alignment process, the effect of the displacement of the substrate 1 is eliminated.
  • the discharge unit 6 is moved by the XY direction moving mechanism 18 so that the tip of the discharge unit 6 is positioned right above the point A on the substrate 1, and the tip of the discharge unit 6 is moved to a desired height.
  • the height is adjusted by the Z-axis moving mechanism 19 so that it is positioned.
  • the discharge unit 6 While supplying pressurized air at a desired pressure from the dispenser 14 through the air tube 13 into the syringe 7, the discharge unit 6 is moved along the path A ⁇ B ⁇ C on the substrate 1 Fill material 5 is supplied (see Fig. 7). After moving discharge unit 6 to point C, The supply of pressurized air from the pencer 14 is stopped, and the supply of the underfill material 5 is terminated. The discharge unit 6 is moved upward by the Z-axis moving mechanism 19.
  • the underfill material 5 supplied from the discharge unit 6 is filled in the gap between the semiconductor chip 2 and the substrate 1 by capillary action, and the supply process is completed.
  • the optimum amount of the underfill material 5 is an amount assumed to reach the gap between the semiconductor chip 2 and the substrate 1 and is calculated in advance by trial and error tests and calculations based on theory.
  • the discharge is controlled by controlling the discharge conditions.
  • the discharge conditions in the control of the present embodiment are the pressure of pressurized air supplied into the syringe 7 and the caloric pressure time. Specifically, the pressure of the pressurized air in the syringe 7 is controlled by the dispenser 14, and the pressurization time is added by the dispenser 14 when the discharge unit 6 completes the movement of A ⁇ B ⁇ C. Control by stopping the pressure.
  • the discharge time is always constant by setting the movement speed and the movement distance to be the same.
  • the moving speed of the discharge unit 6 can be controlled by the XY direction moving mechanism 18.
  • the temperature affects the discharge amount
  • the temperature is also an object of control.
  • the temperature can be controlled by a method of controlling the syringe 7, the discharge unit 6, the substrate 1, etc. by providing heating / cooling means, or by using the heat radiated by the heating / cooling means provided around the apparatus. This is exemplified by the control method. These are selected as necessary.
  • the amount of the underfill material 5 to be supplied may be controlled by changing the discharge pressure or time according to the amount of the underfill material 5 in the syringe 7. Even in a discharge device that does not have a means for directly measuring the discharge amount, it is possible to control the required amount of discharge by controlling the required discharge conditions.
  • the semiconductor chip 2 that has undergone the supply process is the target of the imaging process.
  • the imaging process is preferably performed after the flow of the underfill material 5 filled in the gap has subsided.
  • the camera 40 is positioned on the point a. Then, the imaging part is irradiated by the irradiation unit 20 to capture an image including the periphery of the semiconductor chip 2 and the substrate 1.
  • the image to be captured may be a still image, not a moving image.
  • points b, c, d, and e an image including the periphery of the semiconductor chip 2 and the substrate 1 is taken.
  • the irradiating means 20 irradiates with an irradiating unit 21 that is uniformly arranged around the camera 40 in an annular shape. it can. Therefore, the ability S to obtain an image with clear contrast that is optimal for image recognition can be obtained.
  • the camera 40 used for imaging is shared with the camera 40 used in the alignment process.
  • the alignment camera 40 is intended to capture the alignment mark, and therefore cannot generally capture a wide field of view. For this reason, only a part of the periphery of the semiconductor chip 2 can be imaged with the alignment device. Therefore, in this embodiment, the camera 40 is moved to each point from the point a to the point e. I decided to do it. (If a camera that can capture a wide field of view is used, an image including all of points a to e may be captured at once.) Thus, according to the configuration of this embodiment, Since there is no need to provide a plurality of cameras 40, the entire apparatus can be reduced in size and can be configured at low cost.
  • the image data captured by the camera 40 is sent to the image recognition unit 31.
  • the image recognition unit 31 performs image recognition for each of the points a to e! /, And confirms that the underfill material 5 exists outside the periphery of the semiconductor chip 2.
  • Image recognition is performed using a known simple method.For example, image data that has been subjected to color reduction processing such as binarization is divided into arbitrary areas and the area ratio is determined before and after the underfill process in that area. And a method of performing determination based on a contrast difference between the surface of the substrate 1 and the underfill material 5 is disclosed.
  • an image with a clear contrast can be obtained by the irradiation means 20, so the presence of the underfill material 5 without performing complex image recognition can be confirmed.
  • force S is disclosed.
  • the underfill material 5 When the underfill material 5 is present outside the semiconductor chip 2 at all points, it is determined that the underfill material 5 has been satisfactorily filled. If it is not possible to confirm the presence of the underfill material 5 at any one point! /, It is determined that the underfill material 5 has not been satisfactorily filled. For example, in FIG. 8, since the underfill material 5 has not reached at the point c, it is determined that the filling is not performed well.
  • the underfill process of the semiconductor chip 2 is completed.
  • a replenishment process is performed. For example, in FIG. 8, since the underfill material 5 has not reached at the point c, it is determined that the filling is not performed well, and thus the replenishment step is performed.
  • the replenishment step is performed as follows.
  • the discharge time may be shortened to reduce the discharge amount.
  • replenishment is performed by moving the discharge part 6 to the point c and supplying the underfill material 5.
  • the discharge unit 6 is moved to each of the points c and e, and the underfill material 5 is moved.
  • Replenishment is performed by supplying fill material 5.
  • the amount of the underfill material 5 to be replenished in the replenishment step may be calculated by a predetermined calculation method. This is particularly effective when the liquid material is supplied from a position that overlaps the position of the discharge portion when the liquid material is supplied in the supply process.
  • the first method is to determine the presence or absence of the underfill material 5 for each of the points a to e in the determination process, and to determine the amount of the underfill material 5 to be replenished in the replenishment process. It is determined by the number. This is because the underfill material 5 does not exist! / The number of locations and the amount of the underfill material 5 that needs to be replenished have a certain correlation.
  • the width of the underfill material 5 protruding from the edge of the semiconductor chip 2 is detected for each of the points a to e in the determination process, and the width of the underfill material 5 to be replenished in the replenishment process is determined from this width. The amount is to be determined.
  • Another example is the edge of the workpiece in the captured image.
  • the boundary between the fork and the underfill material 5 and the boundary between the underfill material 5 and the substrate are recognized, and the underfill that protrudes
  • a method for detecting the width of the material 5 is mentioned.
  • FIG. 9 (a) shows a scene in which the underfill material 5 is supplied while the ejection unit 6 is moved along the side AB that is one side of the semiconductor chip 2.
  • an image including the periphery of the semiconductor chip 2 is taken at corners C and D that do not belong to the side to which the underfinole material 5 is supplied, and it is determined whether the underfill material 5 has reached. That's fine.
  • imaging / determination may be performed at one of the corners C and D, apart from the problem of deterioration in determination accuracy.
  • FIG. 9 (b) shows a scene in which the underfill material 5 is supplied while the ejection unit 6 is moved along the sides AB and BC, which are the two sides of the semiconductor chip 2.
  • an image including the periphery of the semiconductor chip 2 is taken at the corner D that does not belong to the side AB and the side BC to which the underfill material 5 is supplied, and the underfill material 5 arrives! /, Judgment!
  • FIG. 9 (c) shows a scene in which the underfill material 5 is supplied with the discharge section 6 stationary at a point a.
  • an image including the periphery of the semiconductor chip 2 is taken at corners C and D that do not belong to the side AB to which the point a to which the underfill material 5 is supplied belongs, and the underfill material 5 arrives. What is necessary is just to determine whether it is doing. When you want to perform imaging and judgment in a shorter time, apart from the problem of degradation in judgment accuracy, either corner C or corner D In this case, imaging / determination may be performed.
  • each step when a plurality of semiconductor chips 2A, 2B, 2C, and 2D are placed on one substrate 1 will be described.
  • the supply process to the replenishment process is not performed.
  • the supply process is performed for all of the semiconductor chips 2A to 2D, and then the imaging process to the replenishment process is performed. To do.
  • the imaging process and the determination process are performed in the order of the semiconductor chips 2A, 2B, 2C, and 2D, and then filling the underfill material 5
  • the replenishment process is performed only for the semiconductor chip 2 that is determined to be unsatisfactory.
  • the supply process to the replenishment process is not performed for each of the semiconductor chips 2A to 2D because the supplied underfill material 5 flows after flowing into the gap between the semiconductor chip 2 and the substrate 1. Since there is a time lag before the process is settled, if the imaging process of the semiconductor chip 2A is performed immediately after the supply process of the semiconductor chip 2A, it is necessary to wait for the shooting until the flow subsides! / It will be useless.
  • the imaging process and the replenishment process are performed after the supply process is performed in units of substrates as in the present embodiment, it is possible to perform filling work on another semiconductor chip 2 in the time until the flow subsides. As a result, it is possible to reduce the time required for the underfill process per substrate. Needless to say, the imaging step and the determination step may be performed in parallel. For example, after imaging the semiconductor chip 2A, it is efficient to determine the semiconductor chip 2A and to image the semiconductor chip 2B during that time.
  • the apparatus of the present embodiment includes a camera 40b for the imaging process separately from the alignment camera 40a.
  • the imaging process camera 40b is different from the alignment camera 40a and the discharge unit 6 in the XY direction. It can be moved by the moving mechanism 18b. Therefore, the imaging process camera 40b can move in the XY directions independently of the alignment camera 40a and the discharge unit 6. The operation when underfilling the substrate 1 in FIG. 10 using the apparatus configured as described above will be described.
  • a supplying process is performed on the semiconductor chips 2A to 2D. That is, as soon as the supply of the underfill material 5 to the semiconductor chip 2A is completed, the underfill material 5 is immediately supplied to the semiconductor chip 2B from the discharge section 6, and similarly to the semiconductor chip 2C and the semiconductor chip 2D. Will also supply underfill material 5 in sequence.
  • the imaging process is performed in parallel with the supplying process. That is, as soon as the flow of the underfill material 5 supplied to the semiconductor chip 2A is stopped, the imaging chip 40A is imaged by the imaging process camera 40b, and the semiconductor chip 2B, the semiconductor chip 2C, and the semiconductor chip 2D are sequentially imaged in the same manner. .
  • a determination process is performed in parallel with the imaging process. That is, as soon as imaging of the semiconductor chip 2A is completed, the determination is made for the semiconductor chip 2A, and similarly, the determination is also performed for the semiconductor chip 2B, the semiconductor chip 2C, and the semiconductor chip 2D.
  • the semiconductor chip 2D supplying process is completed, the semiconductor chip 2 determined in the determination process of the semiconductor chips 2A to 2D is not sufficiently filled with underfill, and the sequential replenishment process is performed from 2A.
  • the supply process' imaging process' determination process' supplementing process is performed in parallel on one substrate. This makes it possible to shorten the time required for the underfill process per substrate.
  • Example 2 further improvements were made to Example 2, and an attempt was made to determine whether the underfill material 5 was efficiently filled with fewer determination points.
  • Example 2 in order to determine whether or not the underfill material 5 was appropriately filled in the pattern of FIG. 9 (a), it was determined whether the underfill material 5 was present at corners C and D. However, if the reachability of the underfill material 5 is not so different between the corner and the side, it is efficient to determine only one point in the side CD. Therefore, in this embodiment, the periphery of the semiconductor chip 2 is included at one central point of the side CD. By picking up an image and determining whether the underfill material 5 has arrived, it is possible to perform imaging and determination in a shorter time.
  • the amount of the underfill material 5 to be replenished may be calculated by a predetermined calculation method! /, Of course.
  • the present invention can be implemented in various apparatuses for discharging a liquid material.
  • an air type, a flat tubing mechanism or the like that applies a regulated air to the liquid material in the syringe having a nozzle at the tip for a desired time.
  • Tubing type with a rotary tubing mechanism plunger type that moves a desired amount of plunger that slides in close contact with the inner surface of a storage container having a nozzle at the tip, and a screw type that discharges liquid material by rotating the screw, desired Examples thereof include a valve type that controls discharge of a liquid material to which pressure is applied by opening and closing the valve.
  • a jet type or plunger type plunger that discharges and discharges the liquid material from the nozzle tip by colliding the valve body with the valve seat.
  • Examples include a plunger jet type, a continuous jet type, or a demand type ink jet type in which the nozzle is moved and then suddenly stopped and then ejected from the nozzle tip.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)

Abstract

L'invention concerne un procédé et un dispositif pour placer un matériau liquide, dans lequel le dispositif a un haut degré de liberté de structure et peut fournir une quantité appropriée du matériau liquide sans commande complexe. Le procédé utilise l'effet capillaire et est utilisé pour remplir un espace entre un substrat et une pièce, maintenue sur le substrat, avec un matériau liquide déchargé à partir d'une section de décharge, et le dispositif est utilisé pour le procédé. Le procédé a une étape d'alimentation pour alimenter le matériau liquide vers un bord de la pièce à partir de la section de décharge ; une étape d'imagerie pour capturer, par des moyens d'imagerie, une image de ce bord de la pièce à partir duquel le matériau liquide alimenté dans l'étape d'alimentation précédente est supposé exsuder par l'effet capillaire ; une étape de détermination pour détecter la présence du matériau liquide au bord de la pièce sur la base de l'image capturée et pour déterminer si ou non le matériau liquide est placé dans la région entière de l'espace entre le substrat et la pièce ; et une étape de remplissage pour alimenter le matériau liquide à partir de la section de décharge au bord de la pièce lorsqu'un échec est déterminé.
PCT/JP2007/072721 2006-11-29 2007-11-26 Procédé et dispositif pour placer un matériau liquide WO2008065979A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2007800435463A CN101563764B (zh) 2006-11-29 2007-11-26 液体材料的填充方法及装置
KR1020097011528A KR101457459B1 (ko) 2006-11-29 2007-11-26 액체 재료의 충전 방법 및 장치
HK09112282.3A HK1132375A1 (en) 2006-11-29 2009-12-30 Method and device for placing liquid material

Applications Claiming Priority (2)

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JP2006-321011 2006-11-29
JP2006321011A JP5089966B2 (ja) 2006-11-29 2006-11-29 液体材料の充填方法および装置

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KR (1) KR101457459B1 (fr)
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WO (1) WO2008065979A1 (fr)

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US20140093638A1 (en) * 2012-09-28 2014-04-03 Jonathan Joel Bloom Method of dispensing material based on angular locate feature
JP6355440B2 (ja) * 2014-06-09 2018-07-11 富士通周辺機株式会社 アンダーフィル材の塗布装置
WO2018216183A1 (fr) * 2017-05-25 2018-11-29 武蔵エンジニアリング株式会社 Dispositif de revêtement de matériau liquide et procédé de revêtement de matériau liquide
JP7054017B2 (ja) * 2020-03-09 2022-04-13 日亜化学工業株式会社 発光装置の製造方法及び発光装置の検査方法
JP7003184B2 (ja) * 2020-06-22 2022-01-20 Ｔｏｗａ株式会社 樹脂成形装置、及び、樹脂成形品の製造方法

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JP2005217435A (ja) * 2005-03-18 2005-08-11 Matsushita Electric Ind Co Ltd 部品の実装方法と装置
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JP2007194403A (ja) * 2006-01-19 2007-08-02 Sony Corp 電子デバイスの製造装置及び電子デバイスの製造方法、並びに、アンダーフィル材充填状態の検査装置及びアンダーフィル材充填状態の検査方法

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JPH11204553A (ja) * 1998-01-08 1999-07-30 Matsushita Electric Ind Co Ltd 封止装置、及びその定量塗布方法
CN1531042A (zh) * 2003-01-28 2004-09-22 诺德森公司 用于有效毛细填充的方法
JP2005116805A (ja) * 2003-10-08 2005-04-28 Seiko Epson Corp Ｔｃｐ型半導体装置、その製造方法及び製造装置

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Publication number Priority date Publication date Assignee Title
JPH11121482A (ja) * 1997-10-14 1999-04-30 Matsushita Electric Ind Co Ltd アンダーフィルボンドの塗布方法
JP2005217435A (ja) * 2005-03-18 2005-08-11 Matsushita Electric Ind Co Ltd 部品の実装方法と装置
JP2006286744A (ja) * 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd 半導体実装基板、半導体実装用基板、その外観検査方法及び外観検査装置
JP2007194403A (ja) * 2006-01-19 2007-08-02 Sony Corp 電子デバイスの製造装置及び電子デバイスの製造方法、並びに、アンダーフィル材充填状態の検査装置及びアンダーフィル材充填状態の検査方法

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HK1132375A1 (en) 2010-02-19
KR20090088390A (ko) 2009-08-19
TWI471953B (zh) 2015-02-01
JP2008132440A (ja) 2008-06-12
JP5089966B2 (ja) 2012-12-05
TW200834758A (en) 2008-08-16
CN101563764A (zh) 2009-10-21
KR101457459B1 (ko) 2014-11-03
CN101563764B (zh) 2012-05-30

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