HK1132375A1 - Method and device for placing liquid material - Google Patents

Method and device for placing liquid material

Info

Publication number
HK1132375A1
HK1132375A1 HK09112282.3A HK09112282A HK1132375A1 HK 1132375 A1 HK1132375 A1 HK 1132375A1 HK 09112282 A HK09112282 A HK 09112282A HK 1132375 A1 HK1132375 A1 HK 1132375A1
Authority
HK
Hong Kong
Prior art keywords
liquid material
placing liquid
placing
liquid
Prior art date
Application number
HK09112282.3A
Other languages
English (en)
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of HK1132375A1 publication Critical patent/HK1132375A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
HK09112282.3A 2006-11-29 2009-12-30 Method and device for placing liquid material HK1132375A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006321011A JP5089966B2 (ja) 2006-11-29 2006-11-29 液体材料の充填方法および装置
PCT/JP2007/072721 WO2008065979A1 (fr) 2006-11-29 2007-11-26 Procédé et dispositif pour placer un matériau liquide

Publications (1)

Publication Number Publication Date
HK1132375A1 true HK1132375A1 (en) 2010-02-19

Family

ID=39467770

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09112282.3A HK1132375A1 (en) 2006-11-29 2009-12-30 Method and device for placing liquid material

Country Status (6)

Country Link
JP (1) JP5089966B2 (fr)
KR (1) KR101457459B1 (fr)
CN (1) CN101563764B (fr)
HK (1) HK1132375A1 (fr)
TW (1) TWI471953B (fr)
WO (1) WO2008065979A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140093638A1 (en) * 2012-09-28 2014-04-03 Jonathan Joel Bloom Method of dispensing material based on angular locate feature
JP6355440B2 (ja) * 2014-06-09 2018-07-11 富士通周辺機株式会社 アンダーフィル材の塗布装置
KR101940598B1 (ko) * 2017-05-25 2019-01-21 무사시 엔지니어링 가부시키가이샤 액체 재료 도포 장치 및 액체 재료 도포 방법
JP7054017B2 (ja) * 2020-03-09 2022-04-13 日亜化学工業株式会社 発光装置の製造方法及び発光装置の検査方法
JP7003184B2 (ja) * 2020-06-22 2022-01-20 Ｔｏｗａ株式会社 樹脂成形装置、及び、樹脂成形品の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3405149B2 (ja) * 1997-10-14 2003-05-12 松下電器産業株式会社 アンダーフィルボンドの塗布方法
JPH11204553A (ja) * 1998-01-08 1999-07-30 Matsushita Electric Ind Co Ltd 封止装置、及びその定量塗布方法
CN1531042A (zh) * 2003-01-28 2004-09-22 诺德森公司 用于有效毛细填充的方法
JP2005116805A (ja) * 2003-10-08 2005-04-28 Seiko Epson Corp Ｔｃｐ型半導体装置、その製造方法及び製造装置
JP3868453B2 (ja) * 2005-03-18 2007-01-17 松下電器産業株式会社 部品の実装方法
JP4235621B2 (ja) * 2005-03-31 2009-03-11 太陽誘電株式会社 半導体実装基板、半導体実装用基板、その外観検査方法及び外観検査装置
JP2007194403A (ja) * 2006-01-19 2007-08-02 Sony Corp 電子デバイスの製造装置及び電子デバイスの製造方法、並びに、アンダーフィル材充填状態の検査装置及びアンダーフィル材充填状態の検査方法

Also Published As

Publication number Publication date
TW200834758A (en) 2008-08-16
WO2008065979A1 (fr) 2008-06-05
KR101457459B1 (ko) 2014-11-03
CN101563764B (zh) 2012-05-30
TWI471953B (zh) 2015-02-01
KR20090088390A (ko) 2009-08-19
CN101563764A (zh) 2009-10-21
JP2008132440A (ja) 2008-06-12
JP5089966B2 (ja) 2012-12-05

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