JP6355440B2 - アンダーフィル材の塗布装置 - Google Patents
アンダーフィル材の塗布装置 Download PDFInfo
- Publication number
- JP6355440B2 JP6355440B2 JP2014118311A JP2014118311A JP6355440B2 JP 6355440 B2 JP6355440 B2 JP 6355440B2 JP 2014118311 A JP2014118311 A JP 2014118311A JP 2014118311 A JP2014118311 A JP 2014118311A JP 6355440 B2 JP6355440 B2 JP 6355440B2
- Authority
- JP
- Japan
- Prior art keywords
- syringe
- underfill material
- circuit board
- printed circuit
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 title claims description 52
- 238000000576 coating method Methods 0.000 title claims description 23
- 239000011248 coating agent Substances 0.000 title claims description 21
- 230000007246 mechanism Effects 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Coating Apparatus (AREA)
Description
この発明は、このような事情に鑑みてなされたものであり、シリンジを交換した場合でも正しい位置にアンダーフィル材を供給できるようにすることを目的とする。
前述の一般的な説明及び以下の詳細な説明は、典型例及び説明のためのものであって、本発明を限定するためのものではない。
5 プリント基板
6 ホルダー
10 アンダーフィル材
12 Yステージ
15 Zステージ
21 シリンジ
22 支持部材
52 レール部材
53 第1の位置決め部材
54 第2の位置決め部材
Claims (2)
- プリント基板を位置決めして保持するホルダーと、
前記プリント基板上の所定位置に塗布するアンダーフィル材を貯溜するシリンジと、
前記シリンジを保持する支持部材と、
前記支持部材を移動させる移動機構と、
前記シリンジの先端部を位置決めする位置決め部材と、
を含み、
前記位置決め部材を複数有し、1つの前記位置決め部材は、レール部材に固定され、少なくとも1つの前記位置決め部材は前記レール部材に移動可能に取り付けられていることを特徴とするアンダーフィル材の塗布装置。 - 前記シリンジを複数有し、前記支持部材は1つの前記シリンジに対して、他の前記シリンジの位置を前記位置決め部材の移動方向と平行に移動可能に構成したことを特徴とする請求項1に記載のアンダーフィル材の塗布装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014118311A JP6355440B2 (ja) | 2014-06-09 | 2014-06-09 | アンダーフィル材の塗布装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014118311A JP6355440B2 (ja) | 2014-06-09 | 2014-06-09 | アンダーフィル材の塗布装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015231044A JP2015231044A (ja) | 2015-12-21 |
JP6355440B2 true JP6355440B2 (ja) | 2018-07-11 |
Family
ID=54887659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014118311A Active JP6355440B2 (ja) | 2014-06-09 | 2014-06-09 | アンダーフィル材の塗布装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6355440B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113519209B (zh) * | 2019-01-04 | 2023-01-24 | 捷普有限公司 | 提供电路板组件底部填充物分配器的设备、系统和方法 |
CN110972407B8 (zh) * | 2019-12-13 | 2021-03-05 | 东莞市鸿运电子有限公司 | 一种氧化铝陶瓷电路板表面处理工艺 |
JP7116330B2 (ja) | 2020-01-31 | 2022-08-10 | 日亜化学工業株式会社 | 発光装置の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3992893B2 (ja) * | 1999-12-02 | 2007-10-17 | 富士通株式会社 | 半導体装置のアンダーフィル方法 |
JP2001246299A (ja) * | 2000-03-07 | 2001-09-11 | Toshiba Corp | ぺースト塗布方法および実装装置 |
JP3848106B2 (ja) * | 2001-06-05 | 2006-11-22 | Tdk株式会社 | 半導体処理装置における処理部の位置決めおよび検査方法 |
JP5089966B2 (ja) * | 2006-11-29 | 2012-12-05 | 武蔵エンジニアリング株式会社 | 液体材料の充填方法および装置 |
JP2011249195A (ja) * | 2010-05-28 | 2011-12-08 | Panasonic Corp | 印刷装置 |
-
2014
- 2014-06-09 JP JP2014118311A patent/JP6355440B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2015231044A (ja) | 2015-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11470724B2 (en) | Manufacturing apparatus for performing additive manufacturing of an electrical device | |
US10966323B2 (en) | Method and apparatus for automatically adjusting dispensing units of a dispenser | |
JP6450923B2 (ja) | 電子部品実装システムおよび電子部品実装方法ならびに電子部品実装装置 | |
US7357288B2 (en) | Component connecting apparatus | |
JP6355440B2 (ja) | アンダーフィル材の塗布装置 | |
US20190006211A1 (en) | Electronic component handling unit | |
JP6152248B2 (ja) | ペースト塗布装置及びペースト塗布方法並びにダイボンダ | |
JP2008060438A (ja) | 電子部品実装装置および電子部品実装方法 | |
EP3522687B1 (en) | Machine for performing work on substrate, and insertion method | |
KR101228456B1 (ko) | 카메라 모듈 제조용 연성 인쇄회로기판 접합 장치 | |
TW201519718A (zh) | 焊膏印刷裝置及焊膏印刷方法 | |
JP2010225968A (ja) | 電子部品実装装置 | |
JP2005129668A (ja) | 接着剤塗布ノズル及び接着剤塗布装置 | |
WO2016174715A1 (ja) | 作業機 | |
JP4340957B2 (ja) | 部品装着方法 | |
JP6654978B2 (ja) | 対基板作業機 | |
KR101366672B1 (ko) | 반도체 칩 다이 본딩 방법 및 반도체 칩 다이 본딩 장치 | |
JP4985528B2 (ja) | アンダーフィル装置およびそれを用いたアンダーフィル方法 | |
KR20160013616A (ko) | 스크린 프린터 | |
KR100283744B1 (ko) | 집적회로실장방법 | |
JP3868453B2 (ja) | 部品の実装方法 | |
CN114787974A (zh) | 元件安装机以及转印材料转印方法 | |
KR200179788Y1 (ko) | 볼 그리드 어레이 패키지용 플럭스 도포 장치 | |
JP2012104630A (ja) | ペースト供給装置及びペースト供給方法 | |
JP2004266164A (ja) | 実装部品の実装方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170228 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171020 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171107 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171220 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20180405 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20180410 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180515 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180612 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6355440 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D02 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |