JP2006525878A - 基板研磨装置 - Google Patents

基板研磨装置 Download PDF

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Publication number
JP2006525878A
JP2006525878A JP2006519155A JP2006519155A JP2006525878A JP 2006525878 A JP2006525878 A JP 2006525878A JP 2006519155 A JP2006519155 A JP 2006519155A JP 2006519155 A JP2006519155 A JP 2006519155A JP 2006525878 A JP2006525878 A JP 2006525878A
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JP
Japan
Prior art keywords
substrate
polishing
measurement
light
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006519155A
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English (en)
Japanese (ja)
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JP2006525878A5 (https=
Inventor
一人 廣川
俊輔 中井
真朗 大田
雄高 和田
洋一 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
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Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of JP2006525878A publication Critical patent/JP2006525878A/ja
Publication of JP2006525878A5 publication Critical patent/JP2006525878A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2006519155A 2003-05-16 2004-05-13 基板研磨装置 Pending JP2006525878A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003138782 2003-05-16
JP2003138479 2003-05-16
JP2003138496 2003-05-16
PCT/JP2004/006768 WO2004101223A1 (en) 2003-05-16 2004-05-13 Substrate polishing apparatus

Publications (2)

Publication Number Publication Date
JP2006525878A true JP2006525878A (ja) 2006-11-16
JP2006525878A5 JP2006525878A5 (https=) 2007-06-28

Family

ID=33458361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006519155A Pending JP2006525878A (ja) 2003-05-16 2004-05-13 基板研磨装置

Country Status (7)

Country Link
US (3) US20040242121A1 (https=)
EP (1) EP1641597A4 (https=)
JP (1) JP2006525878A (https=)
KR (1) KR20060009327A (https=)
CN (1) CN1791490B (https=)
TW (1) TWI338605B (https=)
WO (1) WO2004101223A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020137653A1 (ja) * 2018-12-26 2020-07-02 株式会社荏原製作所 光学式膜厚測定システムの洗浄方法
JP2021003761A (ja) * 2019-06-26 2021-01-14 株式会社荏原製作所 光学式表面監視装置の洗浄方法
JP2021030408A (ja) * 2019-08-29 2021-03-01 株式会社荏原製作所 研磨装置および研磨方法
JP2022002870A (ja) * 2017-07-24 2022-01-11 株式会社荏原製作所 研磨方法
KR20220100110A (ko) * 2016-09-15 2022-07-14 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 폴리싱 스마트 링
KR20250019583A (ko) 2023-08-01 2025-02-10 가부시키가이샤 에바라 세이사꾸쇼 연마 장치

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KR100568258B1 (ko) * 2004-07-01 2006-04-07 삼성전자주식회사 화학적 기계적 연마용 연마 패드 및 이를 이용하는 화학적기계적 연마 장치
US7153191B2 (en) * 2004-08-20 2006-12-26 Micron Technology, Inc. Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
JP2006159317A (ja) * 2004-12-03 2006-06-22 Asahi Sunac Corp 研磨パッドのドレッシング方法
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US8380024B1 (en) * 2011-08-17 2013-02-19 Princetel Inc. Integrated electro-optical fluid rotary joint
JP2013222856A (ja) * 2012-04-17 2013-10-28 Ebara Corp 研磨装置および研磨方法
US10279311B2 (en) * 2012-08-21 2019-05-07 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for operating chemical mechanical polishing process
US9079287B2 (en) * 2013-03-12 2015-07-14 Macronix International Co., Ltd. CMP polishing pad detector and system
JP6145342B2 (ja) * 2013-07-12 2017-06-07 株式会社荏原製作所 膜厚測定装置、膜厚測定方法、および膜厚測定装置を備えた研磨装置
US9966281B2 (en) * 2013-11-15 2018-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and systems for chemical mechanical polish cleaning
TWI652735B (zh) 2014-10-09 2019-03-01 美商應用材料股份有限公司 具有內部通道的化學機械研磨墊
JP6313196B2 (ja) * 2014-11-20 2018-04-18 株式会社荏原製作所 研磨面洗浄装置、研磨装置、および研磨面洗浄装置の製造方法
US9996369B2 (en) 2015-01-05 2018-06-12 Anki, Inc. Adaptive data analytics service
US9902415B2 (en) * 2016-02-15 2018-02-27 Lam Research Corporation Universal service cart for semiconductor system maintenance
KR102642988B1 (ko) * 2016-11-09 2024-03-06 삼성디스플레이 주식회사 기판 연마 장치 및 방법
JP6951229B2 (ja) 2017-01-05 2021-10-20 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
WO2018128093A1 (ja) 2017-01-05 2018-07-12 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
CN108630561B (zh) * 2017-03-15 2021-10-15 北京北方华创微电子装备有限公司 基片表面的检测装置和检测方法、传片腔室
RU173875U1 (ru) * 2017-03-17 2017-09-15 Акционерное общество "Московский вертолетный завод им. М.Л. Миля" Эталонное устройство для оценки светотехнических характеристик
JP6948878B2 (ja) * 2017-08-22 2021-10-13 ラピスセミコンダクタ株式会社 半導体製造装置及び半導体基板の研磨方法
JP6974087B2 (ja) * 2017-09-14 2021-12-01 株式会社ディスコ 切削装置
CN107745330B (zh) * 2017-11-28 2024-07-05 合肥波林新材料股份有限公司 一种端面研磨装置
WO2019133724A1 (en) * 2017-12-28 2019-07-04 Sinmat, Inc. Cmp polishing pad conditioner
CN110153872B (zh) * 2018-02-14 2021-03-26 台湾积体电路制造股份有限公司 研磨系统、晶片夹持装置及晶片的研磨方法
JP7022647B2 (ja) * 2018-05-08 2022-02-18 株式会社荏原製作所 光透過性部材、研磨パッドおよび基板研磨装置
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JP2020001162A (ja) * 2018-06-28 2020-01-09 株式会社荏原製作所 研磨パッド積層体、研磨パッド位置決め治具、および研磨パッドを研磨テーブルに貼り付ける方法
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KR102564376B1 (ko) * 2016-09-15 2023-08-04 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 폴리싱 스마트 링
KR20220100110A (ko) * 2016-09-15 2022-07-14 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 폴리싱 스마트 링
JP2022002870A (ja) * 2017-07-24 2022-01-11 株式会社荏原製作所 研磨方法
JP7316785B2 (ja) 2018-12-26 2023-07-28 株式会社荏原製作所 光学式膜厚測定システムの洗浄方法
WO2020137653A1 (ja) * 2018-12-26 2020-07-02 株式会社荏原製作所 光学式膜厚測定システムの洗浄方法
KR20210106479A (ko) * 2018-12-26 2021-08-30 가부시키가이샤 에바라 세이사꾸쇼 광학식 막 두께 측정 시스템의 세정 방법
KR102815099B1 (ko) * 2018-12-26 2025-06-04 가부시키가이샤 에바라 세이사꾸쇼 광학식 막 두께 측정 시스템의 세정 방법
TWI843783B (zh) * 2018-12-26 2024-06-01 日商荏原製作所股份有限公司 光學式膜厚量測系統之清洗方法
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JP2020104191A (ja) * 2018-12-26 2020-07-09 株式会社荏原製作所 光学式膜厚測定システムの洗浄方法
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JP2023101596A (ja) * 2019-06-26 2023-07-21 株式会社荏原製作所 光学式表面監視装置の洗浄方法
JP2021003761A (ja) * 2019-06-26 2021-01-14 株式会社荏原製作所 光学式表面監視装置の洗浄方法
JP7596438B2 (ja) 2019-06-26 2024-12-09 株式会社荏原製作所 光学式表面監視装置の洗浄方法
JP7638617B2 (ja) 2019-06-26 2025-03-04 株式会社荏原製作所 光学式表面監視装置の洗浄方法
WO2021039401A1 (ja) * 2019-08-29 2021-03-04 株式会社荏原製作所 研磨装置および研磨方法
JP7403998B2 (ja) 2019-08-29 2023-12-25 株式会社荏原製作所 研磨装置および研磨方法
KR20220049596A (ko) * 2019-08-29 2022-04-21 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
JP2021030408A (ja) * 2019-08-29 2021-03-01 株式会社荏原製作所 研磨装置および研磨方法
KR102846970B1 (ko) 2019-08-29 2025-08-18 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
KR20250019583A (ko) 2023-08-01 2025-02-10 가부시키가이샤 에바라 세이사꾸쇼 연마 장치

Also Published As

Publication number Publication date
CN1791490B (zh) 2010-12-08
WO2004101223A1 (en) 2004-11-25
US20070173177A1 (en) 2007-07-26
KR20060009327A (ko) 2006-01-31
EP1641597A1 (en) 2006-04-05
US20060105679A1 (en) 2006-05-18
US7214122B2 (en) 2007-05-08
EP1641597A4 (en) 2007-10-31
CN1791490A (zh) 2006-06-21
TW200507984A (en) 2005-03-01
US20040242121A1 (en) 2004-12-02
TWI338605B (en) 2011-03-11
US7507144B2 (en) 2009-03-24

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