JP2006525878A5 - - Google Patents
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- Publication number
- JP2006525878A5 JP2006525878A5 JP2006519155A JP2006519155A JP2006525878A5 JP 2006525878 A5 JP2006525878 A5 JP 2006525878A5 JP 2006519155 A JP2006519155 A JP 2006519155A JP 2006519155 A JP2006519155 A JP 2006519155A JP 2006525878 A5 JP2006525878 A5 JP 2006525878A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- polishing
- measurement
- fluid
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003138782 | 2003-05-16 | ||
| JP2003138479 | 2003-05-16 | ||
| JP2003138496 | 2003-05-16 | ||
| PCT/JP2004/006768 WO2004101223A1 (en) | 2003-05-16 | 2004-05-13 | Substrate polishing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006525878A JP2006525878A (ja) | 2006-11-16 |
| JP2006525878A5 true JP2006525878A5 (https=) | 2007-06-28 |
Family
ID=33458361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006519155A Pending JP2006525878A (ja) | 2003-05-16 | 2004-05-13 | 基板研磨装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US20040242121A1 (https=) |
| EP (1) | EP1641597A4 (https=) |
| JP (1) | JP2006525878A (https=) |
| KR (1) | KR20060009327A (https=) |
| CN (1) | CN1791490B (https=) |
| TW (1) | TWI338605B (https=) |
| WO (1) | WO2004101223A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102815099B1 (ko) | 2018-12-26 | 2025-06-04 | 가부시키가이샤 에바라 세이사꾸쇼 | 광학식 막 두께 측정 시스템의 세정 방법 |
Families Citing this family (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7112960B2 (en) | 2003-07-31 | 2006-09-26 | Applied Materials, Inc. | Eddy current system for in-situ profile measurement |
| EP1710048B1 (en) * | 2004-01-28 | 2013-06-12 | Nikon Corporation | Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, cmp polisher, and method of manufacturing semiconductor device |
| CN1972780B (zh) * | 2004-06-21 | 2010-09-08 | 株式会社荏原制作所 | 抛光设备和抛光方法 |
| KR100568258B1 (ko) * | 2004-07-01 | 2006-04-07 | 삼성전자주식회사 | 화학적 기계적 연마용 연마 패드 및 이를 이용하는 화학적기계적 연마 장치 |
| US7153191B2 (en) * | 2004-08-20 | 2006-12-26 | Micron Technology, Inc. | Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods |
| JP2006159317A (ja) * | 2004-12-03 | 2006-06-22 | Asahi Sunac Corp | 研磨パッドのドレッシング方法 |
| KR101398570B1 (ko) * | 2005-08-22 | 2014-05-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
| US7226339B2 (en) * | 2005-08-22 | 2007-06-05 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
| JP4675803B2 (ja) * | 2006-03-10 | 2011-04-27 | 東京エレクトロン株式会社 | 平坦化装置 |
| US7494929B2 (en) * | 2006-04-27 | 2009-02-24 | Applied Materials, Inc. | Automatic gain control |
| JP4745920B2 (ja) * | 2006-08-28 | 2011-08-10 | 三菱重工業株式会社 | 放電電極、薄膜製造装置、及び太陽電池の製造方法 |
| DE102006047207B3 (de) * | 2006-10-05 | 2008-07-03 | Fachhochschule Koblenz | Optischer Drehverteiler für Lichtwellenleiter |
| US7998358B2 (en) | 2006-10-31 | 2011-08-16 | Applied Materials, Inc. | Peak-based endpointing for chemical mechanical polishing |
| US8352061B2 (en) | 2008-11-14 | 2013-01-08 | Applied Materials, Inc. | Semi-quantitative thickness determination |
| WO2010082992A2 (en) * | 2009-01-16 | 2010-07-22 | Applied Materials, Inc. | Polishing pad and system with window support |
| US8157614B2 (en) * | 2009-04-30 | 2012-04-17 | Applied Materials, Inc. | Method of making and apparatus having windowless polishing pad and protected fiber |
| US10188958B2 (en) | 2009-05-28 | 2019-01-29 | Anki, Inc. | Automated detection of surface layout |
| US9155961B2 (en) | 2009-05-28 | 2015-10-13 | Anki, Inc. | Mobile agents for manipulating, moving, and/or reorienting components |
| US8882560B2 (en) | 2009-05-28 | 2014-11-11 | Anki, Inc. | Integration of a robotic system with one or more mobile computing devices |
| EP2786791A3 (en) | 2009-05-28 | 2015-01-07 | Anki, Inc. | Distributed system of autonomously controlled mobile agents |
| WO2011056485A2 (en) | 2009-11-03 | 2011-05-12 | Applied Materials, Inc. | Endpoint method using peak location of spectra contour plots versus time |
| KR101165208B1 (ko) * | 2009-11-18 | 2012-07-16 | 주식회사 케이엔제이 | 평판디스플레이패널의 연마방법 |
| GB2482119B (en) | 2010-07-19 | 2013-01-23 | China Ind Ltd | Racing vehicle game |
| CN102278967A (zh) * | 2011-03-10 | 2011-12-14 | 清华大学 | 抛光液厚度测量装置、测量方法和化学机械抛光设备 |
| CN102221416B (zh) * | 2011-03-10 | 2012-10-10 | 清华大学 | 抛光液物理参数测量装置、测量方法和化学机械抛光设备 |
| US8380024B1 (en) * | 2011-08-17 | 2013-02-19 | Princetel Inc. | Integrated electro-optical fluid rotary joint |
| JP2013222856A (ja) * | 2012-04-17 | 2013-10-28 | Ebara Corp | 研磨装置および研磨方法 |
| US10279311B2 (en) * | 2012-08-21 | 2019-05-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for operating chemical mechanical polishing process |
| US9079287B2 (en) * | 2013-03-12 | 2015-07-14 | Macronix International Co., Ltd. | CMP polishing pad detector and system |
| JP6145342B2 (ja) * | 2013-07-12 | 2017-06-07 | 株式会社荏原製作所 | 膜厚測定装置、膜厚測定方法、および膜厚測定装置を備えた研磨装置 |
| US9966281B2 (en) * | 2013-11-15 | 2018-05-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and systems for chemical mechanical polish cleaning |
| TWI652735B (zh) | 2014-10-09 | 2019-03-01 | 美商應用材料股份有限公司 | 具有內部通道的化學機械研磨墊 |
| JP6313196B2 (ja) * | 2014-11-20 | 2018-04-18 | 株式会社荏原製作所 | 研磨面洗浄装置、研磨装置、および研磨面洗浄装置の製造方法 |
| US9996369B2 (en) | 2015-01-05 | 2018-06-12 | Anki, Inc. | Adaptive data analytics service |
| US9902415B2 (en) * | 2016-02-15 | 2018-02-27 | Lam Research Corporation | Universal service cart for semiconductor system maintenance |
| JP7312103B2 (ja) * | 2016-09-15 | 2023-07-20 | アプライド マテリアルズ インコーポレイテッド | 化学機械研磨スマートリング |
| KR102642988B1 (ko) * | 2016-11-09 | 2024-03-06 | 삼성디스플레이 주식회사 | 기판 연마 장치 및 방법 |
| JP6951229B2 (ja) | 2017-01-05 | 2021-10-20 | 株式会社Screenホールディングス | 基板洗浄装置および基板洗浄方法 |
| WO2018128093A1 (ja) | 2017-01-05 | 2018-07-12 | 株式会社Screenホールディングス | 基板洗浄装置および基板洗浄方法 |
| CN108630561B (zh) * | 2017-03-15 | 2021-10-15 | 北京北方华创微电子装备有限公司 | 基片表面的检测装置和检测方法、传片腔室 |
| RU173875U1 (ru) * | 2017-03-17 | 2017-09-15 | Акционерное общество "Московский вертолетный завод им. М.Л. Миля" | Эталонное устройство для оценки светотехнических характеристик |
| JP6948868B2 (ja) * | 2017-07-24 | 2021-10-13 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| JP6948878B2 (ja) * | 2017-08-22 | 2021-10-13 | ラピスセミコンダクタ株式会社 | 半導体製造装置及び半導体基板の研磨方法 |
| JP6974087B2 (ja) * | 2017-09-14 | 2021-12-01 | 株式会社ディスコ | 切削装置 |
| CN107745330B (zh) * | 2017-11-28 | 2024-07-05 | 合肥波林新材料股份有限公司 | 一种端面研磨装置 |
| WO2019133724A1 (en) * | 2017-12-28 | 2019-07-04 | Sinmat, Inc. | Cmp polishing pad conditioner |
| CN110153872B (zh) * | 2018-02-14 | 2021-03-26 | 台湾积体电路制造股份有限公司 | 研磨系统、晶片夹持装置及晶片的研磨方法 |
| JP7022647B2 (ja) * | 2018-05-08 | 2022-02-18 | 株式会社荏原製作所 | 光透過性部材、研磨パッドおよび基板研磨装置 |
| US11878388B2 (en) * | 2018-06-15 | 2024-01-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same |
| JP2020001162A (ja) * | 2018-06-28 | 2020-01-09 | 株式会社荏原製作所 | 研磨パッド積層体、研磨パッド位置決め治具、および研磨パッドを研磨テーブルに貼り付ける方法 |
| US20200361052A1 (en) * | 2019-05-16 | 2020-11-19 | Micron Technology, Inc. | Planarization endpoint determination |
| JP7638617B2 (ja) * | 2019-06-26 | 2025-03-04 | 株式会社荏原製作所 | 光学式表面監視装置の洗浄方法 |
| JP7403998B2 (ja) * | 2019-08-29 | 2023-12-25 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| US11389923B2 (en) * | 2020-03-12 | 2022-07-19 | Bruker Nano, Inc. | Chemical-mechanical polishing system with a potentiostat and pulsed-force applied to a workpiece |
| US12318881B2 (en) * | 2021-03-29 | 2025-06-03 | Ebara Corporation | Substrate polishing apparatus and substrate polishing method |
| JP2025021626A (ja) | 2023-08-01 | 2025-02-14 | 株式会社荏原製作所 | 研磨装置 |
| CN117140236B (zh) * | 2023-10-25 | 2024-01-26 | 苏州博宏源机械制造有限公司 | 一种晶圆厚度在线测量装置及方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6614529B1 (en) * | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| JPH10229061A (ja) * | 1997-02-13 | 1998-08-25 | Nikon Corp | 研磨量測定装置 |
| US6142855A (en) * | 1997-10-31 | 2000-11-07 | Canon Kabushiki Kaisha | Polishing apparatus and polishing method |
| US6271047B1 (en) * | 1998-05-21 | 2001-08-07 | Nikon Corporation | Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same |
| US6361646B1 (en) * | 1998-06-08 | 2002-03-26 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection for chemical mechanical polishing |
| US6146242A (en) * | 1999-06-11 | 2000-11-14 | Strasbaugh, Inc. | Optical view port for chemical mechanical planarization endpoint detection |
| US6454630B1 (en) * | 1999-09-14 | 2002-09-24 | Applied Materials, Inc. | Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same |
| US6671051B1 (en) * | 1999-09-15 | 2003-12-30 | Kla-Tencor | Apparatus and methods for detecting killer particles during chemical mechanical polishing |
| US6628397B1 (en) * | 1999-09-15 | 2003-09-30 | Kla-Tencor | Apparatus and methods for performing self-clearing optical measurements |
| JP3854056B2 (ja) * | 1999-12-13 | 2006-12-06 | 株式会社荏原製作所 | 基板膜厚測定方法、基板膜厚測定装置、基板処理方法及び基板処理装置 |
| US6707540B1 (en) * | 1999-12-23 | 2004-03-16 | Kla-Tencor Corporation | In-situ metalization monitoring using eddy current and optical measurements |
| US6878038B2 (en) * | 2000-07-10 | 2005-04-12 | Applied Materials Inc. | Combined eddy current sensing and optical monitoring for chemical mechanical polishing |
| US6609947B1 (en) * | 2000-08-30 | 2003-08-26 | Micron Technology, Inc. | Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates |
| JP2002198341A (ja) * | 2000-12-25 | 2002-07-12 | Toshiba Corp | 化学的機械的研磨処理システム及び化学的機械的研磨方法 |
| US6790768B2 (en) * | 2001-07-11 | 2004-09-14 | Applied Materials Inc. | Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects |
| JP2003057027A (ja) * | 2001-08-10 | 2003-02-26 | Ebara Corp | 測定装置 |
| US6599765B1 (en) * | 2001-12-12 | 2003-07-29 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
| US7175503B2 (en) * | 2002-02-04 | 2007-02-13 | Kla-Tencor Technologies Corp. | Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device |
| US7226339B2 (en) * | 2005-08-22 | 2007-06-05 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
-
2003
- 2003-07-14 US US10/617,794 patent/US20040242121A1/en not_active Abandoned
-
2004
- 2004-05-13 JP JP2006519155A patent/JP2006525878A/ja active Pending
- 2004-05-13 TW TW093113413A patent/TWI338605B/zh not_active IP Right Cessation
- 2004-05-13 EP EP04732769A patent/EP1641597A4/en not_active Withdrawn
- 2004-05-13 CN CN2004800134000A patent/CN1791490B/zh not_active Expired - Lifetime
- 2004-05-13 KR KR1020057021477A patent/KR20060009327A/ko not_active Ceased
- 2004-05-13 WO PCT/JP2004/006768 patent/WO2004101223A1/en not_active Ceased
-
2005
- 2005-11-16 US US11/274,112 patent/US7214122B2/en not_active Expired - Lifetime
-
2007
- 2007-03-28 US US11/727,727 patent/US7507144B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102815099B1 (ko) | 2018-12-26 | 2025-06-04 | 가부시키가이샤 에바라 세이사꾸쇼 | 광학식 막 두께 측정 시스템의 세정 방법 |
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