JP2006526292A5 - - Google Patents

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Publication number
JP2006526292A5
JP2006526292A5 JP2006519167A JP2006519167A JP2006526292A5 JP 2006526292 A5 JP2006526292 A5 JP 2006526292A5 JP 2006519167 A JP2006519167 A JP 2006519167A JP 2006519167 A JP2006519167 A JP 2006519167A JP 2006526292 A5 JP2006526292 A5 JP 2006526292A5
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JP
Japan
Prior art keywords
substrate
fluid
flow path
fluid chamber
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006519167A
Other languages
English (en)
Japanese (ja)
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JP2006526292A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2004/007152 external-priority patent/WO2004103636A2/en
Publication of JP2006526292A publication Critical patent/JP2006526292A/ja
Publication of JP2006526292A5 publication Critical patent/JP2006526292A5/ja
Pending legal-status Critical Current

Links

JP2006519167A 2003-05-21 2004-05-19 基板研磨装置 Pending JP2006526292A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003143527 2003-05-21
JP2003143526 2003-05-21
PCT/JP2004/007152 WO2004103636A2 (en) 2003-05-21 2004-05-19 Substrate polishing apparatus

Publications (2)

Publication Number Publication Date
JP2006526292A JP2006526292A (ja) 2006-11-16
JP2006526292A5 true JP2006526292A5 (https=) 2007-02-08

Family

ID=33455528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006519167A Pending JP2006526292A (ja) 2003-05-21 2004-05-19 基板研磨装置

Country Status (8)

Country Link
US (2) US7101257B2 (https=)
EP (1) EP1633528B1 (https=)
JP (1) JP2006526292A (https=)
KR (1) KR101052844B1 (https=)
CN (1) CN1791491B (https=)
DE (1) DE602004031295D1 (https=)
TW (1) TWI271265B (https=)
WO (1) WO2004103636A2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7101257B2 (en) * 2003-05-21 2006-09-05 Ebara Corporation Substrate polishing apparatus
US7777920B2 (en) * 2006-02-28 2010-08-17 Toshiba Tec Kabushiki Kaisha Image copier and image copying method
JP2014154874A (ja) * 2013-02-07 2014-08-25 Toshiba Corp 膜厚モニタ装置、研磨装置および膜厚モニタ方法
JP2015126179A (ja) * 2013-12-27 2015-07-06 株式会社荏原製作所 研磨終点検出方法、及び研磨終点検出装置
TWI583495B (zh) * 2014-01-10 2017-05-21 Ｓｕｍｃｏ股份有限公司 工件厚度的測定裝置、測定方法及工件的硏磨裝置
KR20170039019A (ko) 2015-09-30 2017-04-10 서울바이오시스 주식회사 침대용 공기 정화기 및 광촉매-공기조화 모듈
TW201822953A (zh) * 2016-09-16 2018-07-01 美商應用材料股份有限公司 基於溝槽深度的電磁感應監控進行的過拋光
CN109844923B (zh) * 2016-10-10 2023-07-11 应用材料公司 用于化学机械抛光的实时轮廓控制
JP7141204B2 (ja) * 2017-10-19 2022-09-22 株式会社荏原製作所 研磨装置、及び研磨方法
JP7022647B2 (ja) * 2018-05-08 2022-02-18 株式会社荏原製作所 光透過性部材、研磨パッドおよび基板研磨装置
JP7403998B2 (ja) * 2019-08-29 2023-12-25 株式会社荏原製作所 研磨装置および研磨方法
CN112247819B (zh) * 2020-10-09 2022-08-19 无锡贝来钢管有限公司 大口径厚壁无缝钢管加工装置
US11965798B2 (en) * 2021-06-10 2024-04-23 Applied Materials, Inc. Endpoint detection system for enhanced spectral data collection
CN115308140A (zh) * 2022-10-11 2022-11-08 杭州众硅电子科技有限公司 一种化学机械抛光的在线监测装置

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US6614529B1 (en) * 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5657123A (en) * 1994-09-16 1997-08-12 Mitsubishi Materials Corp. Film thickness measuring apparatus, film thickness measuring method and wafer polishing system measuring a film thickness in conjunction with a liquid tank
JPH08174411A (ja) * 1994-12-22 1996-07-09 Ebara Corp ポリッシング装置
US6537133B1 (en) * 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5838447A (en) * 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
US5762536A (en) * 1996-04-26 1998-06-09 Lam Research Corporation Sensors for a linear polisher
US5958148A (en) * 1996-07-26 1999-09-28 Speedfam-Ipec Corporation Method for cleaning workpiece surfaces and monitoring probes during workpiece processing
JP3454658B2 (ja) * 1997-02-03 2003-10-06 大日本スクリーン製造株式会社 研磨処理モニター装置
JPH10229061A (ja) * 1997-02-13 1998-08-25 Nikon Corp 研磨量測定装置
US6361646B1 (en) * 1998-06-08 2002-03-26 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6106662A (en) * 1998-06-08 2000-08-22 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6334807B1 (en) * 1999-04-30 2002-01-01 International Business Machines Corporation Chemical mechanical polishing in-situ end point system
DE10084915C2 (de) * 1999-08-27 2003-12-24 Asahi Chemical Ind Polierkissen und Poliervorrichtung
US6628397B1 (en) * 1999-09-15 2003-09-30 Kla-Tencor Apparatus and methods for performing self-clearing optical measurements
US6671051B1 (en) * 1999-09-15 2003-12-30 Kla-Tencor Apparatus and methods for detecting killer particles during chemical mechanical polishing
JP2001088021A (ja) 1999-09-22 2001-04-03 Speedfam Co Ltd 研磨終点検出機構付き研磨装置
JP3854056B2 (ja) * 1999-12-13 2006-12-06 株式会社荏原製作所 基板膜厚測定方法、基板膜厚測定装置、基板処理方法及び基板処理装置
US6399501B2 (en) * 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
US6707540B1 (en) * 1999-12-23 2004-03-16 Kla-Tencor Corporation In-situ metalization monitoring using eddy current and optical measurements
US6433541B1 (en) * 1999-12-23 2002-08-13 Kla-Tencor Corporation In-situ metalization monitoring using eddy current measurements during the process for removing the film
WO2001046684A1 (en) * 1999-12-23 2001-06-28 Kla-Tencor Corporation In-situ metalization monitoring using eddy current measurements and optical measurements
US6491569B2 (en) * 2001-04-19 2002-12-10 Speedfam-Ipec Corporation Method and apparatus for using optical reflection data to obtain a continuous predictive signal during CMP
CN1414608A (zh) * 2001-10-26 2003-04-30 矽统科技股份有限公司 晶圆的化学机械研磨装置
US6599765B1 (en) * 2001-12-12 2003-07-29 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
JP3878016B2 (ja) * 2001-12-28 2007-02-07 株式会社荏原製作所 基板研磨装置
US7175503B2 (en) * 2002-02-04 2007-02-13 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
US6733368B1 (en) * 2003-02-10 2004-05-11 Seh America, Inc. Method for lapping a wafer
US7101257B2 (en) * 2003-05-21 2006-09-05 Ebara Corporation Substrate polishing apparatus

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