TWI271265B - Substrate polishing apparatus - Google Patents

Substrate polishing apparatus Download PDF

Info

Publication number
TWI271265B
TWI271265B TW093114210A TW93114210A TWI271265B TW I271265 B TWI271265 B TW I271265B TW 093114210 A TW093114210 A TW 093114210A TW 93114210 A TW93114210 A TW 93114210A TW I271265 B TWI271265 B TW I271265B
Authority
TW
Taiwan
Prior art keywords
light
substrate
fiber
emitting
polishing
Prior art date
Application number
TW093114210A
Other languages
English (en)
Chinese (zh)
Other versions
TW200505633A (en
Inventor
Kazuto Hirokawa
Yoichi Kobayashi
Shunsuke Nakai
Shinrou Ohta
Yasuo Tsukuda
Original Assignee
Ebara Corp
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Shimadzu Corp filed Critical Ebara Corp
Publication of TW200505633A publication Critical patent/TW200505633A/zh
Application granted granted Critical
Publication of TWI271265B publication Critical patent/TWI271265B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW093114210A 2003-05-21 2004-05-20 Substrate polishing apparatus TWI271265B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003143527 2003-05-21
JP2003143526 2003-05-21

Publications (2)

Publication Number Publication Date
TW200505633A TW200505633A (en) 2005-02-16
TWI271265B true TWI271265B (en) 2007-01-21

Family

ID=33455528

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093114210A TWI271265B (en) 2003-05-21 2004-05-20 Substrate polishing apparatus

Country Status (8)

Country Link
US (2) US7101257B2 (https=)
EP (1) EP1633528B1 (https=)
JP (1) JP2006526292A (https=)
KR (1) KR101052844B1 (https=)
CN (1) CN1791491B (https=)
DE (1) DE602004031295D1 (https=)
TW (1) TWI271265B (https=)
WO (1) WO2004103636A2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7101257B2 (en) * 2003-05-21 2006-09-05 Ebara Corporation Substrate polishing apparatus
US7777920B2 (en) * 2006-02-28 2010-08-17 Toshiba Tec Kabushiki Kaisha Image copier and image copying method
JP2014154874A (ja) * 2013-02-07 2014-08-25 Toshiba Corp 膜厚モニタ装置、研磨装置および膜厚モニタ方法
JP2015126179A (ja) * 2013-12-27 2015-07-06 株式会社荏原製作所 研磨終点検出方法、及び研磨終点検出装置
TWI583495B (zh) * 2014-01-10 2017-05-21 Ｓｕｍｃｏ股份有限公司 工件厚度的測定裝置、測定方法及工件的硏磨裝置
KR20170039019A (ko) 2015-09-30 2017-04-10 서울바이오시스 주식회사 침대용 공기 정화기 및 광촉매-공기조화 모듈
TW201822953A (zh) * 2016-09-16 2018-07-01 美商應用材料股份有限公司 基於溝槽深度的電磁感應監控進行的過拋光
CN109844923B (zh) * 2016-10-10 2023-07-11 应用材料公司 用于化学机械抛光的实时轮廓控制
JP7141204B2 (ja) * 2017-10-19 2022-09-22 株式会社荏原製作所 研磨装置、及び研磨方法
JP7022647B2 (ja) * 2018-05-08 2022-02-18 株式会社荏原製作所 光透過性部材、研磨パッドおよび基板研磨装置
JP7403998B2 (ja) * 2019-08-29 2023-12-25 株式会社荏原製作所 研磨装置および研磨方法
CN112247819B (zh) * 2020-10-09 2022-08-19 无锡贝来钢管有限公司 大口径厚壁无缝钢管加工装置
US11965798B2 (en) * 2021-06-10 2024-04-23 Applied Materials, Inc. Endpoint detection system for enhanced spectral data collection
CN115308140A (zh) * 2022-10-11 2022-11-08 杭州众硅电子科技有限公司 一种化学机械抛光的在线监测装置

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6614529B1 (en) * 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5657123A (en) * 1994-09-16 1997-08-12 Mitsubishi Materials Corp. Film thickness measuring apparatus, film thickness measuring method and wafer polishing system measuring a film thickness in conjunction with a liquid tank
JPH08174411A (ja) * 1994-12-22 1996-07-09 Ebara Corp ポリッシング装置
US6537133B1 (en) * 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5838447A (en) * 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
US5762536A (en) * 1996-04-26 1998-06-09 Lam Research Corporation Sensors for a linear polisher
US5958148A (en) * 1996-07-26 1999-09-28 Speedfam-Ipec Corporation Method for cleaning workpiece surfaces and monitoring probes during workpiece processing
JP3454658B2 (ja) * 1997-02-03 2003-10-06 大日本スクリーン製造株式会社 研磨処理モニター装置
JPH10229061A (ja) * 1997-02-13 1998-08-25 Nikon Corp 研磨量測定装置
US6361646B1 (en) * 1998-06-08 2002-03-26 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6106662A (en) * 1998-06-08 2000-08-22 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6334807B1 (en) * 1999-04-30 2002-01-01 International Business Machines Corporation Chemical mechanical polishing in-situ end point system
DE10084915C2 (de) * 1999-08-27 2003-12-24 Asahi Chemical Ind Polierkissen und Poliervorrichtung
US6628397B1 (en) * 1999-09-15 2003-09-30 Kla-Tencor Apparatus and methods for performing self-clearing optical measurements
US6671051B1 (en) * 1999-09-15 2003-12-30 Kla-Tencor Apparatus and methods for detecting killer particles during chemical mechanical polishing
JP2001088021A (ja) 1999-09-22 2001-04-03 Speedfam Co Ltd 研磨終点検出機構付き研磨装置
JP3854056B2 (ja) * 1999-12-13 2006-12-06 株式会社荏原製作所 基板膜厚測定方法、基板膜厚測定装置、基板処理方法及び基板処理装置
US6399501B2 (en) * 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
US6707540B1 (en) * 1999-12-23 2004-03-16 Kla-Tencor Corporation In-situ metalization monitoring using eddy current and optical measurements
US6433541B1 (en) * 1999-12-23 2002-08-13 Kla-Tencor Corporation In-situ metalization monitoring using eddy current measurements during the process for removing the film
WO2001046684A1 (en) * 1999-12-23 2001-06-28 Kla-Tencor Corporation In-situ metalization monitoring using eddy current measurements and optical measurements
US6491569B2 (en) * 2001-04-19 2002-12-10 Speedfam-Ipec Corporation Method and apparatus for using optical reflection data to obtain a continuous predictive signal during CMP
CN1414608A (zh) * 2001-10-26 2003-04-30 矽统科技股份有限公司 晶圆的化学机械研磨装置
US6599765B1 (en) * 2001-12-12 2003-07-29 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
JP3878016B2 (ja) * 2001-12-28 2007-02-07 株式会社荏原製作所 基板研磨装置
US7175503B2 (en) * 2002-02-04 2007-02-13 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
US6733368B1 (en) * 2003-02-10 2004-05-11 Seh America, Inc. Method for lapping a wafer
US7101257B2 (en) * 2003-05-21 2006-09-05 Ebara Corporation Substrate polishing apparatus

Also Published As

Publication number Publication date
EP1633528A2 (en) 2006-03-15
DE602004031295D1 (de) 2011-03-17
US7547242B2 (en) 2009-06-16
US20070042679A1 (en) 2007-02-22
JP2006526292A (ja) 2006-11-16
US7101257B2 (en) 2006-09-05
TW200505633A (en) 2005-02-16
WO2004103636A3 (en) 2005-02-17
KR101052844B1 (ko) 2011-07-29
EP1633528B1 (en) 2011-02-02
CN1791491A (zh) 2006-06-21
EP1633528A4 (en) 2007-08-08
WO2004103636A2 (en) 2004-12-02
CN1791491B (zh) 2010-04-28
US20040235393A1 (en) 2004-11-25
KR20060003907A (ko) 2006-01-11

Similar Documents

Publication Publication Date Title
TWI271265B (en) Substrate polishing apparatus
US6758723B2 (en) Substrate polishing apparatus
KR102513791B1 (ko) 기판 처리 장치 및 기판 처리 방법
TWI709456B (zh) 拋光設備及拋光方法
KR102677333B1 (ko) 연마 장치
JP3902724B2 (ja) 研磨装置
WO2001020304A2 (en) Self-clearing optical measurement apparatus and methods of use
JP2003501845A (ja) 化学機械平坦化の終点検知のための光学ビューポート
KR20060009327A (ko) 기판폴리싱장치
JP2628915B2 (ja) 研磨布のドレッシング装置
US5657123A (en) Film thickness measuring apparatus, film thickness measuring method and wafer polishing system measuring a film thickness in conjunction with a liquid tank
KR20160001065U (ko) 화학적 기계적 연마용 연마패드의 그루브 측정 장치 및 이를 포함하는 화학적 기계적 연마 장치
JP6844971B2 (ja) 研削装置
CN115052712B (zh) 加工装置
KR20160001066U (ko) 화학적 기계적 연마용 연마패드의 그루브 측정 장치 및 이를 포함하는 화학적 기계적 연마 장치
JP5218890B2 (ja) 研磨装置
JP2023148227A (ja) ワークピースの研磨方法および研磨装置
TW202108293A (zh) 用於平坦化端點判定之方法，系統及設備
JP5731134B2 (ja) 研削装置
JP2020175464A (ja) 研磨装置
JP2013107203A (ja) 研磨装置

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent