KR20060009327A - 기판폴리싱장치 - Google Patents

기판폴리싱장치 Download PDF

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Publication number
KR20060009327A
KR20060009327A KR1020057021477A KR20057021477A KR20060009327A KR 20060009327 A KR20060009327 A KR 20060009327A KR 1020057021477 A KR1020057021477 A KR 1020057021477A KR 20057021477 A KR20057021477 A KR 20057021477A KR 20060009327 A KR20060009327 A KR 20060009327A
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KR
South Korea
Prior art keywords
substrate
polishing
light
fluid
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020057021477A
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English (en)
Korean (ko)
Inventor
가즈토 히로카와
순스케 나카이
신로 오타
유타카 와다
요이치 고바야시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20060009327A publication Critical patent/KR20060009327A/ko
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020057021477A 2003-05-16 2004-05-13 기판폴리싱장치 Ceased KR20060009327A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2003138782 2003-05-16
JPJP-P-2003-00138479 2003-05-16
JP2003138479 2003-05-16
JP2003138496 2003-05-16
JPJP-P-2003-00138782 2003-05-16
JPJP-P-2003-00138496 2003-05-16

Publications (1)

Publication Number Publication Date
KR20060009327A true KR20060009327A (ko) 2006-01-31

Family

ID=33458361

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057021477A Ceased KR20060009327A (ko) 2003-05-16 2004-05-13 기판폴리싱장치

Country Status (7)

Country Link
US (3) US20040242121A1 (https=)
EP (1) EP1641597A4 (https=)
JP (1) JP2006525878A (https=)
KR (1) KR20060009327A (https=)
CN (1) CN1791490B (https=)
TW (1) TWI338605B (https=)
WO (1) WO2004101223A1 (https=)

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US7153191B2 (en) * 2004-08-20 2006-12-26 Micron Technology, Inc. Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
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US7226339B2 (en) * 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
JP4675803B2 (ja) * 2006-03-10 2011-04-27 東京エレクトロン株式会社 平坦化装置
US7494929B2 (en) * 2006-04-27 2009-02-24 Applied Materials, Inc. Automatic gain control
JP4745920B2 (ja) * 2006-08-28 2011-08-10 三菱重工業株式会社 放電電極、薄膜製造装置、及び太陽電池の製造方法
DE102006047207B3 (de) * 2006-10-05 2008-07-03 Fachhochschule Koblenz Optischer Drehverteiler für Lichtwellenleiter
US7998358B2 (en) 2006-10-31 2011-08-16 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
US8352061B2 (en) 2008-11-14 2013-01-08 Applied Materials, Inc. Semi-quantitative thickness determination
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US10188958B2 (en) 2009-05-28 2019-01-29 Anki, Inc. Automated detection of surface layout
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US10279311B2 (en) * 2012-08-21 2019-05-07 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for operating chemical mechanical polishing process
US9079287B2 (en) * 2013-03-12 2015-07-14 Macronix International Co., Ltd. CMP polishing pad detector and system
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US9966281B2 (en) * 2013-11-15 2018-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and systems for chemical mechanical polish cleaning
TWI652735B (zh) 2014-10-09 2019-03-01 美商應用材料股份有限公司 具有內部通道的化學機械研磨墊
JP6313196B2 (ja) * 2014-11-20 2018-04-18 株式会社荏原製作所 研磨面洗浄装置、研磨装置、および研磨面洗浄装置の製造方法
US9996369B2 (en) 2015-01-05 2018-06-12 Anki, Inc. Adaptive data analytics service
US9902415B2 (en) * 2016-02-15 2018-02-27 Lam Research Corporation Universal service cart for semiconductor system maintenance
JP7312103B2 (ja) * 2016-09-15 2023-07-20 アプライド マテリアルズ インコーポレイテッド 化学機械研磨スマートリング
KR102642988B1 (ko) * 2016-11-09 2024-03-06 삼성디스플레이 주식회사 기판 연마 장치 및 방법
JP6951229B2 (ja) 2017-01-05 2021-10-20 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
WO2018128093A1 (ja) 2017-01-05 2018-07-12 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
CN108630561B (zh) * 2017-03-15 2021-10-15 北京北方华创微电子装备有限公司 基片表面的检测装置和检测方法、传片腔室
RU173875U1 (ru) * 2017-03-17 2017-09-15 Акционерное общество "Московский вертолетный завод им. М.Л. Миля" Эталонное устройство для оценки светотехнических характеристик
JP6948868B2 (ja) * 2017-07-24 2021-10-13 株式会社荏原製作所 研磨装置および研磨方法
JP6948878B2 (ja) * 2017-08-22 2021-10-13 ラピスセミコンダクタ株式会社 半導体製造装置及び半導体基板の研磨方法
JP6974087B2 (ja) * 2017-09-14 2021-12-01 株式会社ディスコ 切削装置
CN107745330B (zh) * 2017-11-28 2024-07-05 合肥波林新材料股份有限公司 一种端面研磨装置
WO2019133724A1 (en) * 2017-12-28 2019-07-04 Sinmat, Inc. Cmp polishing pad conditioner
CN110153872B (zh) * 2018-02-14 2021-03-26 台湾积体电路制造股份有限公司 研磨系统、晶片夹持装置及晶片的研磨方法
JP7022647B2 (ja) * 2018-05-08 2022-02-18 株式会社荏原製作所 光透過性部材、研磨パッドおよび基板研磨装置
US11878388B2 (en) * 2018-06-15 2024-01-23 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same
JP2020001162A (ja) * 2018-06-28 2020-01-09 株式会社荏原製作所 研磨パッド積層体、研磨パッド位置決め治具、および研磨パッドを研磨テーブルに貼り付ける方法
JP7316785B2 (ja) * 2018-12-26 2023-07-28 株式会社荏原製作所 光学式膜厚測定システムの洗浄方法
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JP7638617B2 (ja) * 2019-06-26 2025-03-04 株式会社荏原製作所 光学式表面監視装置の洗浄方法
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Also Published As

Publication number Publication date
CN1791490B (zh) 2010-12-08
JP2006525878A (ja) 2006-11-16
WO2004101223A1 (en) 2004-11-25
US20070173177A1 (en) 2007-07-26
EP1641597A1 (en) 2006-04-05
US20060105679A1 (en) 2006-05-18
US7214122B2 (en) 2007-05-08
EP1641597A4 (en) 2007-10-31
CN1791490A (zh) 2006-06-21
TW200507984A (en) 2005-03-01
US20040242121A1 (en) 2004-12-02
TWI338605B (en) 2011-03-11
US7507144B2 (en) 2009-03-24

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